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Dai Nippon Printing Co., Ltd. (DNP) has developed a new interposer, a high-performance device that connects multiple chips, set to enhance next-generation semiconductor packaging. This innovation addresses the challenges of increased wiring resistance and insulation degradation. Participating in the JOINT2 consortium, DNP is targeting mass production by 2024, focusing on improving semiconductor functionality. This move aligns with the industry’s push for higher density chip integration, aiming to overcome the limitations of traditional miniaturization processes.
Dai Nippon Printing Co., Ltd. (DNP, Tokyo: 7912) has signed an agreement with Ingram Content Group’s Lightning Source LLC to expand Ingram’s Global Connect program into Japan. This partnership enables rapid access to print-on-demand services for books in local markets, enhancing sales opportunities for publishers and retailers. DNP will provide works via its bookstore EC website, allowing Japanese consumers to purchase a diverse range of books, including those from Latin America and Asia. This agreement aims to meet domestic consumer needs and grow DNP's publishing business.
Dai Nippon Printing Co., Ltd. (DNP) has developed an advanced lead frame technology for semiconductor chips, achieving the highest MSL 1 ranking for moisture sensitivity. This innovative lead frame enhances reliability and adhesion through improved surface roughening methods. DNP plans to propose this technology to post-processing manufacturers and aims to double production capacity by FY 2023 compared to FY 2020.
DNP is a leader in printing solutions and microfabrication, holding a top market share in optical films and photomasks for semiconductors.
Dai Nippon Printing Co., Ltd. (DNP) has developed a new Reflect Array designed to enhance the coverage area of 5G mobile communications by effectively reflecting millimeter waves. This innovative product offers targeted reflection capabilities, allowing for flexible installation in challenging environments, such as areas shadowed by buildings. The Reflect Array is more cost-effective than traditional base stations, requires no power source, and can significantly improve communication conditions. DNP aims to commercialize this product in FY 2023, partnering with various telecommunications companies.