Axcelis Announces the Launch of the Company's New Purion Power Series+ Ion Implant Platform Designed for Next Generation SiC Power Devices

Rhea-AI Summary

Axcelis Technologies (NASDAQ: ACLS) has launched its new Purion Power Series+™ ion implant platform, designed for next-generation power devices and superjunction architectures. The platform includes multiple product extensions: Purion H200+ SiC for high current medium energy, Purion M+ SiC for medium current, and Purion XE+ SiC and Purion EXE+ SiC for high energy applications.

The innovative platform offers flexibility to handle multiple wafer sizes (150mm and 200mm), various substrate types (SiC, Si, GaN, GaAs), and different implant temperatures while delivering industry-leading throughput and capital efficiency. This launch reinforces Axcelis' position as the innovation and market leader in ion implantation solutions for power devices.

Positive

• Platform offers flexibility with multiple wafer sizes and substrate types compatibility
• Industry-leading throughput and capital efficiency in ion implantation
• First-to-market position with full portfolio of implanters for power device industry
• Expanded product line with multiple new extensions and upgrades

Negative

• None.

BEVERLY, Mass., Sept. 8, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (NASDAQ: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's new Purion Power Series+™ ion implant product platform, designed specifically to enable improved device performance and increase productivity for next generation power devices, including emerging superjunction architectures.

The new Purion Power Series+ covers the full ion implant market space with new product line extensions and upgrades that include the Purion H200+ SiC for high current medium energy applications, Purion M+ SiC for medium current applications and the Purion XE+ SiC and Purion EXE+ SiC for high energy applications. 

Executive Vice President Dr. Greg Redinbo, commented, "We're excited to launch the Company's new Purion Power Series+ platform. Axcelis has a long history of collaborating closely with our customers to develop innovative solutions for their high value challenges. The Purion Power Series+ family is uniquely suited to address these challenges due to its innovative platform that offers the flexibility to handle multiple wafer sizes (150mm and 200mm), substrate types (including SiC, Si, GaN, and GaAs wafers) and implant temperatures (room temperature, warm and hot). This is accomplished while also delivering the industry's highest throughput and capital efficiency."

President and CEO Dr. Russell Low, said, "We are proud to be the innovation and market leader in ion implantation solutions for power devices. Axcelis was first to market with a full portfolio of implanters with innovative capabilities specifically to address high volume manufacturing needs for the power device industry. Evolving power device roadmaps are now driving the rapid transition to new technical and production requirements. Axcelis' Purion Power Series+ Platform is the next generation of ion implant solutions designed specifically to meet these challenges across the full spectrum of existing and emerging applications."

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CONTACTS:
Press/Media Relations Contact: 
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com 

Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com 

 

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SOURCE Axcelis Technologies, Inc.

FAQ

What new products did Axcelis (NASDAQ: ACLS) announce in September 2025?

Axcelis announced the Purion Power Series+™ ion implant platform, including four new products: Purion H200+ SiC, Purion M+ SiC, Purion XE+ SiC, and Purion EXE+ SiC, designed for next-generation power devices.

What are the key features of Axcelis' new Purion Power Series+ platform?

The platform features flexibility to handle multiple wafer sizes (150mm and 200mm), various substrate types (SiC, Si, GaN, GaAs), different implant temperatures, while delivering industry-leading throughput and capital efficiency.

What types of substrates can the new Axcelis Purion Power Series+ handle?

The platform can handle multiple substrate types including SiC, Si, GaN, and GaAs wafers at various implant temperatures (room temperature, warm and hot).

How does the Purion Power Series+ impact Axcelis' market position?

The launch reinforces Axcelis' position as the innovation and market leader in ion implantation solutions for power devices, being first to market with a full portfolio of implanters for the power device industry.