Axcelis Announces Sponsorship and Participation in the 25th International Conference on Ion Implantation and Annealing Technology 2026
Axcelis Technologies (ACLS) will be a Platinum Sponsor of the 25th International Conference on Ion Implantation and Annealing Technology (IIT 2026), held September 20-24, 2026 at the Congress Center Villach in Austria.
Rhea-AI Summary
Axcelis Technologies (ACLS) will be a Platinum Sponsor of the 25th International Conference on Ion Implantation and Annealing Technology (IIT 2026), held September 20-24, 2026 at the Congress Center Villach in Austria.
The company will host an exhibit at Booth #7 and its technologists and collaborators will present on topics including implant innovation, SiC MOSFET manufacturing, aluminum ion implantation performance, implant platform developments such as realtime beam shape monitoring and beam energy measurement, wafer backside particle reduction, and emerging research in advanced CMOS contact module engineering and resonator devices. Axcelis' president and CEO said the company is committed to enabling next-generation semiconductor device manufacturing with its ion implantation technologies. Additional event and registration details are available on the IIT 2026 conference website.
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Key Terms
ion implantation technical
annealing technical
MOSFETs technical
SiC technical
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At the event, Axcelis will host a company exhibit in Booth #7 and the company's technologists and collaborators will present on the following topics:
Implant Innovation
- Purion XEmax™ for SiC Superjunction MOSFETs
- Purion H6™ Next Generation High Current Implanter
- Improving SiC MOSFET Within-Wafer Implant Uniformity Through an Integrated CIP
- Remote Vaporizer for Al Implantation in SiC
Enabling SiC Manufacturing Excellence
- Impact of Stacking Density on SiC Implant Profiles
- High-Energy Al Channeling Implant Characterization
- Aluminum Ion Implantation Beam Current & Performance Improvement
Implant Platform Developments
- Realtime Beam Shape Monitor
- Beam Energy Measurement System
- Wafer Backside Particle Reduction
- Low-Cost High Current Metal Ion Source
Emerging Research
- Contact Module Engineering for Advanced CMOS Nodes
- Resonator Devices
- Neutron Spectroscopy of Light Ion Nuclear Reactions
President and CEO of Axcelis Technologies Russell Low said, "We're proud to be a Platinum Sponsor of IIT 2026. As a world leader in ion implantation innovation, Axcelis is committed to helping customers succeed with enabling technologies and support solutions that deliver the purity, precision and productivity needed for the next generation of semiconductor devices."
For more information on the event, or to register, visit the conference website at https://www.iitvillach2026.com/
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry nearly 50 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.
CONTACTS:
Investor Relations Contact:
David Ryzhik
Senior Vice President and Interim CFO
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
Press/Media Relations Contacts:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
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SOURCE Axcelis Technologies, Inc.