Welcome to our dedicated page for Acm Research news (Ticker: ACMR), a resource for investors and traders seeking the latest updates and insights on Acm Research stock.
ACM Research, Inc. develops, manufactures and sells wafer and panel processing equipment for semiconductor manufacturing and advanced packaging applications. Company news commonly covers financial results, shipment trends, customer orders, and product introductions across cleaning, electroplating, stress-free polishing, vertical furnace, track, PECVD, and wafer- and panel-level packaging tools.
Recurring updates also include ACM’s ACM Planetary Family product organization, advanced packaging platforms, global customer activity, production-capacity initiatives, and disclosures involving ACM Research (Shanghai), Inc., the company’s principal operating subsidiary listed on the Shanghai Stock Exchange STAR Market.
ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).
Key features include:
- Compatibility with organic and glass substrates
- Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
- Proprietary technology for consistent plating across panels
- Advanced automation for efficiency and quality control
ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.
ACM Research, Inc. (NASDAQ: ACMR) has appointed Howard Chen as General Counsel and Vice President of Corporate Strategy, effective July 1, 2024. Chen, a leading high-tech legal practitioner with over 25 years of experience, brings valuable legal knowledge and industry insight to ACM. Previously, he served as Co-Chair of the China Practice at Greenberg Traurig and has represented numerous global technology companies with significant operations in Asia.
ACM's CEO, Dr. David Wang, expressed confidence that Chen's leadership will enhance the company's legal strategies and IP portfolio, supporting its mission to become a key supplier in the global semiconductor industry. Chen's career began with an engineering role at AMD, and he has since made significant contributions to technology firms globally. His accolades include being named one of the 'Best Lawyers in America' and 'IP Stars'.
ACM Research (NASDAQ: ACMR) has introduced the Ultra C vac-p flux cleaning tool for fan-out panel-level packaging (FOPLP), marking its entry into this growing market. The tool uses vacuum technology and IPA drying to efficiently remove flux residues from chiplet structures, addressing critical cleaning challenges in advanced packaging processes.
ACM has already received and shipped a purchase order from a major Chinese semiconductor manufacturer. The FOPLP market is expected to grow from 2% in 2022 to 8% in 2028, driven by potential cost savings and increased efficiency. The Ultra C vac-p tool's innovative approach ensures thorough cleaning of small bump pitches and large chip sizes, overcoming limitations of traditional methods.
ACM Research (NASDAQ:ACMR) has announced the release date for its second quarter 2024 financial results. The company will unveil its earnings before the U.S. market opens on Wednesday, August 7, 2024. Following the release, ACM will host a conference call at 8:00 a.m. U.S. Eastern Time (8:00 p.m. China Time) to discuss the results.
Participants can join the call via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, interested parties can join the webcast directly through ACM's investor relations website. Both live and archived versions of the webcast will be available on the company's website at www.acmrcsh.com.
ACM Research (NASDAQ: ACMR), a leader in wafer processing solutions for semiconductor and advanced wafer-level packaging, announced its upcoming participation in two investor conferences.
On May 29, 2024, ACM Research will attend the Craig-Hallum 21st Annual Institutional Investor Conference in Minneapolis.
On June 26, 2024, the company will participate in the ROTH 10th Annual London Conference at the Four Seasons Park Lane in London.
Management will be available for meetings with institutional investors at both events. Interested parties can request meetings through their institutional sales representatives at the sponsoring banks.
ACM Research reported robust financial results for the first quarter of 2024, showcasing impressive revenue growth of 105% driven by mature node spending, new products, and market share gains. The company's President and CEO, Dr. David Wang, expressed satisfaction with the record shipments and strong profitability. ACM anticipates further growth in 2024 due to its expanding product portfolio and global footprint. The company maintained its revenue guidance range of $650 million to $725 million for fiscal year 2024. ACM also highlighted key operating highlights, including increased shipments, introduction of new products like Frame Wafer Cleaning Tool, and strong financial performance.
ACM Research, a supplier of wafer processing solutions, appointed David Kim as CEO of ACM Research Korea. Kim brings over thirty years of semiconductor experience to the role, with a background at Hyundai Electronics and SK Hynix. His expertise will enhance technology adoption and business growth in Korea, benefiting relationships with local semiconductor manufacturers and supporting global customers.
ACM Research, Inc. (ACM) introduces the Frame Wafer Cleaning Tool for advanced packaging, offering residue-free cleaning and environmental benefits. The tool includes an innovative solvent reclamation system, enabling nearly 100% recovery and filtration of solvents. ACM successfully installed the first tool with a major Chinese manufacturer, showcasing its commitment to sustainability and customer support in the semiconductor industry.
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