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Infineon Technologies AG (IFNNY) reports semiconductor developments across power, sensing, microcontroller, connectivity and embedded-security markets. News about the company commonly covers gallium nitride and silicon carbide power technology, motor-control systems, XENSIV and REAL3 sensing components, PSOC and AURIX microcontrollers, OPTIGA Trust M security controllers, and applications in humanoid robotics, AI data-center power infrastructure, edge AI, smart access and industrial automation.
Company updates also include technology collaborations, startup and co-innovation programs, product demonstrations, portfolio extensions and intellectual-property proceedings involving semiconductor patents. These items reflect Infineon’s role as a supplier of components and system technologies used in energy-efficient power systems, secure connected devices and advanced automation platforms.
Infineon Technologies AG (IFNNY) has entered into a definitive agreement to acquire Marvell Technology's Automotive Ethernet business for US$2.5 billion in cash. The acquisition strengthens Infineon's position as the global leader in automotive semiconductors and enhances its capabilities for software-defined vehicles.
The acquired business is expected to generate revenue of US$225-250 million in calendar year 2025 with a gross margin of around 60%. Marvell's Brightlane™ Automotive Ethernet portfolio includes PHY transceivers, switches, and bridges supporting network data rates up to 10 Gbps. The business serves over 50 automotive manufacturers and has a design-win pipeline of approximately US$4 billion until 2030.
The all-cash transaction will be financed through existing liquidity and additional debt, with closing expected within calendar year 2025, subject to regulatory approvals.
Deutsche Bank (DB) has been appointed as the successor depositary bank for Infineon Technologies AG's (OTC: IFNNY) sponsored American Depositary Receipt Program, effective April 1, 2025. Infineon Technologies, a global semiconductor leader in power systems and IoT focusing on decarbonization and digitalization, reported revenue of approximately €15 billion in fiscal year 2024 with 58,060 employees worldwide.
The Level I ADR program features a 1:1 ratio between ADS and ordinary shares, trading on the OTC market under symbol IFNNY. The program includes DTC eligibility and Deutsche Bank AG (Frankfurt) serving as the custodian bank.
SkyWater Technology (SKYT) has agreed to acquire Infineon Technologies' 200mm fab (Fab 25) in Austin, Texas, along with establishing a long-term supply agreement. The facility will operate as a foundry, producing critical chips for industrial, automotive, and defense applications on 130nm to 65nm nodes.
The acquisition will significantly expand SkyWater's foundry capabilities, adding 65nm infrastructure, enhanced copper processing, and high-voltage BCD technology. The deal includes transferring nearly 1,000 Fab 25 employees to SkyWater and maintains Infineon's strong U.S. manufacturing presence.
The facility currently produces up to one billion semiconductor chips annually. This strategic partnership aims to strengthen the U.S. domestic semiconductor supply chain and enhance manufacturing capacity for foundational chips. The transaction, pending regulatory approval, will transition Fab 25's business model from Integrated Device Manufacturer (IDM) to foundry, serving a broader customer base.
Teradyne (NASDAQ:TER) and Infineon Technologies have announced a strategic partnership to advance power semiconductor testing. The agreement includes Teradyne's acquisition of Infineon's automated test equipment team in Regensburg, Germany, comprising 80 employees.
Through this partnership, Teradyne will enhance its ETS product portfolio and accelerate its roadmap in the power semiconductor segment. The acquisition provides mutual benefits: Teradyne gains additional resources and expertise while collaborating with a key market leader, while Infineon secures continued manufacturing support and enhanced flexibility for specialized test equipment needs.
The partnership will focus on advancing test capabilities for new technologies like silicon carbide and gallium nitride, addressing dynamic test challenges at scale. Teradyne has committed to maintaining and building upon the capabilities of the Regensburg team as part of its Power Semiconductor business unit.
RS has released DesignSpark PCB version 12, a significant upgrade to its PCB design software, backed by Infineon Technologies. The new version introduces enhanced features for both free and paid subscription plans, building upon its existing platform that serves a 1.4-million-member community. Key improvements include pre-plot checks, new edit component options for high-pin footprints, angular precision settings, dual measurement units, and advanced Design Rule Check options.
The software, which has been providing professional-grade PCB design tools since 2010, maintains its user-friendly interface while adding capabilities like project-specific libraries, improved reference design conversion, and enhanced component management features. Infineon's support particularly strengthens the software's position in industrial automation and automotive industries.
Infineon Technologies has won the German Sustainability Award 2025 in the Electrical Engineering and Electronics category, recognized for its leading role in sustainability transformation. The company has made significant progress in its decarbonization strategy, reducing emissions by over two-thirds while nearly doubling revenue since 2020, targeting climate neutrality by 2030.
As an industry pioneer, Infineon now reports Product Carbon Footprint data for half of its products. A notable innovation is their new energy-saving silicon carbide module, which enhances efficiency in solar and wind power plants, train drives, and large machinery. A single electric locomotive using this system saves approximately 300 megawatt hours annually, equivalent to 100 homes' energy needs.
Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) has developed the world's first 300 mm power gallium nitride (GaN) wafer technology, a groundbreaking achievement in high-volume manufacturing. This innovation will significantly drive the GaN-based power semiconductor market, offering 2.3 times more chips per wafer compared to 200 mm wafers.
GaN semiconductors are rapidly adopted in various applications, including AI systems, solar inverters, and motor-control systems. The 300 mm manufacturing process ensures improved device performance, efficiency, and customer supply stability. Infineon's success leverages existing 300 mm silicon production competencies, allowing for accelerated implementation and efficient capital use.
This breakthrough positions Infineon to shape the growing GaN market, estimated to reach several billion US-Dollars by the end of the decade. The company aims to achieve cost parity between GaN and silicon products, supporting its mission of decarbonization and digitalization.
Infineon Technologies AG and Amkor Technology, Inc. have signed a Memorandum of Understanding to promote decarbonization and sustainability across their supply chain. This partnership aims to:
- Engage with common suppliers to develop effective decarbonization strategies
- Identify areas for improvement in emissions reduction
- Support suppliers in setting science-based targets
- Provide guidance and track progress for continuous improvement
The collaboration expands on their existing Outsourced Semiconductor Assembly and Test (OSAT) relationship and aligns with both companies' sustainability goals. Infineon aims to become CO2-neutral for scope 1 and 2 by 2030, while Amkor targets net-zero emissions by 2050.
Cooler Master has expanded its partnership with Infineon Technologies AG to introduce the X series high-wattage power supplies. These new PSUs, ranging from 850W to 2000W, are designed for high-performance gaming, AI, and industrial applications. The collaboration combines Cooler Master's thermal and power design expertise with Infineon's advanced semiconductor technology.
Key products include the X Silent Series (industry's first 850W/1100W fanless PSUs), MAX Platinum 1300W, and X Mighty Platinum Series 2000W. These PSUs feature advanced thermal management, high conversion efficiency, silent performance, and digital monitoring capabilities. The partnership aims to meet evolving customer needs and drive decarbonization in high-performance computing.
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