Ansys Inc Stock Price, News & Analysis

On October 27, 2020, Ansys announced certifications for its semiconductor design solutions with Samsung Foundry's FinFET process nodes. This includes the integration of Ansys RedHawk-SC aimed at designing efficient chips for markets like 5G, AI, HPC, automotive, and IoT.

The certification covers all FinFET nodes from 4nm to 14nm, focusing on power integrity and thermal analysis. This collaboration allows Samsung to optimize performance while reducing simulation time significantly. The partnership enhances the ability to meet advanced design requirements and reliability challenges in semiconductor applications.

Ansys has entered into a definitive agreement to acquire Analytical Graphics, Inc. for $700 million, expected to close in Q4 2020 subject to regulatory clearance. This acquisition will enhance Ansys' offerings by enabling mission-driven simulation capabilities, essential for aerospace and defense sectors. The deal involves a cash payment of 67% and 33% in Ansys common stock. Once finalized, it is projected to contribute $75 million to $85 million in non-GAAP revenue in 2021, with modest accretion to earnings per share.

Ansys has been recognized with two TSMC Open Integration Platform Partner of the Year awards for its contributions to 3nm design infrastructure and 3D-IC design productivity solutions. The awards highlight Ansys' advanced simulation tools, including Ansys RedHawk-SC and Totem, which are tailored for TSMC's latest technologies. These tools enable efficient design and verification for high-performance applications in sectors like automotive and IoT. TSMC's senior director lauded Ansys for facilitating customer success through innovative solutions.

Ansys (NASDAQ: ANSS) and EOS have partnered to enhance the workflow for developing additive manufacturing (AM) parts. This collaboration integrates EOS's industrial 3D printing systems with Ansys simulation solutions, enabling AM engineers to create precise parts more efficiently. By eliminating trial-and-error methods, the new workflow significantly reduces production time and costs, allowing for faster product market entry. Users can design complex print jobs up to 20% faster and simple jobs by 50-60%. This collaboration aims to reduce build failures, enhance material property selection, and improve overall productivity.

ANSYS, Inc. (NASDAQ: ANSS) will release its Q3 2020 earnings on November 4, 2020, after market close.

A conference call is scheduled for November 5, 2020, at 8:30 a.m. ET, hosted by Ajei Gopal, President and CEO, and Maria T. Shields, CFO. Participants can pre-register for immediate call access without operator intervention.

The earnings announcement, prepared remarks, and investor presentation will be available on the Ansys Investor Relations website.

Ansys announced that its Startup Program has surpassed 1000 participants globally, doubling in size in two years. Startups use Ansys simulation tools to innovate while reducing costs and development time. Notable users include Firefly Aerospace and The Onward Project, which leverage these solutions for optimizing designs such as rocket launch vehicles and a human-powered wheelchair. The program provides accessible pricing for startups, allowing them to validate product performance virtually, significantly reducing reliance on expensive physical prototypes. This initiative enhances Ansys's role as a leader in engineering simulation.

Ansys hosted its inaugural IDEAS Digital Forum, a virtual event aimed at semiconductor designers, featuring keynotes from industry leaders like Nvidia, Google, and Intel. The event emphasized the pivotal role of simulation in enhancing integrated circuit performance and reliability, showcasing 16 hours of technical content. Discussions included advancements in multiphysics analysis for cutting-edge chip design. John Lee, Ansys VP, highlighted the event's success and the importance of their simulation tools in modern technology sectors such as AI and 5G.

Compal Electronics has integrated Ansys automation solutions to significantly reduce data processing times for its 5G laptop development, from weeks to days. This partnership allows Compal to effectively design high-frequency electronics, ensuring enhanced product safety and reliability. Moreover, Ansys enabled Compal to achieve a crucial FCC certification for its 5G millimeter-wave laptop, boosting its competitive edge in the 5G market.

The collaboration optimizes R&D efficiency, accelerating the time-to-market for 5G laptops and aiding compliance with rigorous international standards.

Ansys and the University of Texas at Arlington (UTA) have partnered to create an advanced design and analysis workflow for validating models in U.S. hypersonic vehicles. This collaboration aims to enhance software accuracy through physical flight tests in UTA's specialized wind tunnel. The initiative seeks to streamline certification processes, reduce costs tied to hypersonic technology development, and address the shortage of engineers in this field, all while expediting the engineering cycle for future aerospace projects.