CREDO TECHNOLOGY GROUP HOLDING Stock Price, News & Analysis

Credo Technology Group (Nasdaq: CRDO) reported Q2 FY2026 revenue of $268.0M, up 20.2% sequentially and 272.1% year‑over‑year. GAAP gross margin was 67.5% (non‑GAAP 67.7%). GAAP net income was $82.6M (GAAP diluted EPS $0.44); non‑GAAP net income was $127.8M (non‑GAAP diluted EPS $0.67). Ending cash and short‑term investments were $813.6M.

Company provided Q3 FY2026 guidance: revenue of $335.0M–$345.0M, GAAP gross margin 63.8%–65.8% (non‑GAAP 64.0%–66.0%), and GAAP operating expenses of $116.0M–$120.0M (non‑GAAP $68.0M–$72.0M). Management cited product ramps (ZeroFlap Optics, ALCs, OmniConnect) supporting continued growth.

Credo Technology Group (NASDAQ: CRDO) announced a license agreement with The Siemon Company covering Credo's patents for its active electrical cable technology.

Executives from both companies said they are pleased to have reached the agreement. The companies did not disclose financial terms or other commercial details; the terms remain confidential.

Credo (NASDAQ: CRDO) President and CEO Bill Brennan was appointed to the Axiado Board of Directors on November 18, 2025. Brennan brings over 25 years of semiconductor and connectivity leadership and was elected to the Global Semiconductor Alliance board in July 2025.

Axiado cited Brennan’s expertise in cloud infrastructure, AI data centers, and hyperscale networking as strategic to advancing its Trusted Control/Compute Unit (TCU) platform security and system management efforts for data center, 5G, and networking applications.

Credo (NASDAQ: CRDO) will host a conference call on Monday, December 1, 2025 at 2:00 p.m. PT to discuss fiscal second quarter results for the period ended November 1, 2025. The company said the related earnings release will be issued after market close on December 1, 2025.

Interested parties may join by dialing 800-715-9871 (U.S. toll-free) or +1 646-307-1963 (international) using conference ID 5251802. A live webcast and replay will be available at http://investors.credosemi.com/. Participants are advised to dial in at least 10 minutes before the start time.

Credo (NASDAQ: CRDO) unveiled Weaver, the first product in its OmniConnect family: a memory fanout gearbox aimed at easing AI inference memory bottlenecks. Weaver uses 112G VSR SerDes and Credo proprietary design to increase I/O density up to 10x and enable up to 6.4TB memory and 16TB/s bandwidth with LPDDR5X. The OmniConnect 112G VSR interface is available for design-in now, and Weaver is scheduled for availability in 2H 2026. Weaver supports flexible DRAM packaging, late binding, telemetry/diagnostics, and is positioned for migration to next-gen memory protocols. Register for Credo’s webinar on Nov 10, 2025 to learn more.

Credo (NASDAQ: CRDO) appointed Brian Kelleher to its Board of Directors as an Independent Director, effective October 27, 2025. Kelleher is a former Senior Vice President of GPU Engineering at NVIDIA (2005–2024) with decades of experience in semiconductor design and AI systems.

Lip-Bu Tan resigned from the board, effective October 23, 2025. Credo said Kelleher’s background in general-purpose GPU computing and accelerated computing engineering aligns with its focus on high-speed, energy-efficient connectivity for AI networks.

xMEMS (CRDO) closed a $21 million Series D led by Boardman Bay Capital Management on October 30, 2025 to accelerate mass production and global commercialization of its piezoMEMS technologies for AI-enabled consumer devices.

The company highlighted two flagship product families—Sycamore, a thinnest high-fidelity MEMS loudspeaker, and µCooling, a chip-scale solid-state air-moving solution—and said the funding will expand manufacturing, deepen OEM partnerships, and continue R&D. xMEMS cited >250 granted patents and recent industry awards as evidence of commercial momentum.

Credo (NASDAQ: CRDO) joined the Arm Total Design ecosystem on October 14, 2025 to integrate Credo’s SerDes and mixed-signal DSP IP, including SerDes chiplets, with Arm Neoverse compute subsystems.

This collaboration aims to speed design of custom silicon for next‑generation AI, cloud and hyperscale data center applications by combining high‑speed connectivity IP (28G–224G signaling; LR+/LR/MR/VSR reach) with Arm processor building blocks for low‑power, high‑performance infrastructure and chiplet‑based MCM/2.5D designs.

Credo (NASDAQ: CRDO) will showcase high-speed connectivity solutions for AI infrastructure at the 2025 OCP Global Summit in San Jose, Oct 13-16.

At Booth B23 Credo will demo ZeroFlap optical modules and 1.6T AECs, Rubin rack assemblies, 224Gbps Bluebird DSPs, Lark 850 DSPs, Toucan PCIe Gen6 retimers, and the PILOT telemetry platform. Executive and expo presentations on Oct 14 include “The Path to Zero Flap” (1:15 p.m.) and an AEC session (4:20 p.m.). Meeting and demo requests via sales@credosemi.com.