Ansys Inc Stock Price, News & Analysis

Ansys and TSMC have collaborated to provide a sophisticated thermal analysis solution for multi-die designs utilizing TSMC's 3DFabric technologies. This solution includes the use of Ansys RedHawk-SC for power integrity signoff and Icepak for thermal analysis, which are critical for preventing overheating in electronic systems. The collaboration aims to enhance the reliability of complex chip-and-package systems. A paper detailing this solution was presented at the TSMC 2021 Open Innovation Platform Ecosystem Forum.

Ansys has appointed Anil Chakravarthy to its Board of Directors, effective October 26, 2021. Chakravarthy, with extensive experience in digital transformation, SaaS, and cloud technologies, previously served as an executive at Adobe, CEO of Informatica, and held roles at Symantec and VeriSign. His appointment is viewed positively as he brings valuable insights for accelerating growth and innovation at Ansys, a leader in engineering simulation. His expertise in transforming businesses aligns with Ansys's vision of improving product delivery.

Ansys and Electro Magnetic Applications, Inc. have launched EMA3D Charge, a new simulation solution for predicting charging and discharging events in electronic components. This solution aims to enhance safety and design efficiency across industries such as aerospace, electronics, and automotive by allowing engineers to identify risks early in the design process. The intuitive interface and end-to-end workflow of EMA3D Charge could reduce late-phase redesign costs, thereby saving companies potentially millions of dollars.

On October 20, 2021, Ansys (NASDAQ: ANSS) announced a collaboration with Ford to advance predictive smart headlight technology. The partnership utilizes Ansys' AVxcelerate Headlamp solution to enhance headlight performance through virtual simulations, significantly reducing costs and time associated with physical testing. The new system uses real-time data to improve visibility and safety during night driving, enabling Ford to optimize designs before creating physical prototypes. This innovation represents a significant step in automotive safety, leveraging simulation technology to reduce accidents.

Ansys has announced that its LS-DYNA software is the first commercial CAE structural simulation solution to support Fujitsu's Arm-based PRIMEHPC supercomputers. This collaboration aims to lower computing costs and enhance sustainability by reducing energy consumption during simulations. Early tests indicate the single precision version of LS-DYNA runs over 2X faster on the PRIMEHPC FX1000 than on its predecessor. Ansys is set to release a double precision version in 2022, further expanding its HPC offerings for energy-efficient product development.

ANSYS (NASDAQ: ANSS) will release its third quarter earnings on November 3, 2021, after market close. A conference call led by CEO Ajei Gopal and CFO Nicole Anasenes will follow on November 4, 2021, at 8:30 a.m. ET to discuss the results and future outlook. Participants can pre-register for the call or join directly on the event day. The call will also be recorded and available for replay shortly after.

As a leader in engineering simulation, ANSYS aids companies in overcoming complex design challenges and enhancing product development.

Ansys (NASDAQ: ANSS) announced the upcoming launch of its first metal stamping simulation software, Ansys Forming, set for release in January. This all-in-one platform is designed to address various metal stamping needs, empowering engineers with early-stage design configurations and enhanced predictive accuracy using Ansys LS-DYNA as its solver. Ansys Forming allows users to optimize their workflows by eliminating physical testing, improving productivity, and driving cost savings. The software aims to deliver detailed insights into structural weaknesses and increase accessibility for users, streamlining the metal manufacturing process.

Ansys has partnered with Apple to introduce a cloud-based RF safety testing simulation solution for developers of MagSafe modules. This innovative offering aims to streamline the certification process for Specific Absorption Rate (SAR), significantly reducing costs by eliminating the need for physical prototypes and expensive RF safety certification software. The solution enhances efficiency, enabling developers to bring safer and reliable accessories to market more rapidly. Ansys leverages its advanced HFSS electromagnetic solver to provide an intuitive developer experience with automated results and standards-conforming data reports.

Ansys and Autodesk are collaborating to launch the Fusion 360 PCB extension, enhancing electromagnetic analysis for PCB design. This extension aims to improve design efficiency by enabling rapid exploration and validation of PCB designs, reducing costly prototyping. Key benefits include:

• Predictive accuracy in PCB design
• Increased accessibility for engineers
• Early simulation to speed up product development

This partnership strengthens Ansys's role in engineering simulation, providing significant advantages for consumer product designers.