Axcelis Announces the Launch of the Company's New Purion Power Series+ Ion Implant Platform Designed for Next Generation SiC Power Devices
Axcelis Technologies (NASDAQ: ACLS) has launched its new Purion Power Series+™ ion implant platform, designed for next-generation power devices and superjunction architectures. The platform includes multiple product extensions: Purion H200+ SiC for high current medium energy, Purion M+ SiC for medium current, and Purion XE+ SiC and Purion EXE+ SiC for high energy applications.
The innovative platform offers flexibility to handle multiple wafer sizes (150mm and 200mm), various substrate types (SiC, Si, GaN, GaAs), and different implant temperatures while delivering industry-leading throughput and capital efficiency. This launch reinforces Axcelis' position as the innovation and market leader in ion implantation solutions for power devices.
Axcelis Technologies (NASDAQ: ACLS) ha lanciato la nuova piattaforma di impianto ionico Purion Power Series+™, progettata per dispositivi di potenza di nuova generazione e architetture superjunction. La piattaforma comprende diverse estensioni di prodotto: Purion H200+ SiC per correnti elevate e energie medie, Purion M+ SiC per correnti medie, e Purion XE+ SiC e Purion EXE+ SiC per applicazioni ad alta energia.
La piattaforma innovativa offre flessibilità nella gestione di più dimensioni di wafer (150 mm e 200 mm), vari tipi di substrati (SiC, Si, GaN, GaAs) e diverse temperature di impianto, garantendo al contempo un rendimento e un'efficienza di capitale leader nel settore. Questo lancio rafforza la posizione di Axcelis come leader nell'innovazione e nel mercato delle soluzioni di impiantazione ionica per dispositivi di potenza.
Axcelis Technologies (NASDAQ: ACLS) ha lanzado su nueva plataforma de implantación iónica Purion Power Series+™, diseñada para dispositivos de potencia de próxima generación y arquitecturas superjunction. La plataforma incluye varias extensiones de producto: Purion H200+ SiC para alta corriente y energía media, Purion M+ SiC para corriente media, y Purion XE+ SiC y Purion EXE+ SiC para aplicaciones de alta energía.
La plataforma innovadora ofrece flexibilidad para manejar múltiples tamaños de oblea (150 mm y 200 mm), distintos tipos de sustratos (SiC, Si, GaN, GaAs) y diferentes temperaturas de implantación, al tiempo que proporciona un rendimiento y una eficiencia de capital líderes en la industria. Este lanzamiento refuerza la posición de Axcelis como líder en innovación y en el mercado de soluciones de implantación iónica para dispositivos de potencia.
Axcelis Technologies (NASDAQ: ACLS)는 차세대 전력 디바이스 및 슈퍼정션 구조를 위해 설계된 새로운 이온 임플란트 플랫폼 Purion Power Series+™를 출시했습니다. 이 플랫폼은 고전류 중간 에너지용 Purion H200+ SiC, 중전류용 Purion M+ SiC, 고에너지 응용용 Purion XE+ SiC 및 Purion EXE+ SiC 등 여러 제품 확장을 포함합니다.
이 혁신적인 플랫폼은 여러 웨이퍼 크기(150mm 및 200mm), 다양한 기판 유형(SiC, Si, GaN, GaAs) 및 서로 다른 임플란트 온도를 처리할 수 있는 유연성을 제공하며 업계 선도적인 처리량과 자본 효율성을 제공합니다. 이번 출시는 전력 디바이스용 이온 임플란트 솔루션 분야에서 Axcelis의 혁신성과 시장 리더십을 더욱 공고히 합니다.
Axcelis Technologies (NASDAQ: ACLS) a lancé sa nouvelle plateforme d'implantation ionique Purion Power Series+™, conçue pour les dispositifs de puissance de nouvelle génération et les architectures superjunction. La plateforme comprend plusieurs extensions de produits : Purion H200+ SiC pour courant élevé et énergie moyenne, Purion M+ SiC pour courant moyen, et Purion XE+ SiC et Purion EXE+ SiC pour les applications à haute énergie.
La plateforme innovante offre la flexibilité de traiter plusieurs tailles de plaquettes (150 mm et 200 mm), différents types de substrats (SiC, Si, GaN, GaAs) et diverses températures d'implantation, tout en offrant un débit et une efficacité du capital leader sur le marché. Ce lancement renforce la position d'Axcelis en tant que leader en innovation et sur le marché des solutions d'implantation ionique pour dispositifs de puissance.
