Welcome to our dedicated page for Advanced Micro Devices news (Ticker: AMD), a resource for investors and traders seeking the latest updates and insights on Advanced Micro Devices stock.
Advanced Micro Devices, Inc. (AMD) is a global leader in high-performance computing and graphics technologies, driving innovation across semiconductors for data centers, gaming, and adaptive computing solutions. This dedicated news hub provides investors and technology professionals with essential updates spanning corporate developments and product advancements.
Access AMD's official press releases alongside curated industry analysis covering strategic partnerships, processor innovations, and market leadership in next-generation computing. Our repository includes earnings reports, executive commentary, and technology roadmap updates critical for understanding AMD's position in competitive semiconductor markets.
Key content categories feature quarterly financial results, product launch announcements, research breakthroughs, and industry event coverage. Stay informed about developments in artificial intelligence infrastructure, data center expansion, and next-gen GPU/CPU architectures shaping computing's future.
Bookmark this page for streamlined access to AMD's evolving story, with verified updates organized chronologically for efficient research. Check back regularly to monitor how AMD's adaptive computing solutions continue transforming industries from cloud services to edge AI applications.
AMD announced that AMD Ryzen AI PRO processors will power new Dell Pro devices, marking their first collaboration on commercial Dell devices. The announcement was made ahead of CES 2025. The third-generation Ryzen AI PRO processors are designed to enhance business productivity with features like live captioning and language translation in conference calls, along with advanced AI image generators.
The processors combine CPU, GPU, and NPU capabilities to deliver exceptional battery life, on-device AI processing, and Copilot+ experiences. These new processors offer security and manageability features through AMD PRO Technologies, aimed at streamlining IT operations and ensuring business ROI. The collaboration extends AMD and Dell's existing partnership, which includes AMD Threadripper PRO processors in workstations and EPYC CPUs in Dell PowerEdge servers.
AMD has announced new gaming products at CES 2025, expanding its leadership across desktop, mobile, and handheld gaming segments. The company unveiled the Ryzen 9950X3D and 9900X3D desktop processors, featuring up to 16 cores and enhanced 3D V-Cache technology, expected to launch in Q1 2025.
The new Ryzen Z2 Series processors for handheld gaming devices offer up to 8 'Zen 5' CPU cores and RDNA 3.5 architecture, promising console-class gaming experiences. Additionally, AMD introduced the Ryzen 9000HX Series mobile processors, including the flagship Ryzen 9955HX3D with 16 cores and 32 threads, targeted at high-performance gaming laptops.
Major OEM partners including Acer, ASUS, and Lenovo have committed to launching new gaming systems powered by these AMD processors, with products expected to hit shelves in the first half of 2025.
AMD has unveiled new processors ahead of CES 2025, expanding its AI PC portfolio with three main series: Ryzen AI Max, Ryzen AI 300, and Ryzen 200, along with their PRO variants for business users.
The flagship Ryzen AI Max Series features up to 16 'Zen 5' CPU cores, 40 RDNA 3.5 graphics compute units, and an XDNA 2 Neural Processing Unit delivering up to 50 TOPS of AI processing. These processors support up to 128GB of unified memory and will be available in Q1 2025.
The Ryzen AI 300 Series includes new Ryzen AI 7 and Ryzen AI 5 models with up to 8 'Zen 5' cores and RDNA 3.5 graphics, offering five times better performance than first-generation NPUs. The Ryzen 200 Series, based on 'Zen 4' architecture, will launch in Q2 2025 with up to 8 cores and 16 NPU TOPS.
AMD has announced the Versal RF Series, a groundbreaking adaptive system-on-chip (SoC) that integrates high-resolution RF data converters, DSP hard IP, AI Engines, and programmable logic in a single device. The series offers up to 80 TOPS of DSP performance and features 14-bit, 32 GSPS, 18 GHz RF-ADCs for precise spectrum analysis.
This 5th generation of AMD direct RF devices delivers up to 19X more DSP compute in channelizer mode compared to previous generation Zynq UltraScale+ RFSoC. The solution targets aerospace, defense, and test & measurement markets with optimized size, weight, and power (SWaP). Development tools are available now, with silicon samples expected in Q4 2025 and production beginning in H1 2027.
AMD has appointed Tim Keating as Senior Vice President of Government Relations and Regulatory Affairs. Keating brings extensive experience, including over 14 years at Boeing as executive vice president of Government Relations and previous roles at Honeywell International and the White House. The appointment aims to strengthen AMD's engagement with key stakeholders as high-performance and AI chips become increasingly important in daily life.
AMD announced it will host a press conference during CES 2025 Media Days on January 6 at 11 a.m. PST at the Mandalay Bay. Jack Huynh, AMD's senior vice president and general manager of Computing and Graphics Group, along with other executives will discuss AMD's leadership in PCs and gaming, and showcase the company's high-performance computing and AI product portfolio. The event will be livestreamed on AMD's YouTube Channel with replay available afterward.
AMD has announced two upcoming financial community events. Forrest Norrod, executive vice president and general manager of Data Center Solutions Business Unit, will participate in the UBS Annual Technology Conference on December 3, 2024, at 12:15 PM MST. Additionally, Jean Hu, executive vice president, chief financial officer and treasurer, will attend the Barclays Global TMT Conference on December 12, 2024, at 11:00 AM PST. Both presentations will be available via webcast on AMD's Investor Relations website.
AMD announces El Capitan supercomputer, powered by AMD Instinct MI300A APUs, becomes the world's fastest supercomputer with a 1.742 exaflops performance score. This marks the second AMD-powered system to break the exascale barrier, following Frontier. AMD now powers 50% of the top ten fastest and 40% of the most energy-efficient supercomputers globally. The company also announced a collaboration with IBM to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud, expected in first half of 2025.
AMD has announced the Versal Premium Series Gen 2, an adaptive SoC platform featuring industry-first FPGA devices with CXL 3.1 and PCIe Gen6 connectivity, along with LPDDR5X memory support. The platform offers enhanced data movement efficiency and increased memory resources to address growing processing demands in data center, communications, and defense markets.
Key features include PCIe Gen6 offering 2-4X faster line rates compared to competing FPGAs, LPDDR5X memory connectivity at up to 8533 Mb/s, and enhanced security features including PCIe Integrity and Data Encryption. Development tools are expected in Q2 2025, with silicon samples by early 2026 and production starting in second half 2026.
Fujitsu and AMD have signed a memorandum of understanding to form a strategic partnership focused on creating computing platforms for AI and high-performance computing (HPC). The collaboration aims to develop open-source and energy-efficient platforms by combining Fujitsu's MONAKA processor with AMD Instinct accelerators. The partnership spans three strategic areas: engineering, ecosystems, and business, with joint development targets set for 2027. The initiative will enhance AMD's ROCm software and Fujitsu's Arm-based software stack, while establishing a joint customer center to promote AI implementation globally.
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