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Aehr Test Systems to Participate in the Craig-Hallum Alpha Select Conference in New York on November 16, 2023

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Aehr Test Systems (NASDAQ:AEHR) announced its participation in the Craig-Hallum 14th Annual Alpha Select Conference on November 16, 2023, where President and CEO Gayn Erickson and CFO Chris Siu will be discussing the company's semiconductor production test and burn-in solutions. Aehr Test provides production solutions for improving quality, reliability, and yield of semiconductors such as silicon carbide devices used in electric vehicles and charging infrastructure, silicon photonics devices used in data centers and 5G infrastructure, and new applications such as optical input/output (I/O) and co-packaged optics devices. The adoption of wafer level test and burn-in of devices is a significant growth driver for Aehr Test.
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FREMONT, CA / ACCESSWIRE / November 8, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will participate in the Craig-Hallum 14th Annual Alpha Select Conference taking place on November 16, 2023 at the Sheraton New York Times Square Hotel. President and CEO Gayn Erickson and CFO Chris Siu will be hosting meetings with institutional investors throughout the day.

"We look forward to discussing our unique semiconductor production test and burn-in solutions and the markets they serve with investors and shareholders at the Craig-Hallum conference," said Gayn Erickson, President and CEO of Aehr Test Systems. "Aehr Test provides complete production solutions for improving quality, reliability, and yield of semiconductors such as silicon carbide devices used in electric vehicles and charging infrastructure, silicon photonics devices used in data centers and 5G infrastructure, and also for new applications such as optical input/output (I/O) and co-packaged optics devices that are on the horizon. The adoption of wafer level test and burn-in of devices where quality, reliability, safety, and security are critical to the customers is a significant growth driver for Aehr Test."

For additional information, or to schedule a meeting with Aehr management, please contact your Craig-Hallum representative, or Aehr's investor relations firm, MKR Investor Relations, at aehr@mkr-group.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. For more information, please visit Aehr Test Systems' website at www.aehr.com.

Contacts:

Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com

MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com

SOURCE: Aehr Test Systems



View source version on accesswire.com:
https://www.accesswire.com/801367/aehr-test-systems-to-participate-in-the-craig-hallum-alpha-select-conference-in-new-york-on-november-16-2023

Aehr Test Systems announced its participation in the Craig-Hallum 14th Annual Alpha Select Conference on November 16, 2023.

President and CEO Gayn Erickson and CFO Chris Siu will be discussing the company's semiconductor production test and burn-in solutions at the conference.

Aehr Test's solutions serve markets such as electric vehicles, charging infrastructure, data centers, 5G infrastructure, and new applications such as optical input/output (I/O) and co-packaged optics devices.

The adoption of wafer level test and burn-in of devices is a significant growth driver for Aehr Test.
Aehr Test Systems

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Semiconductor and Related Device Manufacturing
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About AEHR

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.