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Aehr Test Systems to Participate in the 21st Annual Craig-Hallum Institutional Investor Conference on May 29

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Aehr Test Systems (NASDAQ: AEHR) will participate in the 21st Annual Craig-Hallum Institutional Investor Conference on May 29, 2024, in Minneapolis. President and CEO Gayn Erickson will hold one-on-one meetings with investors to discuss the company's wafer level test and burn-in solutions for semiconductor production. Aehr Test offers solutions for improving the quality, reliability, and yield of semiconductors used in electric vehicles, power conversion applications, and data centers. The company sees significant growth potential in the adoption of these solutions for new applications like optical I/O and co-packaged optics devices.

Positive
  • Participation in a high-profile investor conference increases visibility.
  • Potential for new investor engagements and partnerships.
  • Focus on high-demand sectors like electric vehicles and 5G infrastructure.
  • Growth potential in new semiconductor applications such as optical I/O.
Negative
  • No concrete financial data or forecasts provided.
  • Dependence on market adoption of new technologies.

FREMONT, CA / ACCESSWIRE / May 21, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that President and CEO Gayn Erickson will be participating in one-on-one meetings with investors at the 21st Annual Craig-Hallum Institutional Investor Conference taking place Wednesday, May 29, 2024 at the Depot Renaissance Hotel in Minneapolis.

"I look forward to discussing our unique wafer level test and burn-in solutions for semiconductor production and the markets they serve with investors and shareholders at the Craig-Hallum conference," said Mr. Erickson. "Aehr Test provides complete production solutions for improving quality, reliability, and yield of semiconductors such as silicon carbide devices used in electric vehicles and charging infrastructure, gallium nitride devices for multiple power conversion applications, and silicon photonics devices used in data centers and 5G infrastructure, as well as for new applications such as optical input/output (I/O) and co-packaged optics devices that are on the horizon. The adoption of wafer level test and burn-in of devices is a significant growth driver for Aehr Test."

For additional information, or to schedule a meeting with Aehr management, please contact your Craig-Hallum representative, or Aehr's investor relations firm, MKR Investor Relations, at aehr@mkr-group.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. For more information, please visit Aehr Test Systems' website at www.aehr.com.

Contacts:

Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com

MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com

SOURCE: Aehr Test Systems



View the original press release on accesswire.com

FAQ

What event is Aehr Test Systems participating in on May 29, 2024?

Aehr Test Systems will participate in the 21st Annual Craig-Hallum Institutional Investor Conference on May 29, 2024.

Who will represent Aehr Test Systems at the Craig-Hallum conference?

President and CEO Gayn Erickson will represent Aehr Test Systems.

What are the focus areas of Aehr Test Systems' semiconductor solutions?

Aehr Test Systems focuses on wafer level test and burn-in solutions for silicon carbide devices, gallium nitride devices, and silicon photonics devices.

Which sectors does Aehr Test Systems target with its products?

Aehr Test Systems targets sectors like electric vehicles, power conversion applications, data centers, and 5G infrastructure.

What is the stock symbol for Aehr Test Systems?

The stock symbol for Aehr Test Systems is AEHR.

Aehr Test Systems

NASDAQ:AEHR

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332.81M
27.33M
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19.45%
Semiconductor and Related Device Manufacturing
Manufacturing
Link
United States of America
FREMONT

About AEHR

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.