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Amtech Systems Appoints Thomas Sabol as Chief Financial Officer

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ai semiconductor device packaging technical
AI semiconductor device packaging is the physical assembly and protective housing of chips designed for artificial intelligence tasks, including how multiple chip components are stacked, connected, cooled and linked to a circuit board. It matters to investors because packaging influences a chip’s speed, power use, reliability and production cost—like the case, wiring and cooling system for a high-performance engine—so advances can create competitive advantage, affect profit margins and shape supply-chain risks.
advanced substrate fabrication technical
Advanced substrate fabrication is the specialized process of producing high‑precision base layers or platform materials on which electronic components, chips, or delicate devices are built. Like laying a building’s foundation, small improvements in these base materials can markedly boost product speed, reliability and manufacturing yield, so changes in this process affect costs, supply constraints and a company’s competitive edge—key factors for investors.
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TEMPE, Ariz.--(BUSINESS WIRE)-- Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, today announced the appointment of Mr. Thomas Sabol as the Company’s Chief Financial Officer, effective May 14, 2026. In this role, Mr. Sabol will also serve as the Company’s principal accounting officer and principal financial officer. Mr. Sabol will replace Mr. Mark Weaver, who has been serving as Interim Chief Financial Officer.

“We are pleased to have appointed Tom Sabol as our incoming Chief Financial Officer and are fortunate to have found a financial leader with significant technical expertise who aligns with our culture of innovation, customer focus and workforce engagement,” said Mr. Bob Daigle, Chief Executive Officer of Amtech. “Tom’s appointment enables Amtech to benefit from his experience in assisting companies scale through periods of secular growth. He will be instrumental in our mission to deliver profitable growth and reap the full benefit of operational leverage amid the increasing demand for advanced packaging and enterprise board assembly equipment that supports the AI infrastructure buildout and solutions that support the broader semiconductor market.”

Mr. Sabol has more than 30 years of senior financial leadership experience, including over 20 years as a chief financial officer of public and private companies, with significant experience in electronics manufacturing, electronic payments, software, and technology‑enabled businesses.

Mr. Sabol previously served as Interim Chief Financial Officer and Head of HR with Korn Ferry Executive Interim Services practice from August 2025 to May 2026. From May 2023 to May 2026, Mr. Sabol also served as a consultant to various companies, providing CFO and other support services. From October 2021 through March 2023, Mr. Sabol served as Chief Financial Officer of Corcentric Inc. From November 2019 through December 2020, Mr. Sabol served as Chief Financial Officer at Transact Campus Inc. From November 2016 through November 2019, Mr. Sabol served as Chief Financial Officer of Rimini Street, Inc., where he led the company through its initial public offering and managed SEC reporting, internal controls, and investor relations.

Earlier in his career, Mr. Sabol served at Plexus Corp., a publicly traded global electronic manufacturing services company, initially as Chief Financial Officer from 1996 through 2002 and subsequently as Chief Operating Officer and Executive Vice President from 2002 through 2003, during a period that included international expansion and multiple acquisitions.

Mr. Sabol began his career at Coopers & Lybrand, where he served as a Senior Audit Manager, including participation in several initial public offerings and service in the firm's SEC National Office. He is a Certified Public Accountant and holds a Bachelor of Arts in Accounting from Marquette University.

About Amtech Systems, Inc.

Amtech Systems, Inc. (NASDAQ: ASYS) provides equipment, consumables and services for AI semiconductor device packaging and advanced wafer substrate fabrication. Our products include advanced packaging and electronics assembly equipment for applications such as AI GPUs and advanced automotive electronics. Consumable and other solutions are used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon (Si) power devices, digital and analog devices, power electronic packages, advanced semiconductor packages and electronic assemblies. We sell these products to semiconductor device and module manufacturers worldwide, particularly in Asia, North America and Europe. To learn more about Amtech, please visit our website at https://www.amtechsystems.com.

Amtech Systems may use its website (www.amtechsystems.com), investor relations page (https://www.amtechsystems.com/investors), and LinkedIn page (https://www.linkedin.com/company/amtechsystems) to disclose material non-public information and for complying with its disclosure obligations under Regulation FD. Accordingly, investors and other interested parties should monitor these sites, in addition to following Amtech Systems press releases, Securities and Exchange Commission (SEC) filings, public conference calls and public presentations/webcasts.

Investor Relations Contact:

Darrow Associates
Jordan Darrow
631-766-4528
jdarrow@darrowir.com

Source: Amtech Systems, Inc.