SK hynix Enhances Leadership in Graphics Memory With Introduction of Industry's Best GDDR7
Rhea-AI Summary
SK hynix has unveiled GDDR7, the industry's best-performing graphics memory product. Key features include:
1. 60% speed improvement (32Gbps, up to 40Gbps) over previous generation
2. 50% better power efficiency
3. Ability to process 1.5TB per second (300 Full-HD movies) when used in high-end graphics cards
4. 74% reduction in thermal resistance through new packaging technology
5. Mass production to start in Q3 2024
GDDR7 is expected to be adopted in 3D graphics, AI, high-performance computing, and autonomous driving. This development strengthens SK hynix's position as a leading AI memory solution provider.
Positive
- 60% speed improvement in GDDR7 compared to previous generation
- 50% better power efficiency in GDDR7
- Ability to process 1.5TB of data per second with high-end graphics cards
- 74% reduction in thermal resistance through new packaging technology
- Expansion into AI, high-performance computing, and autonomous driving markets
Negative
- None.
- Industry's best-performing graphics memory with improvement of
60% in speed,50% in power efficiency to be mass produced in 3Q24 - GDDR7 processes data equivalent to 300 Full-HD movies in a second when combined with high-end graphics card
- AI, high-performance computing, autonomous vehicles expected to adopt GDDR7
* Graphics DDR(GDDR): a standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly. Its generation has shifted from GDDR3, GDDR5, GDDR5X, GDDR6 to GDDR7. With the newer generation promising faster speed and higher power efficiency, GDDR has now become one of the most popular memory chips for AI
The development of GDDR7 in March comes amid growing interest by global customers in the AI space in the DRAM product that meets both specialized performance for graphics processing and fast speed. The company said that it will start volume production in the third quarter.
The new product comes with the operating speed of 32Gbps, a
SK hynix also improved power efficiency by more than
The company increased the layer number of the heat-dissipating substrates from four to six, while applying the EMC** for the packaging material in a bid to reduce thermal resistance*** by
** Epoxy Molding Compound (EMC): an essential material for semiconductor packaging that protects chips from various external conditions such as water, heat, shock and charge by sealing them
*** Thermal Resistance: a measurement of a material's resistance to heat transfer that is expressed in the temperature generated by a watt. A lower thermal resistance means better heat-dissipation efficiency as heat is dissipated more easily when a different temperature is applied.
Sangkwon Lee, Head of DRAM Product Planning & Enablement at SK hynix, said that GDDR7 is expected to be adopted by a wider range of applications such as high-specification 3D graphics, AI, high-performance computing and autonomous driving.
"We will continue to work towards enhancing our position as the most trusted AI memory solution provider by strengthening the premium memory lineup further," Lee said.
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.