Accelsius Brings NeuCool™ to Equinix’s Co-Innovation Facility in Ashburn
Accelsius announced the deployment of its NeuCool™ IR80 cooling system at Equinix's Co-Innovation Facility in Ashburn's DC15 IBX data center during Q3 2025. The collaboration aims to showcase Accelsius's two-phase, direct-to-chip cooling technology in real-world scenarios.
The system offers significant advantages, including the ability to operate with 6-8°C warmer inlet water temperatures compared to alternatives, resulting in increased free cooling and reduced reliance on energy-intensive compressors. The technology, developed under ARPA-E's COOLERCHIPS program, targets reducing cooling energy usage to below 5% of data center IT load. The solution's non-conductive dielectric fluid provides enhanced protection for valuable GPU assets.
Accelsius ha annunciato l'installazione del suo sistema di raffreddamento NeuCool™ IR80 presso la Co-Innovation Facility di Equinix nel data center DC15 IBX di Ashburn nel terzo trimestre del 2025. La collaborazione mira a dimostrare la tecnologia di raffreddamento a due fasi, diretta al chip, di Accelsius in scenari reali.
Il sistema presenta vantaggi significativi, tra cui la capacità di funzionare con temperature di ingresso dell'acqua più elevate di 6-8°C rispetto alle soluzioni alternative, aumentando così il raffreddamento gratuito e riducendo la dipendenza da compressori ad alto consumo energetico. La tecnologia, sviluppata nell'ambito del programma COOLERCHIPS di ARPA-E, punta a ridurre il consumo energetico per il raffreddamento a meno del 5% del carico IT del data center. Il fluido dielettrico non conduttivo della soluzione offre una protezione migliorata per le preziose GPU.
Accelsius anunció la implementación de su sistema de enfriamiento NeuCool™ IR80 en la Co-Innovation Facility de Equinix en el centro de datos DC15 IBX de Ashburn durante el tercer trimestre de 2025. La colaboración busca demostrar la tecnología de enfriamiento directo al chip de dos fases de Accelsius en escenarios reales.
El sistema ofrece ventajas importantes, incluyendo la capacidad de operar con temperaturas de entrada de agua 6-8°C más cálidas en comparación con alternativas, lo que aumenta la refrigeración gratuita y reduce la dependencia de compresores que consumen mucha energía. La tecnología, desarrollada bajo el programa COOLERCHIPS de ARPA-E, apunta a reducir el consumo energético del enfriamiento a menos del 5% de la carga IT del centro de datos. El fluido dieléctrico no conductor de la solución proporciona una protección mejorada para los valiosos activos GPU.
Accelsius는 2025년 3분기에 애쉬번의 DC15 IBX 데이터 센터 내 Equinix의 Co-Innovation Facility에 자사의 NeuCool™ IR80 냉각 시스템을 배치했다고 발표했습니다. 이번 협업은 Accelsius의 2상 직접 칩 냉각 기술을 실제 환경에서 선보이는 것을 목표로 합니다.
이 시스템은 대안 대비 6-8°C 더 높은 입구 수온으로 작동할 수 있어 자유 냉각이 증가하고 에너지 집약적인 압축기 의존도가 줄어드는 등 큰 장점을 제공합니다. ARPA-E의 COOLERCHIPS 프로그램 하에 개발된 이 기술은 데이터 센터 IT 부하의 5% 미만으로 냉각 에너지 사용을 줄이는 것을 목표로 합니다. 비전도성 유전체 유체를 사용하는 이 솔루션은 귀중한 GPU 자산을 더욱 안전하게 보호합니다.
Accelsius a annoncé le déploiement de son système de refroidissement NeuCool™ IR80 dans la Co-Innovation Facility d'Equinix au centre de données DC15 IBX d'Ashburn au cours du 3e trimestre 2025. Cette collaboration vise à démontrer la technologie de refroidissement direct au composant en deux phases d'Accelsius dans des conditions réelles.
Le système présente des avantages notables, notamment la capacité de fonctionner avec des températures d'eau d'entrée 6 à 8°C plus élevées que les alternatives, ce qui augmente le refroidissement gratuit et réduit la dépendance aux compresseurs énergivores. La technologie, développée dans le cadre du programme COOLERCHIPS de l'ARPA-E, vise à réduire la consommation d'énergie pour le refroidissement à moins de 5 % de la charge IT du centre de données. Le fluide diélectrique non conducteur de la solution offre une protection renforcée pour les précieux GPU.
Accelsius gab die Einführung seines Kühlsystems NeuCool™ IR80 in der Co-Innovation Facility von Equinix im DC15 IBX Rechenzentrum in Ashburn im dritten Quartal 2025 bekannt. Die Zusammenarbeit zielt darauf ab, Accelsius' Zwei-Phasen-Direktchip-Kühltechnologie in realen Szenarien zu demonstrieren.
