Flex Showcases Scalable Power Solutions for Next-Generation AI Infrastructure at COMPUTEX 2026
Rhea-AI Summary
Flex (FLEX) announced new scalable power solutions for next-generation AI data centers at COMPUTEX 2026. The portfolio additions include a 110 kW power shelf for NVIDIA Vera Rubin NVL72 platforms, a 30 kW capacitive energy storage system (CESS), and the BMR317 intermediate bus converter.
The 110 kW power shelf enables modular rack-level power distribution and supports future 800 VDC architectures. The 30 kW CESS improves power quality for dynamic AI workloads across AC and 800 VDC environments, while BMR317 targets high-density compute platforms such as accelerator cards, servers and xPU systems.
AI-generated analysis. Not financial advice.
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Key Figures
Market Reality Check
Peers on Argus
FLEX fell 1.84% while peers were mostly positive: JBL up 1.4%, CLS up 10.87%, TEL and GLW modestly higher, and FN down 0.88%. Momentum scanners flagged TTMI and CLS moving up, underscoring that FLEX’s weakness diverged from several related names.
Previous AI Reports
| Date | Event | Sentiment | Move | Catalyst |
|---|---|---|---|---|
| Mar 16 | AI factory designs | Positive | +1.5% | New NVIDIA Omniverse DSX reference designs to speed AI factory deployment. |
| Oct 28 | NVIDIA collaboration | Positive | -0.6% | Collaboration with NVIDIA to accelerate modular, energy-efficient AI factories. |
| Oct 13 | AI platform launch | Positive | +4.0% | Launch of integrated AI infrastructure platform targeting faster giga-scale deployment. |
| Aug 04 | AI power shelf | Positive | -0.8% | New power shelf for NVIDIA GB300 NVL72 with high efficiency and 800 VDC focus. |
| Jun 05 | AI research tie-up | Positive | -0.5% | Collaboration with MIT to advance manufacturing using AI and automation. |
AI-related announcements have generally been positive in tone but produced mixed price reactions, with several instances of slight declines or modest gains rather than consistent upside.
This announcement extends Flex’s AI power and infrastructure story, adding a 110 kW power shelf, 30 kW capacitive energy storage and new bus converters to earlier 800 VDC and NVIDIA-focused initiatives. Prior AI releases on modular AI factories, NVIDIA collaborations, and advanced power shelves around 800 VDC and giga-scale deployments saw small positive and negative moves, indicating that similar strategic updates have not always produced strong, uniform price reactions.
Historical Comparison
Past AI-tagged news for FLEX saw an average move of about 0.7%, whereas this AI power portfolio update came as shares were down 1.84%, marking a weaker-than-typical reaction versus prior AI headlines.
AI-tagged history shows a steady build-out: from collaborations on giga-scale AI factories and 800 VDC infrastructure, to NVIDIA-specific power shelves and integrated platforms. This new 110 kW shelf, 30 kW CESS and bus converter deepen that progression into rack-level and chip-level AI power delivery.
Market Pulse Summary
This announcement expands Flex’s AI infrastructure capabilities with a 110 kW power shelf for NVIDIA Vera Rubin NVL72 platforms, a 30 kW capacitive energy storage system, and the BMR317 bus converter, all aligned to future 800 VDC architectures. In context of prior AI factory and NVIDIA collaborations, it reinforces Flex’s role in rack- and chip-level power delivery. Investors may watch adoption across AI data centers and updates around the planned CPI spin-off.
Key Terms
intermediate bus converter technical
battery energy storage systems (BESS) technical
800 vdc technical
AI-generated analysis. Not financial advice.
New power shelf for NVIDIA Vera Rubin NVL72 platforms, 30 kW capacitive energy storage system and power modules advance the transition to 800 VDC power architectures
News summary
- 110 kW power shelf supports scalable power distribution for NVIDIA Vera Rubin NVL72 platforms and future high-density AI rack architectures
- 30 kW capacitive energy storage system (CESS) helps smooth dynamic AI workloads and improve power quality across traditional AC and emerging 800 VDC environments
- BMR317 intermediate bus converter extends Flex's chip-level power portfolio with compact, high-efficiency power modules for high-density compute platforms
As AI deployments continue driving unprecedented increases in rack power density and infrastructure complexity, Flex's latest power innovations are designed to improve efficiency, power quality, scalability and performance across AI data center environments. The solutions also support the industry's transition toward future 800 VDC architectures.
"The rapid growth of AI is driving new demands on data center power infrastructure, from rack-scale distribution to processor-level power delivery," said Chris Butler, President, Embedded and Critical Power, Flex. "At COMPUTEX 2026, we are showcasing how Flex helps customers scale AI infrastructure more efficiently with high-density power solutions designed for performance, quality, and efficiency."
The new 110 kW power shelf is designed to support NVIDIA Vera Rubin NVL72 platforms and other high-density AI environments. The solution enables modular rack-level power distribution and power disaggregation, helping customers maximize GPU density and infrastructure efficiency within the IT rack. Designed as a building block for future 800 VDC deployments, the power shelf supports scalable AI factory architectures while simplifying rack power management.
Flex will also showcase a new 30 kW CESS designed to improve power quality and stabilize highly dynamic AI workloads. Compatible with both traditional AC and emerging 800 VDC environments, the rack-integrated solution works alongside battery energy storage systems (BESS) and UPS architectures to help smooth transient AI power demands and improve infrastructure resiliency. The system supports both 19-inch and 21-inch rack configurations, enabling deployment flexibility across modern AI data centers.
To extend its AI power portfolio to high-density compute platforms, Flex also introduced the BMR317 intermediate bus converter, a compact, high-efficiency power module designed to support fast, dynamic AI processor loads in accelerator cards, servers and xPU platforms.
The new products join Flex's Cloud and Power Infrastructure portfolio, which enables customers to build and scale the products and digital infrastructure powering the world's most demanding AI workloads. Additional information about Flex's power portfolio is available here: https://flex.com/industries/data-center#power
About Flex
Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps leading brands design, build, and manage products that improve the world. With a global footprint spanning 30 countries, Flex delivers advanced manufacturing and supply chain solutions, innovative products and technology, and lifecycle services that support customers from concept to scale. In the AI era, Flex is helping customers accelerate data center deployment by solving power, heat, and scale challenges through cutting-edge power and cooling technology and scalable IT infrastructure solutions.
For information about Flex's intent to spin off its Cloud and Power Infrastructure portfolio, visit: https://flex.com/transaction-resources
Media contacts
Media & Press
Christie Haber
Senior Director, Commercial Marketing
(602) 245-1057
press@flex.com
Investors & Analysts
Michelle Simmons
Senior Vice President, Global Investor Relations and Public Relations
(669) 242-6332
Michelle.Simmons@flex.com
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SOURCE Flex