Dupont De Nemours Inc Stock Price, News & Analysis

DuPont (NYSE: DD) and Zhen Ding Technology Group have signed a strategic cooperation agreement to advance printed circuit board (PCB) technology development. The partnership aims to enhance end-user applications, advance R&D, improve material performance, and promote sustainable development in the electronics sector. The companies will collaborate on smart manufacturing, corporate governance, and sustainability initiatives. DuPont, a leader in advanced interconnects and thermal management, will leverage its expertise in chip fabrication and packaging solutions, while Zhen Ding contributes its technical expertise in the global PCB industry.

DuPont (NYSE:DD) will showcase advanced circuit materials at the 2024 TPCA Show in Taipei from October 23-25. Located at Booth #K409, DuPont will present solutions for fine line applications, advanced packaging, signal integrity, and thermal management. A session titled "Shaping Our Future with AI by Next-Gen Substrate and Packaging" will be held at the IMPACT Conference, featuring speakers from industry leaders like Taiwan Semiconductor Manufacturing Company and Samsung Electronics. Key innovations include bump plating technology for HBM and 2.5D/3D packaging and a novel seed layer method for glass substrates using a polymer-based adhesion promoter. These advancements aim to enhance AI functionalities by improving data computation and transfer speed and reliability. DuPont's participation emphasizes themes of fine line technology, advanced packaging, and signal integrity & thermal management, important for AI applications.

DuPont (NYSE: DD) has announced its schedule for the release of third quarter 2024 financial results. The company will disclose its earnings at 6:00 a.m. ET on Tuesday, November 5, 2024, followed by a conference call at 8:00 a.m. ET on the same day. Investors and interested parties can access the live webcast of the event through DuPont's Investors Relations webpage.

For those who prefer to join via phone, the dial-in number is 888-440-4172 (toll-free within the U.S.) or +1-646-960-0673, with the conference ID 5994046. Following the live event, a replay of the call, along with the earnings release and supporting materials, will be made available on the company's website for future reference.

DuPont (NYSE: DD) has announced a regular quarterly dividend on its common stock. The company's Board of Directors has declared a dividend of $0.38 per share on the outstanding Common Stock (par value $0.01 per share). This dividend will be payable on December 16, 2024, to shareholders of record at the close of business on November 29, 2024.

DuPont (NYSE: DD) and Aero Tec Laboratories (ATL) have announced a collaboration to innovate the racing industry, starting with a new fuel bladder for Formula One cars. Utilizing DuPont™ Kevlar® EXO™, first introduced in April 2023 for body armor, the fuel bladder offers superior impact and abrasion resistance, reducing weight by over 20% while meeting FIA standards. ATL CEO Giles Dawson emphasized the groundbreaking nature of Kevlar® EXO™. The partnership aims to expand these innovations to other racing sectors like NASCAR, IndyCar, and Le Mans.

DuPont (NYSE:DD) has announced the appointment of two technology leaders, Dr. Deyan Wang and Nicholas Sands, as DuPont Laureates, the company's highest technical designation. This recognition is based on their significant contributions to DuPont's business success and innovation leadership.

Dr. Wang, from DuPont Electronics & Industrial, has a 30-year career in the electronic materials industry. He has created three revolutionary technology platforms and holds over 58 U.S. patents. Nicholas Sands, from DuPont Water & Protection, is an expert in Automation & Process Control with a 34-year career. He has contributed to over $1 billion in capital projects and played a key role in developing industry standards for Alarm Management.

Both laureates have demonstrated exceptional technical and business leadership, translating their knowledge into significant impacts for global customers and driving innovation across various industries.

DuPont (NYSE:DD) has filed a complaint with the United States International Trade Commission (ITC) against Xiamen Dangsheng New Materials, Jiangsu Qingyun New Materials, and their affiliates. The complaint aims to block the importation of products that infringe on DuPont's intellectual property related to its Tyvek® brand and products.

DuPont is requesting the ITC to investigate its claims and issue a general exclusion order to bar the importation of any infringing materials into the United States. This would include all applications where the infringing material is imported as a stand-alone product or incorporated into a converted or finished good.

The company emphasizes its commitment to defending its proprietary technology advancements, supporting its scientists, and protecting customers who rely on Tyvek® products for critical applications. DuPont states it will pursue all available enforcement options in the U.S. and other global jurisdictions to ensure fair competition and protect its IP rights.

DuPont (NYSE: DD) has nearly doubled its photoresist production capacity at the Sasakami Site in Agano-shi, Niigata, Japan with the opening of the new East Star Building. The expansion, celebrated on October 3, 2024, features state-of-the-art cleanrooms with ISO Class 10 to 1000 standards and advanced automation systems. This growth strategy aims to meet increasing global demand for photoresists and provide stable supply for customers.

The Sasakami site, established in 1983, manufactures photoresists for microlithography and metallization chemicals for plating applications. With this expansion, DuPont expects to create over 50 new local jobs in R&D, engineering, quality, manufacturing, and other roles in the coming years.

DuPont (NYSE: DD) announced the winners of its inaugural Tyvek® Sustainable Healthcare Packaging Awards during the virtual Medical Packaging Conference. The awards recognize excellence in healthcare packaging initiatives using Tyvek® material to promote sustainability innovation. Winners in three categories are:

1. Packaging (re)design: PAXXUS for StreamTwo® pouch with Tyvek®, requiring 50% less energy to manufacture.
2. Operational efficiencies: Shawpak for their rotary thermoformer, optimizing energy efficiency and reducing waste.
3. Sustainability in-use: Flexform Inc. for their high-powered digital UV laser system for marking Tyvek® 2FS material without consumables.

The awards program aligns with DuPont's commitment to achieving net-zero carbon emissions by 2050 and its progress in reducing Scope 1, 2, and 3 emissions. DuPont's Tyvek® facilities in Luxembourg and Richmond, Virginia, have received ISCC PLUS certifications and source 100% of their electricity from renewable energy certificates.