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Alpha and Omega Semiconductor Limited reports recurring developments in power semiconductor products, quarterly results, and manufacturing capacity. The company designs, develops, and supplies discrete power devices, wide bandgap power devices, power management ICs, and modules for computing, consumer electronics, communications, industrial power, motor control, and power-supply applications.
Company news often covers MOSFET and DrMOS product launches for AI servers, data centers, high-end GPUs, solar inverters, telecom rectifiers, motor drives, and industrial systems. Updates also include Intelligent Power Module production, participation in power electronics industry events, and financial results that discuss revenue trends, gross margin, operating performance, and application-market demand.
Alpha and Omega Semiconductor (NASDAQ: AOSL) has announced its participation in two upcoming investor conferences. The company will attend the B. Riley 25th Annual Institutional Investor Conference in Marina Del Rey, CA on May 21, and the Stifel 2025 Cross Sector Insight Conference in Boston, MA on June 4. Management will be available for one-on-one meetings with institutional investors at both events. Interested portfolio managers and analysts should contact their institutional sales representatives at the respective sponsoring banks to schedule meetings.
- 30% smaller footprint compared to TO-263 (D2PAK)
- Low on-resistance of 1.95 mOhms @10V
- Continuous drain current of 360A @25°C
- Pulsed drain current of 1440A
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Alpha and Omega Semiconductor (AOSL) has launched its new Mega IPM-7 series intelligent power modules, designed for brushless DC motor drives. These modules target home appliance applications like air-conditioners, refrigerators, dishwashers, and power tools.
The series features:
- High efficiency and compact design
- 600V/1A – 600V/3A power ratings
- Integrated temperature detection
- Multiple package options including Mega IPM7-DT, Mega7 DBC, and Mega7 exposed package
- 18mm x 7.5mm compact package size
- Integrated HVIC gate driver with bootstrap circuit
- Built-in over-temperature protection
The modules are immediately available for production with a 16-week lead time, priced at $1.8 per unit in 1,000-piece quantities. The series aims to improve application performance and power density while meeting space-constrained inverter design requirements.
Alpha and Omega Semiconductor (AOSL) has announced its participation at PCIM 2025 in Nuremberg, Germany, where it will showcase significant advancements in power semiconductor solutions. The company will introduce its Generation 3 1200V SiC MOSFET technology, offering 20-30% loss improvement compared to Gen 2, with enhanced ruggedness for harsh environments.
Key product highlights include:
- New 1200V Gen3 SiC MOSFETs (15mohm to 40mohm) in TO247-4L packages, starting production in May 2025
- Mega IPM-7 Intelligent Power Modules featuring G2 IGBT integration
- New 60V and 100V driver ICs for power tools and e-mobility
- 12V/60A eFuse products launching May 2025
- Advanced packaging solutions including double-sided cooling DFN 5x6
Alpha and Omega Semiconductor (AOSL) has scheduled its fiscal third quarter 2025 financial results announcement for May 7, 2025, after market close. The announcement will cover the period ended March 31, 2025.
The company will host a conference call and live webcast at 2:00 p.m. PT / 5:00 p.m. ET to discuss the results and other business matters. Investors can access the call via phone using +1 (833) 470 1428 (US/Canada) or +1 (404) 975 4839 (International) with access code 362162.
A webcast will be available through the investor relations website, with a seven-day replay period. Phone replay will be accessible at +1 (866) 813 9403 (US/Canada) or +1 (929) 458 6194 (International) with access code 894534.
Alpha and Omega Semiconductor (AOSL) has introduced two new surface mounting package options for its high-power MOSFET portfolio: the GTPAK™ and GLPAK™ packages. The GTPAK, featured in AOGT66909 MOSFET, offers topside cooling with a large exposed pad for efficient heat transfer, enabling the use of lower-cost PCB boards. The GLPAK, available with AOGL66901 MOSFET, utilizes advanced clip technology for high inrush current rating and improved EMI performance.
Both packages feature gull-wing leads for enhanced solder joint reliability and thermal cycling performance, particularly in insulated metal substrates applications. The MOSFETs are manufactured in IATF16949-certified facilities and support automated optical inspection. The AOGT66909 and AOGL66901 are available at $3.6 and $3.15 respectively in 1,000-piece quantities, with a 14-16 week lead time.