Adeia to Present at Upcoming Conferences on Hybrid Bonding Technology

Rhea-AI Summary

Adeia Inc. (Nasdaq: ADEA), a leader in semiconductor technology invention, has announced that its technologists will present at several upcoming industry conferences. The presentations will focus on Adeia's hybrid bonding technology, which is important for next-generation high-performance computing and AI applications.

The company will be presenting at three major conferences:

• The IMAPS Conference in Boston (October 1-3, 2024)
• The International Conference on Planarization/CMP Technology (ICPT) in Wiesbaden, Germany (October 16-18, 2024)
• The IEEE CPMT Symposium Japan (ICSJ) in Kyoto, Japan (November 13-15, 2024)

These presentations will cover various aspects of hybrid bonding technology, including process overviews, market demands, future projections, and key enabling processes like chemical mechanical polishing and metrology techniques.

SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will present at various upcoming industry conferences. The presentations will focus on Adeia’s hybrid bonding technology, a key enabler for next-generation high-performance computing and AI applications.

Adeia continues to see growing interest in its hybrid bonding technology across the semiconductor industry and will be presenting at the following upcoming conferences:

• At the IMAPS Conference in Boston, October 1-3, 2024. Dr. Guilian Gao, a distinguished engineer and leading expert in Adeia’s semiconductor division, will present on "Hybrid Bonding Process Technology" in an invited session. This presentation will cover market demands, process overviews, and future projections for hybrid bonding technology.
• At the International Conference on Planarization/CMP Technology (ICPT) in Wiesbaden, Germany, October 16-18, 2024, Dr. Laura Mirkarimi, head and senior vice president of semiconductor engineering at Adeia, will deliver an invited talk on "CMP, A Key Enabling Process for Hybrid Bonding," highlighting the critical role of chemical mechanical polishing in hybrid bonding technology advancement.
• At the IEEE CPMT Symposium Japan (ICSJ), in Kyoto, Japan, November 13-15, 2024, Dr. Bongsub Lee, a director within Adeia’s semiconductor engineering team, will present an invited talk titled "Hybrid Bonding in Advanced Heterogeneous Integration: Key Metrology Enablers," focusing on innovative metrology techniques crucial for hybrid bonding processes.
  

About Adeia

Adeia is a leading R&D company that accelerates the adoption of innovative technologies in the media, entertainment, e-commerce, and semiconductor industries. Adeia's fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia's IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. Our inventions enable communications that connect our human experiences. For more, please visit www.adeia.com.

For Information Contact:

Investor Relations
Chris Chaney
ir@adeia.com

Semiconductor Business Development
Yan Chai
marketing@adeia.com

Media Relations
JoAnn Yamani
press@adeia.com

FAQ

What technology will Adeia (ADEA) present at upcoming conferences?

Adeia (ADEA) will present its hybrid bonding technology at upcoming conferences. This technology is important for next-generation high-performance computing and AI applications.

Which conferences will Adeia (ADEA) attend to discuss hybrid bonding technology?

Adeia (ADEA) will present at the IMAPS Conference in Boston (October 1-3, 2024), the International Conference on Planarization/CMP Technology in Germany (October 16-18, 2024), and the IEEE CPMT Symposium Japan in Kyoto (November 13-15, 2024).

Who are the key Adeia (ADEA) technologists presenting at the conferences?

Dr. Guilian Gao will present at IMAPS, Dr. Laura Mirkarimi at ICPT, and Dr. Bongsub Lee at ICSJ. They are all experts in Adeia's semiconductor division focusing on hybrid bonding technology.

What specific topics will Adeia (ADEA) cover in its presentations on hybrid bonding?

Adeia (ADEA) will cover topics such as hybrid bonding process technology, the role of chemical mechanical polishing in hybrid bonding, and key metrology enablers for hybrid bonding in advanced heterogeneous integration.