Axcelis Technologies (NASDAQ: ACLS) hat seine neue Ionenimplantationsplattform Purion Power Series+™ eingeführt, die für leistungsstarke Geräte der nächsten Generation und Superjunction-Architekturen entwickelt wurde. Die Plattform umfasst mehrere Produkterweiterungen: Purion H200+ SiC für hohen Strom und mittlere Energie, Purion M+ SiC für mittleren Strom sowie Purion XE+ SiC und Purion EXE+ SiC für Hochenergieanwendungen.
Die innovative Plattform bietet Flexibilität bei der Verarbeitung mehrerer Wafergrößen (150 mm und 200 mm), verschiedener Substrattypen (SiC, Si, GaN, GaAs) und unterschiedlicher Implantationstemperaturen und liefert gleichzeitig branchenführenden Durchsatz und Kapital-effizienz. Dieser Start stärkt Axcelis' Stellung als Innovations- und Marktführer für Ionenimplantationslösungen für Leistungsbauelemente.
- Platform offers flexibility with multiple wafer sizes and substrate types compatibility
- Industry-leading throughput and capital efficiency in ion implantation
- First-to-market position with full portfolio of implanters for power device industry
- Expanded product line with multiple new extensions and upgrades
- None.
Insights
Axcelis strengthens market position with new ion implant platform for next-gen power semiconductors, particularly addressing growing SiC market.
Axcelis Technologies has launched its new Purion Power Series+ ion implantation platform, strategically positioning the company to capitalize on the growing market for next-generation power devices, particularly silicon carbide (SiC) applications. This platform expansion includes four specialized products: the Purion H200+ SiC for high current/medium energy, Purion M+ SiC for medium current, and the Purion XE+ SiC and Purion EXE+ SiC for high energy applications.
The technical differentiation of this platform is substantial. It offers multi-substrate flexibility (SiC, Si, GaN, GaAs) and multi-wafer size capability (150mm and 200mm), along with variable implant temperature options. These features directly address manufacturers' needs to process different materials as power semiconductor production diversifies beyond traditional silicon.
This launch reinforces Axcelis' leadership in the power semiconductor equipment segment. The company has strategically developed these tools to support manufacturers transitioning to 200mm SiC wafer production - a critical industry shift that improves economics and output for power devices used in electric vehicles, renewable energy systems, and industrial applications.
The emphasis on superjunction architectures is particularly noteworthy. These advanced device structures enable higher breakdown voltages and lower on-resistance, critical for improving power device efficiency. By specifically mentioning support for these architectures, Axcelis is signaling readiness to serve the highest-value segments of the power device market.
The platform's focus on capital efficiency and higher throughput directly addresses manufacturers' concerns about the cost of transitioning to SiC and other wide-bandgap materials. By improving productivity while maintaining process flexibility, Axcelis is positioning itself as a key enabler for semiconductor manufacturers expanding their power device capabilities.
The new Purion Power Series+ covers the full ion implant market space with new product line extensions and upgrades that include the Purion H200+ SiC for high current medium energy applications, Purion M+ SiC for medium current applications and the Purion XE+ SiC and Purion EXE+ SiC for high energy applications.
Executive Vice President Dr. Greg Redinbo, commented, "We're excited to launch the Company's new Purion Power Series+ platform. Axcelis has a long history of collaborating closely with our customers to develop innovative solutions for their high value challenges. The Purion Power Series+ family is uniquely suited to address these challenges due to its innovative platform that offers the flexibility to handle multiple wafer sizes (150mm and 200mm), substrate types (including SiC, Si, GaN, and GaAs wafers) and implant temperatures (room temperature, warm and hot). This is accomplished while also delivering the industry's highest throughput and capital efficiency."
President and CEO Dr. Russell Low, said, "We are proud to be the innovation and market leader in ion implantation solutions for power devices. Axcelis was first to market with a full portfolio of implanters with innovative capabilities specifically to address high volume manufacturing needs for the power device industry. Evolving power device roadmaps are now driving the rapid transition to new technical and production requirements. Axcelis' Purion Power Series+ Platform is the next generation of ion implant solutions designed specifically to meet these challenges across the full spectrum of existing and emerging applications."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
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SOURCE Axcelis Technologies, Inc.
FAQ
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