Welcome to our dedicated page for Acm Research news (Ticker: ACMR), a resource for investors and traders seeking the latest updates and insights on Acm Research stock.
ACM Research, Inc. develops, manufactures and sells wafer and panel processing equipment for semiconductor manufacturing and advanced packaging applications. Company news commonly covers financial results, shipment trends, customer orders, and product introductions across cleaning, electroplating, stress-free polishing, vertical furnace, track, PECVD, and wafer- and panel-level packaging tools.
Recurring updates also include ACM’s ACM Planetary Family product organization, advanced packaging platforms, global customer activity, production-capacity initiatives, and disclosures involving ACM Research (Shanghai), Inc., the company’s principal operating subsidiary listed on the Shanghai Stock Exchange STAR Market.
ACM Research, Inc. (NASDAQ: ACMR) has announced updates on its subsidiary ACM Research (Shanghai), Inc.'s IPO on the STAR Market. The offering will consist of 43,355,753 shares, representing 10% of the company, with pricing inquiries set for November 3, 2021. Financial results indicate significant growth, with revenue of RMB 625.3 million and net profit of RMB 89.7 million for H1 2021, up from RMB 355.6 million and RMB 37.6 million respectively in H1 2020. The listing is expected to commence trading on November 18, 2021.
ACM Research, Inc. (NASDAQ: ACMR) will release its financial results for Q3 2021 on November 4, 2021, post-market close. A conference call is scheduled for November 5, 2021, at 8:00 a.m. ET to discuss these results. Participants are advised to dial in 10 minutes early, using passcode 8233909. The earnings call will be accessible via a live webcast on the company's investor relations website. ACM Research specializes in manufacturing semiconductor process equipment essential for advanced device manufacturing.
ACM Research, Inc. (ACMR) announced an order for its Ultra C SAPS frontside cleaning tool from a major global semiconductor manufacturer. This unit will be installed in the client's China-based development fab in Q1 2022. CEO Dr. David Wang highlighted the significance of this evaluation order, noting its potential to enhance the customer’s R&D capabilities and production processes. The SAPS technology provides uniform megasonic energy application for thorough cleaning without damaging devices.
ACM Research (ACMR) announced an order for its Ultra ECP map copper plating tool from a significant IC manufacturer. The delivery is expected in early 2022, contingent upon technical qualification and commercial terms. Dr. David Wang, the company's CEO, highlighted the order as a validation of ACM's technological leadership and regional support. The Ultra ECP map tool is designed to enhance productivity with advanced features like high throughput, lower consumable costs, and compatibility with ultra-thin seed layers, opening potential for larger business opportunities in the semiconductor sector.
ACM Research, Inc. (NASDAQ: ACMR) recently announced the shipment of its first 300mm Single-Wafer Sulfuric Peroxide Mixture systems, enhancing its wet cleaning and etch capabilities for advanced semiconductor manufacturing. This tool supports high-temperature processes vital for production nodes at 10nm and beyond. The new Single-Wafer SPM tool offers improved performance with shorter process times and defect removal efficiency. ACM aims to become a key global cleaning solution provider, leveraging its advanced technologies such as SAPS and TEBO megasonic cleaning.
ACM Research, Inc. (NASDAQ: ACMR) reported updates regarding its subsidiary, ACM Research (Shanghai), and its proposed IPO on the Shanghai Stock Exchange. ACM Shanghai intends to start investor meetings on September 8, 2021, aiming for IPO completion in Q4 2021, subject to various external factors. Financial results show significant growth, with revenue of RMB 625.3 million for H1 2021, up from RMB 355.6 million in H1 2020, and an estimated revenue range of RMB 1,039.1 million to RMB 1,131.1 million for the first nine months of 2021, compared to RMB 608.0 million in the same period last year.
ACM Research (ACMR) announced the launch of the Ultra ECP GIII plating tool to enhance wafer-level packaging for compound semiconductors, including SiC, GaN, and GaAs. This fully automated tool supports both flat and notched 6-inch wafers and integrates advanced technologies for superior performance, achieving plating uniformity within 3%. ACM has secured two orders from Chinese semiconductor manufacturers, the first delivered in July and another expected by September 30, 2021. The growing demand for advanced semiconductor processing, driven by sectors like electric vehicles and 5G, underpins this innovation.
ACM Research, Inc. (NASDAQ: ACMR), a leader in wafer cleaning technologies for advanced semiconductors, announced its participation in several virtual investor conferences. Key events include the Needham SemiCap and EDA Conference on August 24, the Jefferies Semiconductor Summit on August 31, the Jefferies Asia Forum on September 9, and the Credit Suisse Asian Technology Conference on September 10. Management will be available for meetings with institutional investors at these events, providing opportunities to discuss their advanced semiconductor process equipment.
ACM Research, Inc. (NASDAQ: ACMR) announced that its subsidiary, ACM Research (Shanghai), has received approval for its STAR Market IPO registration from the China Securities Regulatory Commission (CSRC). The company anticipates completing the issuance process within several months, though timelines are uncertain due to external factors. CEO Dr. David Wang expressed optimism about the potential for the STAR Market listing to enhance ACM's global presence in the semiconductor equipment industry.
ACM Research (NASDAQ: ACMR) has launched its Bevel Etch product to enhance wafer yield in semiconductor manufacturing. The tool utilizes a wet etch method to effectively remove contaminants while reducing chemical consumption. With expected delivery in Q3 2021 to a Chinese logic manufacturer, it promises improved accuracy in wafer center alignment and operational efficiency for 3D NAND, DRAM, and advanced logic processes. This innovation addresses common manufacturing issues such as edge contamination, leading to better overall yield and cost-effectiveness, positioning ACM favorably in the semiconductor industry.