Ansys Inc Stock Price, News & Analysis

Ansys, Inc. announced it will release its second quarter 2022 earnings on August 3, 2022, post-market. A conference call is scheduled for 8:30 a.m. ET on August 4, 2022, featuring CEO Ajei Gopal and CFO Nicole Anasenes discussing results and future outlook. Investors can pre-register for the call, with a link provided for easy access. The call will be recorded, and a replay will be available shortly after.

NASCAR utilized Ansys' simulation solutions to conduct virtual crash tests, which led to significant cost savings of $1 million and expedited validation for the Next Gen race car ahead of the 2022 NASCAR Cup Series. Through virtual testing, NASCAR reduced reliance on costly physical crash tests, which typically average $500,000 each, to only two full-scale tests. This approach successfully navigated pandemic-related challenges, enabling a timely launch for the prestigious Daytona 500.

Achronix Semiconductor has adopted Ansys' multiphysics simulation solutions to enhance the design of its latest FPGA, the Speedster®7t AC7t1500. This collaboration ensures thermal reliability and power integrity for the high-performance chip, built on advanced 7nm silicon technology, which is essential for demanding tasks like AI and ML. Ansys' tools, including RedHawk and Totem, provide vital verification processes. This strategic partnership leverages Ansys’ capabilities, reinforcing its role in optimizing semiconductor technology.

Ansys (NASDAQ: ANSS) will showcase its simulation solutions at the Farnborough International Airshow from July 18-22, 2022. These solutions are designed to enhance propulsion, design efficiency, and safety technologies while reducing emissions and noise pollution in the aerospace and defense (A&D) industry. Ansys aims to support digital transformation by decreasing prototyping costs and design errors. Experts will demonstrate the benefits of simulation across various sectors, including sustainable aviation and defense capabilities, while also addressing cybersecurity for aircraft systems.

Samsung has selected Ansys' electromagnetic simulation tools to enhance its semiconductor design processes, particularly for 5G/6G technologies.

This collaboration aims to streamline design cycles by accelerating electromagnetic design times by up to 10 times and reducing time to market by 2-3 weeks for smaller designs and up to 2 months for more complex ones.

Key features include advanced capacity, integration capabilities, and automation for greater accuracy and efficiency in modeling. This partnership reflects Ansys' commitment to addressing evolving industry demands in electronic design.

Ansys (NASDAQ: ANSS) has joined Intel Foundry Services' (IFS) Cloud Alliance, enhancing semiconductor design efficiency through multiphysics platforms like Ansys RedHawk-SC and HFSS. This partnership enables robust, cloud-based electronic design automation (EDA) workflows, allowing customers to focus on innovation rather than operational tasks. The collaboration is expected to improve accessibility to Intel's leading silicon technologies, speeding up design processes and boosting productivity for chip designers.

Ansys has partnered with SoftInWay to enhance turbomachinery design workflows by integrating 1D-2D design and 3D simulation capabilities. This collaboration aims to streamline the design process, enabling easier data transfer and optimization. Key benefits include improved efficiency in the engineering workflow, lower production costs, and reduced time to market. The integration allows for high-fidelity simulations and supports the development of lower-emission engine designs. This partnership positions Ansys to better meet evolving efficiency and emissions targets in the aerospace sector.

Ansys has collaborated with TSMC to support the TSMC N6RF Design Reference Flow, enabling faster design of high-performance radio frequency (RF) chips for 5G, Wi-Fi, and IoT applications. Utilizing Ansys' multiphysics simulation platform, including tools like RaptorX and Exalto, the collaboration aims to enhance chip design efficiency and reduce costs through advanced design capabilities. This partnership addresses the growing demand for wireless communication technologies and provides a low-risk solution for RF designers.

Ansys has extended its collaboration with TSMC, achieving certification for its power integrity software, Ansys Redhawk-SC and Ansys Totem, for TSMC's N3E and N4P process technologies. This certification supports advanced chip designs for applications such as machine learning, 5G, and high-performance computing. Ansys' solutions are recognized for their accuracy in analyzing power integrity issues, enabling designers to optimize performance down to 3nm. This partnership enhances Ansys' position in the semiconductor market, ensuring their tools align with cutting-edge technology.