Axcelis Announces Participation in SEMICON China 2026

Axcelis (Nasdaq: ACLS) will be Diamond Sponsor of the Compound Semiconductor Asia Conference (CS Asia) held with SEMICON China 2026 on March 24–27, 2026, in Pudong, Shanghai.

Rhea-AI Summary

Axcelis (Nasdaq: ACLS) will be Diamond Sponsor of the Compound Semiconductor Asia Conference (CS Asia) held with SEMICON China 2026 on March 24–27, 2026, in Pudong, Shanghai.

President and CEO Russell Low will deliver the opening keynote on March 24, and Worldwide Applications Director Hongchen Zhao will present on March 25. Axcelis said it will showcase the next-generation Purion Power Series+ Platform to chipmakers in China.

Argus Mar 19 session

+1.61% close to close Open Argus

Details

News Market Reaction – ACLS

On Mar 19, the day this news came out, ACLS closed 1.61% above the previous close.

Data tracked by StockTitan Argus for the Mar 19 session.

Key Figures

Conference dates: March 24-27, 2026 Keynote time: March 24, 14:30-15:00 Session time: March 25, 14:00-14:25

Conference dates

March 24-27, 2026

CS Asia and SEMICON China 2026 schedule

Keynote time

March 24, 14:30-15:00

Russell Low keynote at Shanghai Ballroom 3

Session time

March 25, 14:00-14:25

Hongchen Zhao presentation in Pudong Ballroom 1

Historical Context

5 past events · Latest: Mar 13

5 events

1. Mar 13

   CFO appointment (peer)

   24h Move

   -2.3%

   Hexcel appointed a new permanent CFO, replacing an interim finance chief.

2. Mar 12

   CFO transition

   24h Move

   -2.3%

   Axcelis named an interim CFO and began search for a permanent successor.

3. Feb 23

   Investor conferences

   24h Move

   -1.7%

   Company scheduled participation in five investor conferences for meetings with management.

4. Feb 17

   2025 earnings

   24h Move

   -16.7%

   Reported 2025 revenue decline versus 2024 with accompanying drop in earnings metrics.

5. Feb 04

   SEMICON Korea expo

   24h Move

   -1.9%

   Announced SEMICON Korea 2026 exhibition and introduction of Purion H6 implanter.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

ion implantation, compound semiconductor, sic, wbg materials

4 terms

ion implantation technical

"a leading supplier of enabling ion implantation solutions for the semiconductor industry"

A manufacturing process that shoots tiny charged atoms into a solid material to change its electrical properties, most commonly used when making computer chips. Think of it like spraying microscopic seeds into a surface so parts of a circuit will conduct electricity differently; it directly affects product performance, production yield and cost. Investors watch it because advances or bottlenecks in this step can influence a maker’s competitiveness, output and profit margins.

compound semiconductor technical

"Compound Semiconductor Asia Conference (CS Asia) 2026, held in conjunction"

Materials made from two or more chemical elements designed to control how electricity and light behave, used to make electronic and optical components. Like mixing metals to get a stronger alloy, these semiconductors let charges move faster or emit light more efficiently than common silicon, enabling faster wireless signals, efficient power conversion, LEDs and lasers. Investors care because they underpin higher‑growth, higher‑margin markets and depend on specialized manufacturing and supply chains that can affect profitability and valuation.

sic technical

"Session 2: SiC, GaN and Related WBG Materials, Equipment and Devices-1"

Sic is a short notation placed immediately after a quoted word or passage to show the text is reproduced exactly as it appeared in the original source, even if it contains a typo, odd phrasing, or factual error. For investors, it signals that any mistake or unusual wording came from the original speaker or document, not from the publisher—like an editor saying “this is how it was said,” which helps with accuracy, responsibility, and legal clarity.

wbg materials technical

"SiC, GaN and Related WBG Materials, Equipment and Devices-1"

WBG materials are “wide bandgap” semiconductor substances, such as silicon carbide or gallium nitride, that can operate at higher voltages, temperatures and switching speeds than conventional silicon. Think of them as sturdier pipes or a stronger bridge that lets more electrical power flow with less loss. Investors watch WBG materials because they enable smaller, more efficient power electronics used in electric vehicles, renewable energy, fast chargers and data centers, which can drive product improvements and market growth.

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President and CEO Russell Low will Present Keynote Speech at CS Asia

BEVERLY, Mass., March 19, 2026 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will be the Diamond Sponsor for the Compound Semiconductor Asia Conference (CS Asia) 2026, held in conjunction with SEMICON China 2026 on March 24-27, 2026, at the Kerry Hotel in Pudong, Shanghai.

Axcelis' President and CEO, Russell Low, PhD, will present an opening Keynote Speech at the event. Hongchen Zhao, PhD, Axcelis' Worldwide Applications Director, will present in Session 2: SiC, GaN and Related WBG Materials, Equipment and Devices-1.

Advancing Power and Compound Semiconductor Performance Through Ion Implantation Innovation
Russell Low, PhD
President & CEO, Axcelis Technologies
March 24, 14:30-15:00
Shanghai Ballroom 3, Kerry Hotel

Innovative Implant Solutions Empower SiC Super Junction Cost Reduction
Hongchen Zhao, PhD
Worldwide Applications Director
Axcelis Technologies, Inc.
March 25, 14:00 – 14:25
Pudong Ballroom 1, Kerry Hotel

President and CEO Russell Low, said, "We're excited to participate in SEMICON China and especially pleased to sponsor the CS Asia Conference, one of the most important technology forums in the Asia Pacific region. Global demand for clean, efficient energy solutions is rising, and power and compound semiconductor solutions are becoming increasingly critical. We are proud to be an innovation and market leader in ion implantation solutions in this market. We look forward to introducing our next generation Purion Power Series+ Platform to chipmakers in China."

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CONTACTS:
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com

Axcelis Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/axcelis-announces-participation-in-semicon-china-2026-302718110.html

SOURCE Axcelis Technologies, Inc.

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

When and where will Axcelis (ACLS) present at SEMICON China 2026?

Axcelis will present at SEMICON China 2026 in Pudong, Shanghai on March 24–27, 2026. According to Axcelis, President and CEO Russell Low will give the opening keynote on March 24, 14:30–15:00 in Shanghai Ballroom 3, and Hongchen Zhao will speak March 25.

What will Russell Low discuss in his ACLS keynote at CS Asia on March 24, 2026?

Russell Low will deliver an opening keynote focused on ion implantation innovation for power and compound semiconductors. According to Axcelis, the talk highlights advances in implant solutions and introduces the Purion Power Series+ platform to chipmakers in China.

What topic will Hongchen Zhao of Axcelis cover at SEMICON China 2026 on March 25?

Hongchen Zhao will present on SiC, GaN and related wide‑bandgap materials and equipment on March 25. According to Axcelis, the session covers innovative implant solutions aimed at SiC super junction cost reduction and performance improvements.

What is Axcelis showcasing at SEMICON China 2026 and who is the target audience?

Axcelis will showcase its next‑generation Purion Power Series+ platform to semiconductor chipmakers and equipment partners. According to Axcelis, the focus is on ion implantation solutions for power and compound semiconductor manufacturers in the Asia Pacific market.

How does Axcelis describe its role at the CS Asia Conference during SEMICON China 2026?

Axcelis is the Diamond Sponsor of the CS Asia Conference and will participate with executive presentations. According to Axcelis, sponsorship and keynote participation underline its leadership in ion implantation technology and engagement with Asia Pacific chipmakers.