Axcelis Announces Participation in SEMICON India 2024
Rhea-AI Summary
Axcelis Technologies (Nasdaq: ACLS) announced its participation in the inaugural SEMICON India 2024, showcasing its Purion™ and GSD Ovation™ Series of ion implanters. The event will be held from September 11-13 at the India Expo Mart in Greater Noida, Delhi. Axcelis will exhibit in Booth #H1T11, featuring innovative ion implant solutions that offer significant technology and manufacturing advantages.
The showcase includes the Purion Power Series™ for thin silicon, TAIKO, and SiC wafer processing; the Purion H Series for high current implants; the Purion XE Series for high energy implants; and the GSD Ovation™ for cost-effective batch platform capability. CEO Russell Low highlighted the importance of the Indian semiconductor market, projected to reach over $55 billion by 2026, driven by smartphones, automotive components, and computing sectors.
Positive
- Participation in SEMICON India 2024 expands Axcelis' presence in a growing market
- Showcasing advanced ion implant solutions for various semiconductor applications
- Addressing the Indian semiconductor market projected to reach $55 billion by 2026
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, ACLS gained 0.42%, reflecting a mild positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Showcase Features the Purion and GSD Ovation Series of Ion Implanters Designed to Deliver Significant Technology and Manufacturing Advantages
Attendees are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages, including:
- Purion Power Series™ - Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space.
- Purion H™ Series - Including the new Purion H5™ and the Purion Dragon™, both designed to provide a comprehensive solution for high current implants.
- Purion H200™ - Axcelis' state of the art single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications.
- Purion XE™ Series - Including the new Purion XEmax™, is the industry leading high energy implant platform, featuring patented Boost Technology™, designed for the most advanced image sensor applications up to 15MeV.
- Purion M™ Series - Offering the broadest spectrum of mid-current doses available, enabling unparalleled flexibility to meet today's evolving implant requirements.
- GSD Ovation™ - Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in power markets, as well as wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic).
President and CEO of Axcelis Technologies Russell Low, said, "We're excited to be a part of this important market and the opportunity to provide the most advanced ion implant technology to semiconductor manufacturers in
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Press/Media Relations Contacts:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
View original content to download multimedia:https://www.prnewswire.com/news-releases/axcelis-announces-participation-in-semicon-india-2024-302233281.html
SOURCE Axcelis Technologies, Inc.