ShunYun Technology and Enablence Technologies Announce Volume Strategic OSAT Agreement

Rhea-AI Summary

Enablence Technologies (TSXV: ENA / ticker ENAFF) announced a strategic volume OSAT partnership with ShunYun Technology (SYT) to manufacture Enablence optical assemblies and modules for North America. The deal aims to ramp production capacity to meet rising AI datacenter, telecom, and sensing demand, citing a market forecast above $40 billion by 2035 and North America representing about 37% of the market.

The collaboration combines Enablence planar lightwave circuit technology with SYT's high-volume packaging and assembly capabilities to improve supply-chain predictability for U.S. customers.

Positive

• Strategic OSAT agreement to ramp volume manufacturing for North America
• Aligns Enablence PLC chips with SYT's high-volume optical packaging expertise
• Targets fast-growing AI datacenter demand in a market forecasted >$40 billion by 2035
• North America exposure of ~37% of target market supports regional revenue opportunity

Negative

• None.

Enablence Ramps Capacity to Expand North American Optical Assemblies and Module Business

Fremont, California--(Newsfile Corp. - March 10, 2026) - ShunYun Technology Ltd. (SYT), a leading manufacturer of optical transceivers, and Enablence Technologies Inc. (TSXV: ENA), a leading supplier of planar lightwave circuit (PLC) optical products for datacom, telecom, AI, and advanced vision applications, today announced a strategic OSAT partnership for volume manufacturing of Enablence Technologies' optical products.

Enablence Technologies continues to expand its worldwide production capacity to support growing demand for its communications, sensing, and compute products. A major growth driver for the Company is its North American optical assembly and module business, which is expanding rapidly as U.S. customers seek increased supply-chain predictability.

Optical assemblies and modules have become critical to rapidly growing AI Datacenter space creating a backbone that enables AI, cloud computing, and high-density networking to scale rapidly. By delivering high-speed, low-latency connectivity with far greater power efficiency than traditional electrical or power-hungry active alternatives, they are not just supporting AI infrastructure-they have become crucial to addressing power, space, and cooling constraints in AI datacenters. The optical assemblies and module business is a fast-growing market opportunity, with industry analysts forecasting the market to exceed $40 billion by 2035. North America currently represents approximately 37% of the market powered by increased investments in computing infrastructure and AI applications by cloud leader like Google, Meta, Microsoft, and Amazon.

"We are pleased to partner with SYT, a proven global high-volume manufacturer of optical transceiver modules," said Todd Haugen, CEO of Enablence Technologies. "The partnership combines Enablence proven planar lightwave optics chips and integrated photonics technology with SYT's proven module manufacturing and packaging processes. This exciting new partnership will help us ramp production of high-quality optics products for our growing North American customer base."

"We are pleased to partner with Enablence Technologies to accelerate the growth of optical assemblies and optical module solutions," said Mike He, General Manager of SYT. "By combining Enablence's proven leadership in PLC technology with our advanced optical packaging and assembly expertise, this collaboration creates a powerful platform for delivering next-generation optical solutions to the market. The partnership with Enablence also aligns with our ongoing investments in key optical module technologies, including co-packaged optics (CPO), optical transceivers, optical engines, and advanced optical packaging and assembly to meet the increased demands of AI, cloud, and next-generation data center infrastructure."

About ShunYun Technology (SYT)

Founded in 1991, ShunYun Technology is a world-class manufacturer of optical transceiver modules and a subsidiary of Shunsin Group and Foxconn. The company operates manufacturing facilities in Hanoi City and Bac Giang City, Vietnam, and Zhongshan City, China, with a branch office in Taiwan. SYT partners with leading global technology companies across North America, Asia, and Europe.

About Enablence Technologies

Enablence Technologies Inc. is a publicly traded company listed on the TSX Venture Exchange (TSXV: ENA). The Company designs, manufactures, and sells optical components, primarily in the form of planar Lightwave circuits (PLC), artificial intelligence (AI) and LiDAR technologies on silicon-based chips. Enablence products support a broad range of customers in the multi-billion, datacenter, telecom, automotive, and industrial automation industries. Enablence operates a wafer fab in Fremont, California, with design centers in Asia and North America supported by sales and marketing operations worldwide.

