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Alpha and Omega Semiconductor Limited reports recurring developments in power semiconductor products, quarterly results, and manufacturing capacity. The company designs, develops, and supplies discrete power devices, wide bandgap power devices, power management ICs, and modules for computing, consumer electronics, communications, industrial power, motor control, and power-supply applications.
Company news often covers MOSFET and DrMOS product launches for AI servers, data centers, high-end GPUs, solar inverters, telecom rectifiers, motor drives, and industrial systems. Updates also include Intelligent Power Module production, participation in power electronics industry events, and financial results that discuss revenue trends, gross margin, operating performance, and application-market demand.
Alpha and Omega Semiconductor (NASDAQ: AOSL) will showcase new power-management products at APEC 2026 (Mar 22–26, San Antonio) and present on Mar 25. Key announcements include multi-phase controllers for GPUs/SoCs, IMVP9.3 CPU power stages in mass production, a compact Intel-footprint SPS, Type-C EPR 3.1 protection switches to 240W, and wide-bandgap MOSFETs for 800V DC data-center power.
The product set targets AI core power, AI factory 48V/54V and 800V architectures, and industrial BLDC motor drives with topside cooling and hot-swap-safe MOSFETs.
Alpha and Omega Semiconductor (NASDAQ: AOSL) reported fiscal Q2 2026 results for the quarter ended December 31, 2025: revenue $162.3M (down 11.1% QoQ, down 6.3% YoY), GAAP gross margin 21.5%, GAAP operating loss $(13.6)M and GAAP net loss $(13.3)M; cash and equivalents were $196.3M. Management expects Q3 revenue ~$160M ±$10M and projects sequential improvement beginning in the June quarter as product mix shifts.
Company highlighted strength in Communications and share gains with a Tier One U.S. smartphone customer and noted higher R&D spending into performance-driven applications.
Alpha and Omega Semiconductor (Nasdaq: AOSL) unveiled the αMOS E2 600V Super Junction MOSFET platform and its first high‑voltage device, the AOTL037V60DE2. The device is a 600V TOLL MOSFET with a maximum RDS(ON) of 37 mΩ, engineered for high efficiency, power density and robustness in servers, telecom rectifiers, solar inverters, motor drives and industrial power systems. Internal testing cited body diode ruggedness at di/dt = 1300 A/µs at 150 °C, improved UIS capability and longer short‑circuit withstanding time versus competing MOSFETs. The part is available in production quantities with a 16‑week lead time and a unit price of $5.58 in 1,000‑piece quantities.
Alpha and Omega Semiconductor (Nasdaq: AOSL) will release fiscal second quarter results for the period ended December 31, 2025 on Thursday, February 5, 2026 after market close. A conference call and live webcast will follow at 2:00 p.m. PT / 5:00 p.m. ET to review results and other business matters.
Dial-in numbers for the live call are +1 (833) 470 1428 (U.S./Canada) and +1 (404) 975 4839 (international) with access code 033075. The webcast will be available in the Events & Presentations section of the company's investor site and a replay (web and telephone) will be available for seven days; telephone replay numbers are +1 (866) 813 9403 (U.S./Canada) and +1 (929) 458 6194 (international) with access code 401512.
Alpha and Omega Semiconductor (Nasdaq: AOSL) announced the AOLV66935, a 100V High SOA MOSFET in an LFPAK 8x8 package aimed at 48V hot-swap architectures in AI servers.
Key facts: RDS(on) max 1.86 mΩ @ VGS=10V, continuous drain current 334 A (@25°C), SOA characterized at 25°C and 125°C, package ~60% smaller than TO-263, immediate production availability with 14–16 week lead time and unit pricing of $3.60 in 1,000-piece quantities.
Alpha and Omega Semiconductor (Nasdaq: AOSL) said company management will participate in the 14th Annual NYC Summit investor conference on Tuesday, December 16, 2025 at Mastro’s Steakhouse New York. The company will join 14 other presenting companies for investor meetings and presentations.
Alpha and Omega Semiconductor (NASDAQ:AOSL) announced on November 13, 2025 a Board-approved share repurchase program authorizing up to $30 million of common-stock repurchases. The company said repurchases may occur in the open market, in privately negotiated transactions, or by other methods and that it intends to adopt a 10b5-1 trading plan to facilitate open-market purchases.
Timing and amounts will depend on share price, market conditions and other factors. The company expects to fund repurchases from existing cash reserves and ongoing cash from operations, and the program may be modified, suspended or terminated at the Board’s discretion.
Alpha and Omega Semiconductor (NASDAQ: AOSL) reported fiscal Q1 2026 results for the quarter ended September 30, 2025: revenue $182.5M (+3.4% QoQ, flat YoY), GAAP gross margin 23.5%, non-GAAP gross margin 24.1%, GAAP operating loss $4.6M, and non-GAAP operating income $2.5M. GAAP net loss per diluted share was $0.07; non-GAAP net income per diluted share was $0.13. Cash and equivalents were $223.5M. Management cited Power IC revenue up 37.3% YoY and said Power ICs now represent nearly 40% of product revenue. Q2 guidance: revenue ~$160M ±$10M, GAAP gross margin ~22.3% ±1%.
Alpha and Omega Semiconductor (Nasdaq: AOSL) will release fiscal first quarter results for the period ended September 30, 2025 on Wednesday, November 5, 2025 after market close.
The release will be followed by a public conference call and live webcast on November 5, 2025 at 2:00 p.m. PT / 5:00 p.m. ET. Participants may join by phone at +1 (833) 470 1428 or +1 (404) 975 4839 (outside US/Canada) using access code 113757, or via the company's investor relations website http://investor.aosmd.com in the Events & Presentations section.
A webcast replay will be available for seven days after the call. A telephone replay will be available approximately two hours after the call for seven days at +1 (866) 813 9403 or +1 (929) 458 6194 (outside US/Canada) using access code 402963.
Alpha and Omega Semiconductor (Nasdaq: AOSL) announced support for an 800 VDC power architecture aimed at next‑generation AI data centers and ‘‘AI factories,’’ highlighting collaborations with NVIDIA to design semiconductors for megawatt‑scale racks.
Key technical elements: SiC Gen3 devices (AOM020V120X3, AOGT020V120X2Q) for high‑voltage AC‑to‑DC conversion, 650V and 100V GaN FETs (AOGT035V65GA1, AOFG018V10GA1) for high‑density DC‑DC conversion, stacked‑die MOSFET packages (AOPL68801) and 16‑phase multiphase controllers. Promised system benefits include ~5% end‑to‑end efficiency improvement and 45% reduction in copper, plus reduced maintenance and cooling costs.