Welcome to our dedicated page for Acm Research news (Ticker: ACMR), a resource for investors and traders seeking the latest updates and insights on Acm Research stock.
ACM Research, Inc. (ACMR) provides critical semiconductor manufacturing solutions through advanced wafer cleaning and packaging technologies. This page aggregates official announcements and verified news about the company's innovations, partnerships, and market developments.
Investors and industry professionals will find comprehensive coverage of ACMR's progress in developing equipment that addresses key challenges in chip fabrication. Track updates spanning product launches, financial results, and technological breakthroughs that influence semiconductor production efficiency.
Our curated collection includes press releases on single-wafer cleaning systems, advanced packaging solutions, and strategic collaborations within the global semiconductor supply chain. All content is verified for accuracy and relevance to support informed decision-making.
Bookmark this page for streamlined access to ACM Research's latest developments in semiconductor process technology. Check regularly for updates that may impact manufacturing capabilities across logic, memory, and foundry applications.
ACM Research reported strong Q3 2021 results with revenue of $67 million, a 40.6% increase from Q3 2020. Gross margin improved to 44.3%, while net income rose to $10.2 million. The company expects 2021 revenue between $230 million and $240 million, adjusting from a prior range due to stable market conditions. Key orders from major semiconductor manufacturers and an upcoming IPO on the STAR Market in Shanghai are highlighted as significant developments.
ACM Research (ACMR) has announced the IPO pricing of its subsidiary, ACM Research (Shanghai), Inc. on the STAR Market. The offering will include 43,355,753 shares, representing 10% of total shares post-IPO, with a proposed price of RMB 85.00 per share. This could yield approximately RMB 3.685 billion (around US$575 million). ACM will retain 82.5% of ACM Shanghai's shares post-offering. The IPO is scheduled for subscription on November 8, 2021, with listing anticipated on November 18, 2021.
ACM Research (ACMR) has secured two orders for its Ultra C pr wet stripping system from a major global integrated device manufacturer. The tools will be utilized in a China-based advanced packaging facility for efficient photoresist removal. The first unit was delivered in October 2021, while the second is expected in Q1 2022. This marks ACM's initial WLP wet tool orders from a significant global player, reinforcing its technology's acceptance in the market. The Ultra C system boasts high efficiency and precise control, enhancing productivity in semiconductor manufacturing.
ACM Research, Inc. (NASDAQ: ACMR) has announced updates on its subsidiary ACM Research (Shanghai), Inc.'s IPO on the STAR Market. The offering will consist of 43,355,753 shares, representing 10% of the company, with pricing inquiries set for November 3, 2021. Financial results indicate significant growth, with revenue of RMB 625.3 million and net profit of RMB 89.7 million for H1 2021, up from RMB 355.6 million and RMB 37.6 million respectively in H1 2020. The listing is expected to commence trading on November 18, 2021.
ACM Research, Inc. (NASDAQ: ACMR) will release its financial results for Q3 2021 on November 4, 2021, post-market close. A conference call is scheduled for November 5, 2021, at 8:00 a.m. ET to discuss these results. Participants are advised to dial in 10 minutes early, using passcode 8233909. The earnings call will be accessible via a live webcast on the company's investor relations website. ACM Research specializes in manufacturing semiconductor process equipment essential for advanced device manufacturing.
ACM Research, Inc. (ACMR) announced an order for its Ultra C SAPS frontside cleaning tool from a major global semiconductor manufacturer. This unit will be installed in the client's China-based development fab in Q1 2022. CEO Dr. David Wang highlighted the significance of this evaluation order, noting its potential to enhance the customer’s R&D capabilities and production processes. The SAPS technology provides uniform megasonic energy application for thorough cleaning without damaging devices.
ACM Research (ACMR) announced an order for its Ultra ECP map copper plating tool from a significant IC manufacturer. The delivery is expected in early 2022, contingent upon technical qualification and commercial terms. Dr. David Wang, the company's CEO, highlighted the order as a validation of ACM's technological leadership and regional support. The Ultra ECP map tool is designed to enhance productivity with advanced features like high throughput, lower consumable costs, and compatibility with ultra-thin seed layers, opening potential for larger business opportunities in the semiconductor sector.
ACM Research, Inc. (NASDAQ: ACMR) recently announced the shipment of its first 300mm Single-Wafer Sulfuric Peroxide Mixture systems, enhancing its wet cleaning and etch capabilities for advanced semiconductor manufacturing. This tool supports high-temperature processes vital for production nodes at 10nm and beyond. The new Single-Wafer SPM tool offers improved performance with shorter process times and defect removal efficiency. ACM aims to become a key global cleaning solution provider, leveraging its advanced technologies such as SAPS and TEBO megasonic cleaning.
ACM Research, Inc. (NASDAQ: ACMR) reported updates regarding its subsidiary, ACM Research (Shanghai), and its proposed IPO on the Shanghai Stock Exchange. ACM Shanghai intends to start investor meetings on September 8, 2021, aiming for IPO completion in Q4 2021, subject to various external factors. Financial results show significant growth, with revenue of RMB 625.3 million for H1 2021, up from RMB 355.6 million in H1 2020, and an estimated revenue range of RMB 1,039.1 million to RMB 1,131.1 million for the first nine months of 2021, compared to RMB 608.0 million in the same period last year.
ACM Research (ACMR) announced the launch of the Ultra ECP GIII plating tool to enhance wafer-level packaging for compound semiconductors, including SiC, GaN, and GaAs. This fully automated tool supports both flat and notched 6-inch wafers and integrates advanced technologies for superior performance, achieving plating uniformity within 3%. ACM has secured two orders from Chinese semiconductor manufacturers, the first delivered in July and another expected by September 30, 2021. The growing demand for advanced semiconductor processing, driven by sectors like electric vehicles and 5G, underpins this innovation.
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