Contact:

Media & Analysts
Alison Parnell
408-590-0137
press@hillandkincaid.com

Investors
Todd Haugen, CEO Enablence Technologies
+1 510-226-8900
Todd.haugen@enablence.com

Ali Mahdavi
Capital Markets & Investor Relations
am@spinnakercmi.com

Cautionary Note Regarding Forward-Looking Information

This news release contains forward-looking statements regarding the Company based on current expectations and assumptions of management, which involve known and unknown risks and uncertainties associated with our business and the economic environment in which the business operates. All such statements are forward-looking statements under applicable Canadian securities legislation. Any statements contained herein that are not statements of historical facts may be deemed to be forward-looking statements. By their nature, forward-looking statements require us to make assumptions and are subject to inherent risks and uncertainties. These statements are based on current expectations and assumptions, including the impact of the Term Loan, the Vortex Loan Amendment and the Pinnacle I Loan Amendment, the ability of the Company to repay any indebtedness, the ability of the Company to continue its operations as contemplated, the use of proceeds from the Term Loan and the Pinnacle I Loan Amendment, and the receipt of final approval from the TSX Venture Exchange for the Term Loan, Vortex Loan Amendment and the Pinnacle I Loan Amendment. These statements are not guarantees of performance and involve known and unknown risks, uncertainties and other factors that may cause actual results or events to differ materially from those anticipated in such forward-looking statements, including risks, including the ability of the Company to comply with covenants under the Loan Agreement and all other loan agreements and facilities the Company and its subsidiaries are subject to, risks relating to the Company's operations, business and economic conditions generally, the terms and availability of future financing and the ability of the Company to repay any indebtedness in accordance with the terms thereof (or at all). Although the Company believes that the expectations reflected in the forward-looking statements contained in this news release, and the assumptions on which such forward- looking statements are made, are reasonable based on the information available as of the date hereof, there can be no assurance that such expectations or assumptions will prove to be correct. The Company cautions readers of this news release not to place undue reliance on the forward-looking statements contained herein as many factors could cause actual results or conditions to differ materially from current expectations. Additional information on these and other risk factors that could affect the Company's operations are outlined in the Company's continuous disclosure documents that can be found on SEDAR+ (www.sedarplus.ca) under Enablence's issuer profile. Enablence does not intend and disclaims any obligation, except as required by law, to update or revise any forward- looking statements, whether because of new information, future events, or otherwise.

Neither TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release. No stock exchange, securities commission, or other regulatory authority has approved or disapproved the information contained herein.

To view the source version of this press release, please visit https://www.newsfilecorp.com/release/287909

FAQ

What does the Enablence (ENAFF) OSAT agreement with ShunYun Technology mean for production capacity?

It means Enablence will ramp volume manufacturing capacity in North America through SYT partnership. According to Enablence, the collaboration pairs its planar lightwave circuit chips with SYT's high-volume module packaging to boost output for U.S. customers.

How will the ENAFF and SYT partnership affect Enablence's ability to serve AI datacenter customers?

The partnership should accelerate supply of optical assemblies and modules to AI datacenters. According to Enablence, combining PLC technology with SYT packaging aims to deliver higher-volume, power-efficient optics for AI, cloud, and high-density networking needs.

Does the announcement specify market size or regional exposure for Enablence's optical module business?

Yes. The announcement cites an industry forecast of more than $40 billion by 2035 and notes North America represents about 37% of the market. According to Enablence, this underpins the regional focus for the production ramp.

What manufacturing locations are involved in the Enablence and ShunYun collaboration?

The agreement leverages ShunYun's high-volume manufacturing footprint and Enablence's Fremont wafer fab and design centers. According to Enablence, SYT operates manufacturing in Vietnam and China and will support North American assembly demand.

Will the ENAFF strategic OSAT deal improve supply-chain predictability for U.S. customers?

The announcement presents the partnership as intended to improve supply-chain predictability for U.S. customers. According to Enablence, using SYT's proven module manufacturing and packaging processes aims to increase reliability and volume availability.