Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing
- New material performs twice as effectively as copper in thermal conductivity (over 800 W/m-K)
- Material matches coefficient of thermal expansion of silicon, enabling direct integration with semiconductors
- Product could significantly reduce datacenter cooling costs, which currently account for up to 50% of energy consumption
- Material is corrosion-resistant, electrically insulating, and mechanically robust across broad temperature ranges
- None.
Insights
Coherent's new diamond-SiC material represents a significant thermal management breakthrough for AI datacenters, potentially capturing high-margin market share in critical cooling applications.
Coherent's new diamond-loaded silicon carbide composite represents a significant technological leap in thermal management materials. With thermal conductivity exceeding 800 W/m-K – twice that of copper – this material addresses one of the most pressing challenges in advanced computing: heat dissipation.
The material's value proposition extends beyond raw thermal performance. Its coefficient of thermal expansion (CTE) matching with silicon solves a critical engineering problem, as mismatched expansion rates typically cause mechanical stress, warping, and eventual failure in high-power applications. This compatibility enables direct integration with semiconductor devices, potentially eliminating intermediate thermal interface materials that introduce inefficiencies.
From a market perspective, this innovation comes at a perfect time. The exponential growth in AI computing has created unprecedented thermal challenges, with datacenter cooling now consuming up to 50% of total energy usage. Even modest improvements in cooling efficiency translate to substantial operating cost reductions at scale.
The versatility of the material – being corrosion-resistant, electrically insulating, and compatible with direct liquid cooling systems – positions it for adoption across multiple cooling architectures. Applications in chip heat spreading, microchannel cold plates, and semiconductor substrates create multiple revenue streams within the high-margin thermal management market.
Coherent's patent protection creates a meaningful competitive moat in a sector where material innovation typically faces rapid commoditization. This technology potentially cements Coherent's position as a critical supplier in the AI infrastructure supply chain, where cooling solutions increasingly determine system performance ceilings.
SAXONBURG, Pa., June 12, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems.
The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices.
“Diamond remains unmatched in its ability to manage extreme thermal loads in electronics,” said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. “Our patented diamond-SiC outperforms traditional materials by a wide margin, enabling more reliable operation, longer component lifetimes, and significantly lower cooling costs. With cooling accounting for up to
Engineered for durability and versatility, this composite is corrosion-resistant, electrically insulating, and mechanically robust across a broad temperature range. It is fully compatible with direct liquid cooling (DLC) systems and integrates easily into modern server architectures and embedded cooling designs. Key applications include direct to chip heat spreading, microchannel cold plates (single- and two-phase), semiconductor device substrates, and other advanced solutions where copper-based materials fall short.
This innovation from Coherent marks a major step forward in thermal management, addressing the growing performance and energy-efficiency needs of AI infrastructure and HPC platforms. For more information on Diamond Heat Spreaders by Coherent, please visit: Cooling Solutions for Overworked Datacenters | Coherent
About Coherent
Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide. For more information, please visit us at coherent.com.
Media Contact:
innovations@coherent.com
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