Aehr Test Systems to Participate in the Susquehanna 15th Annual Technology Conference on February 26, 2026

Aehr Test Systems (NASDAQ:AEHR) will participate in the Susquehanna 15th Annual Technology Conference on February 26, 2026 at the Lotte New York Palace Hotel.

Rhea-AI Summary

Aehr Test Systems (NASDAQ:AEHR) will participate in the Susquehanna 15th Annual Technology Conference on February 26, 2026 at the Lotte New York Palace Hotel.

President and CEO Gayn Erickson and CFO Chris Siu will host institutional investor meetings to discuss Aehr's test and burn-in solutions for AI, data center, automotive and industrial semiconductors. For meetings, contact PondelWilkinson at jbyers@pondel.com or your Susquehanna representative.

Argus Feb 19 session

+4.34% close to close 0.5x rel. volume Open Argus

Details

News Market Reaction – AEHR

On Feb 19, the day this news came out, AEHR closed 4.34% above the previous close.

Data tracked by StockTitan Argus for the Feb 19 session.

Key Figures

Conference edition: 15th Annual Conference date: February 26, 2026

Conference edition

15th Annual

Susquehanna Technology Conference

Conference date

February 26, 2026

Susquehanna 15th Annual Technology Conference

Historical Context

5 past events · Latest: Feb 11

5 events

1. Feb 11

   AI production win

   24h Move

   +26.2%

   Initial production order for Sonoma systems for next-gen AI ASIC processors.

2. Jan 27

   Investor conference

   24h Move

   +3.6%

   Participation in Oppenheimer Emerging Growth Conference with investor meetings.

3. Jan 08

   AI system orders

   24h Move

   -6.1%

   More than $5.5M Sonoma orders and new fully automated Sonoma introduction.

4. Jan 08

   Earnings and guidance

   24h Move

   -6.1%

   Q2 2026 loss but guidance reinstated driven by AI and data center demand.

5. Jan 06

   Growth conference

   24h Move

   +5.3%

   Needham conference presentation highlighting test and burn-in across key markets.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

burn-in, wafer-level, packaged-part, silicon carbide, +4 more

8 terms

burn-in technical

"provider of test and burn-in solutions for semiconductor devices used in artificial intelligence"

Burn-in is a manufacturing test where new devices or components are operated under stress for a set period to surface early failures before products ship. Investors care because effective burn-in reduces returns, warranty costs and reputation risk, and signals production quality; like driving a new car on a rough road to reveal hidden defects before selling it to customers.

wafer-level technical

"strong traction with AI processors in both wafer-level and packaged-part formats"

Wafer-level describes manufacturing steps performed on a whole round silicon slice (the wafer) before it is cut into individual chips, similar to frosting and testing a cookie sheet before breaking it into single cookies. Doing work at the wafer level can lower per-chip cost, shrink final package size, speed production and improve quality, so it matters to investors because it can boost margins, supply efficiency and the competitiveness of semiconductor products.

packaged-part technical

"strong traction with AI processors in both wafer-level and packaged-part formats"

A packaged part is a complete, individual component or unit that has been enclosed, labeled and prepared for storage or shipment so it can be assembled into a larger product or sold as a replaceable item. Think of it as a single ingredient sealed and measured for a recipe; for investors, the availability, quality and compliance of packaged parts affect production schedules, costs, product reliability and regulatory approval, all of which influence a company’s revenue and risk.

silicon carbide technical

"including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles"

Silicon carbide is a hard, durable material made from silicon and carbon, often used in industrial applications like cutting tools and electronics. Its ability to withstand high temperatures and conduct electricity efficiently makes it valuable in manufacturing advanced electronic devices. For investors, companies working with silicon carbide are seen as key players in the growing market for high-performance electronics and energy-efficient technologies.

gallium nitride technical

"electric vehicles and charging infrastructure, gallium nitride for advanced power conversion"

Gallium nitride is a durable semiconductor material used to make electronic components that switch faster, handle higher voltages, and waste less energy than older silicon parts. Think of it as a lighter, more efficient motor in an appliance: it lets devices shrink, run cooler and save power, which can lower manufacturing costs, enable new products and boost sales or margins for companies that adopt it—key factors investors watch.

silicon photonics technical

"gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

5G infrastructure technical

"silicon photonics for data centers, 5G infrastructure and optical input/output (I/O)"

5G infrastructure is the network of physical equipment and software—cell towers and small antennas, fiber optic cables, data centers and the systems that control them—that delivers the next generation of mobile internet. Think of it as upgrading city roads to handle far more traffic at much higher speed and lower delay; investors watch 5G rollout because it requires big spending, enables new services and products, and can boost revenue for equipment makers, carriers and firms that build on faster connectivity.

optical input/output (I/O) technical

"data centers, 5G infrastructure and optical input/output (I/O)"

Optical input/output (I/O) is the use of light—typically through fiber or tiny lasers—to send and receive digital data between chips, devices or systems instead of using electrical wires. For investors it matters because optical I/O can dramatically increase data speed and capacity while lowering power use and heat, similar to upgrading narrow local roads to high‑speed highways that carry much more traffic with less congestion, which can boost performance and reduce operating costs in data centers and networks.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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FREMONT, CA / ACCESS Newswire / February 19, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will host meetings with institutional investors at the Susquehanna 15^th Annual Technology Conference taking place at the Lotte New York Palace Hotel in New York on February 26, 2026.

"We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and packaged-part formats. The growing adoption of wafer-level and packaged-part test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."

For additional information or to schedule a meeting with Aehr management, please contact your Susquehanna representative or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.

# # #

Contacts:

Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com

PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.com

SOURCE: Aehr Test Systems

View the original press release on ACCESS Newswire

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

When will Aehr Test Systems (NASDAQ:AEHR) attend the Susquehanna conference in 2026?

Aehr will attend on February 26, 2026 with management available for investor meetings. According to the company, President and CEO Gayn Erickson and CFO Chris Siu will host institutional investor meetings at the Lotte New York Palace Hotel in New York.

Who will represent Aehr Test Systems (AEHR) at the Susquehanna 15th Annual Technology Conference?

CEO Gayn Erickson and CFO Chris Siu will represent Aehr and meet institutional investors. According to the company, they will discuss Aehr's turnkey test and burn-in solutions across AI, data center, automotive and industrial semiconductor markets.

What topics will Aehr (NASDAQ:AEHR) discuss with investors at the February 26, 2026 meeting?

Aehr plans to discuss its test and burn-in solutions for AI, data center, automotive, and industrial semiconductors. According to the company, the meetings will cover wafer-level and packaged-part traction and the adoption trends driving growth for Aehr Test Systems.

How can investors schedule a meeting with Aehr management at the Susquehanna conference?

Investors should contact their Susquehanna representative or Aehr's investor relations firm to schedule meetings. According to the company, reach out to PondelWilkinson at jbyers@pondel.com for additional information or meeting requests.

Will Aehr (AEHR) present formal financial guidance at the Susquehanna conference?

The announcement specifies investor meetings but does not mention new financial guidance or earnings. According to the company, management will discuss business role and market traction rather than releasing formal financial figures in this notice.