Das System bietet erhebliche Vorteile, darunter die Fähigkeit, mit 6-8°C wärmeren Zulauftemperaturen als Alternativen zu arbeiten, was zu mehr Freikühlung und weniger Abhängigkeit von energieintensiven Kompressoren führt. Die Technologie, entwickelt im Rahmen des COOLERCHIPS-Programms von ARPA-E, zielt darauf ab, den Energieverbrauch für die Kühlung auf unter 5 % der IT-Last im Rechenzentrum zu senken. Die nichtleitende dielektrische Flüssigkeit der Lösung bietet einen verbesserten Schutz für wertvolle GPU-Ressourcen.
- Technology enables 6-8°C warmer inlet water temperatures, increasing energy efficiency
- Non-conductive cooling fluid provides enhanced protection for valuable GPU assets
- Partnership with major industry player Equinix enhances market visibility
- System aims to reduce cooling energy use to below 5% of data center IT load
- None.
Insights
Accelsius' partnership with Equinix demonstrates advanced cooling technology that could significantly reduce data center energy consumption and improve GPU performance.
The partnership between Accelsius and Equinix marks a significant development in data center cooling technology. Accelsius's NeuCool™ IR80 system will be deployed at Equinix's Co-Innovation Facility in Ashburn, providing a real-world demonstration of their advanced cooling capabilities. The technology offers several notable advantages over conventional cooling methods.
The two-phase, direct-to-chip cooling solution allows for 6–8°C warmer inlet water temperatures compared to competing technologies. This temperature difference is crucial as it enables more free cooling (using ambient air rather than mechanical refrigeration) and reduces dependency on energy-intensive compressors. Data centers typically spend 30-40% of their energy on cooling, so this efficiency gain could translate to substantial operational savings.
What's particularly valuable about this deployment is the validation it provides. By implementing the technology in Equinix's facility—one of the world's leading data center providers—Accelsius gains credibility and a showcase environment for potential customers. The integration with Equinix's International Business Exchange™ (IBX®) data center in the critical Ashburn market (known as "Data Center Alley") positions this technology at the heart of internet infrastructure.
The mention of the ARPA-E's COOLERCHIPS program adds another layer of significance, as this federal initiative aims to reduce cooling energy to below 5% of a data center's IT load—an ambitious target that would revolutionize data center economics if achieved.
Most importantly, the technology addresses the growing challenge of cooling high-density hardware, particularly GPUs that are essential for AI and machine learning workloads. The use of non-conductive dielectric fluid provides an additional layer of hardware protection that could be particularly appealing for organizations deploying expensive GPU clusters.
AUSTIN, Texas, July 15, 2025 (GLOBE NEWSWIRE) -- Accelsius, a leader in advanced data center cooling solutions, announced that its proprietary NeuCool™ IR80 system will be deployed in Q3 2025 at Equinix’s Co-Innovation Facility (CIF) in the DC15 International Business Exchange™ (IBX®) data center at the Equinix Ashburn Campus. This dedicated facility provides a platform for Equinix to work with companies that are developing innovative technologies, helping customers see and experience these solutions in action.
“This kind of collaboration is a powerful way to demonstrate our technology in real-world scenarios,” said Josh Claman, CEO of Accelsius. “The key thing we’re finding with all the customers we’re talking to is making it tangible to them—helping them see it and visualize how it’s going to work for them. It’s one thing to talk about technology and capabilities in the abstract, but this shows it in real time.”
“Liquid cooling is revolutionizing how data centers cool powerful, high-density hardware,” said Pawel Wlodarczak, Innovation Director, Global Design & Construction at Equinix. “By working with companies like Accelsius in our Co-Innovation Facility we are able to help the industry continue to iterate and innovate on high density cooling solutions - such a critical aspect of the data center.”
Accelsius’ two-phase, direct-to-chip solution allows for 6–8°C warmer inlet water temperatures than other technologies. This warmer water temperature translates to significantly more free cooling and less reliance on energy-intensive compressors. This partnership brings together two companies committed to energy efficiency and was catalyzed by their shared participation in ARPA-E’s COOLERCHIPS program, which aims to reduce total cooling energy use to below
Beyond energy savings, Accelsius believes this deployment will also help showcase the benefits that two-phase, direct-to-chip cooling offers for customers’ most valuable assets—GPUs. Unlike single-phase systems, Accelsius’ dielectric fluid is non-conductive, ensuring no damage to electronics even in the rare event of a leak.
About Accelsius
Founded by Innventure, Inc. (NASDAQ:INV), Accelsius empowers data center and edge operators to achieve their business, financial and sustainability goals through advanced cooling solutions. The proprietary NeuCool platform provides best-in-class thermal efficiencies through a safe, two-phase liquid cooling system that scales from single racks to entire data centers. For more information, visit accelsius.com or follow us on LinkedIn.
Media Contact
Treble
McKenzie Covell
accelsius@treblepr.com
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