Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing

Rhea-AI Summary

Coherent Corp (NYSE: COHR) has unveiled a revolutionary diamond-loaded silicon carbide ceramic composite material designed for advanced thermal management in AI datacenters and HPC systems. The patented material achieves thermal conductivity over 800 W/m-K, performing twice as effectively as copper while matching silicon's thermal expansion properties. This breakthrough addresses critical cooling challenges in datacenters, where thermal management can consume up to 50% of energy costs. The composite material is corrosion-resistant, electrically insulating, and compatible with direct liquid cooling systems. Key applications include chip heat spreading, microchannel cold plates, and semiconductor device substrates, positioning Coherent at the forefront of thermal management solutions for next-generation computing infrastructure.

Positive

• New material performs twice as effectively as copper in thermal conductivity (over 800 W/m-K)
• Material matches coefficient of thermal expansion of silicon, enabling direct integration with semiconductors
• Product could significantly reduce datacenter cooling costs, which currently account for up to 50% of energy consumption
• Material is corrosion-resistant, electrically insulating, and mechanically robust across broad temperature ranges

Negative

• None.

Insights

Materials Science & Semiconductor Expert

Coherent's new diamond-SiC material represents a significant thermal management breakthrough for AI datacenters, potentially capturing high-margin market share in critical cooling applications.

Coherent's new diamond-loaded silicon carbide composite represents a significant technological leap in thermal management materials. With thermal conductivity exceeding 800 W/m-K – twice that of copper – this material addresses one of the most pressing challenges in advanced computing: heat dissipation.

The material's value proposition extends beyond raw thermal performance. Its coefficient of thermal expansion (CTE) matching with silicon solves a critical engineering problem, as mismatched expansion rates typically cause mechanical stress, warping, and eventual failure in high-power applications. This compatibility enables direct integration with semiconductor devices, potentially eliminating intermediate thermal interface materials that introduce inefficiencies.

From a market perspective, this innovation comes at a perfect time. The exponential growth in AI computing has created unprecedented thermal challenges, with datacenter cooling now consuming up to 50% of total energy usage. Even modest improvements in cooling efficiency translate to substantial operating cost reductions at scale.

The versatility of the material – being corrosion-resistant, electrically insulating, and compatible with direct liquid cooling systems – positions it for adoption across multiple cooling architectures. Applications in chip heat spreading, microchannel cold plates, and semiconductor substrates create multiple revenue streams within the high-margin thermal management market.

Coherent's patent protection creates a meaningful competitive moat in a sector where material innovation typically faces rapid commoditization. This technology potentially cements Coherent's position as a critical supplier in the AI infrastructure supply chain, where cooling solutions increasingly determine system performance ceilings.

SAXONBURG, Pa., June 12, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems.

The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices.

“Diamond remains unmatched in its ability to manage extreme thermal loads in electronics,” said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. “Our patented diamond-SiC outperforms traditional materials by a wide margin, enabling more reliable operation, longer component lifetimes, and significantly lower cooling costs. With cooling accounting for up to 50% of a datacenter’s energy consumption, thermal efficiency is more critical than ever.”

Engineered for durability and versatility, this composite is corrosion-resistant, electrically insulating, and mechanically robust across a broad temperature range. It is fully compatible with direct liquid cooling (DLC) systems and integrates easily into modern server architectures and embedded cooling designs. Key applications include direct to chip heat spreading, microchannel cold plates (single- and two-phase), semiconductor device substrates, and other advanced solutions where copper-based materials fall short.

This innovation from Coherent marks a major step forward in thermal management, addressing the growing performance and energy-efficiency needs of AI infrastructure and HPC platforms. For more information on Diamond Heat Spreaders by Coherent, please visit: Cooling Solutions for Overworked Datacenters | Coherent

About Coherent 

Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide. For more information, please visit us at coherent.com.

Media Contact: 
innovations@coherent.com 

FAQ

What is Coherent's new diamond-silicon carbide material and how does it perform?

Coherent's new material is a diamond-loaded silicon carbide ceramic composite that achieves thermal conductivity exceeding 800 W/m-K, performing twice as effectively as copper in thermal management applications.

How could COHR's new thermal management solution impact datacenter costs?

The solution could significantly reduce datacenter cooling costs, which currently represent up to 50% of a datacenter's energy consumption, through improved thermal efficiency.

What are the key applications for Coherent's diamond-SiC material?

The material is designed for direct to chip heat spreading, microchannel cold plates, semiconductor device substrates, and other thermal management applications in AI and HPC systems.

What are the main advantages of COHR's diamond-silicon carbide composite?

The material offers twice the thermal performance of copper, matches silicon's thermal expansion, is corrosion-resistant, electrically insulating, and compatible with direct liquid cooling systems.

How does Coherent's new material address AI and HPC cooling challenges?

The material's superior thermal conductivity and compatibility with modern cooling systems enables more reliable operation, longer component lifetimes, and significantly lower cooling costs in AI and HPC applications.