Interlink Electronics Awarded $175,000 USDA SBIR Grant to Develop AI-Powered Food Quality & Safety Monitor
Rhea-AI Summary
Interlink Electronics (NASDAQ: LINK) has secured a $175,000 SBIR Phase I grant from the USDA to develop an AI-powered food quality and safety monitoring system. The company's Gas and Environmental Solutions division will leverage its advanced electrochemical gas sensing platform and proprietary data analytics to create a system for continuous produce quality assessment and spoilage risk detection.
The technology aims to combine real-time gas detection with artificial intelligence to enable actionable interventions in food supply chains. This development positions Interlink as a key player in AI-driven environmental and agricultural monitoring, with potential for Phase II funding and future commercialization opportunities.
Positive
- Secured $175,000 USDA SBIR Phase I grant funding
- Potential for additional Phase II funding and commercialization opportunities
- Expansion into AI-driven agricultural monitoring market
- Validation of R&D roadmap through government grant success
Negative
- None.
News Market Reaction
On the day this news was published, LINK gained 2.95%, reflecting a moderate positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Validates Interlink’s Leadership in Gas Sensing, Data Intelligence, and Next-Generation Food Security Solutions
FREMONT, Calif., Sept. 09, 2025 (GLOBE NEWSWIRE) -- Interlink Electronics, Inc. (NASDAQ: LINK), a global leader in sensor technology and printed electronic solutions, today announced that its Gas and Environmental Solutions division has been awarded a
As food supply chains grow more complex, ensuring freshness and safety from farm to table has become both an economic necessity and a global public health imperative. By fusing real-time gas detection with artificial intelligence, Interlink aims to deliver a breakthrough system capable of continuously assessing produce quality, detecting spoilage risks, and enabling actionable interventions before food reaches consumers.
“This award underscores the innovation behind Interlink’s technology and our ability to deliver scalable, low-power, and cost-efficient sensors that generate the high-fidelity data AI systems require,” said Dr. Sreeni Rao, Vice President of Product Management at Interlink Electronics. “By pairing our sensors with advanced AI, we can transform raw data into intelligent insights that strengthen food security, improve safety, and reduce waste across the supply chain.”
Steven N. Bronson, Interlink’s Chairman and CEO, added: “Sensors are the ‘picks and shovels’ of the AI revolution. By integrating our sensor technologies with artificial intelligence, we are expanding Interlink’s role as a foundational enabler of AI-driven applications. This USDA award builds on our successful track record of securing government grants, validates the strength of our R&D roadmap, and advances our mission of addressing global challenges with sensor intelligence.”
The Phase I project lays the groundwork for potential Phase II funding and future commercialization, positioning Interlink at the forefront of AI-driven environmental and agricultural monitoring.
About Interlink Electronics, Inc.
Interlink Electronics is a leading provider of sensors and printed electronic solutions, boasting 40 years of success in delivering mission-critical technologies across diverse markets. Our customers, including global blue-chip companies, trust our products and solutions, which span various markets, including medical, industrial, automotive, wearables, IoT, and other specialty markets. Our expertise in materials science, manufacturing, embedded electronics, firmware, and software enables us to create custom solutions tailored to our customers’ unique needs.
We serve our international customer base from our corporate headquarters and proprietary gas sensor production and product development facility in Fremont, California (Silicon Valley area); our Global Product Development and Materials Science Center and distribution and logistics center in Camarillo, California; and our advanced printed-electronics manufacturing facilities in Shenzhen, China; Irvine, Scotland; and Barnsley, England. For more information, please visit www.InterlinkElectronics.com.
Forward Looking Statements
This release contains “forward-looking statements” within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can be generally identified by phrases such as “thinks,” “anticipates,” “believes,” “estimates,” “expects,” “intends,” “plans,” and similar words. Forward-looking statements in this press include statements about our acquisition program, our projected revenue and earnings growth, and the effects of recent acquisitions, including contributions to our products, manufacturing operations and the markets we serve. Forward-looking statements are not guarantees of future performance and are inherently subject to uncertainties and other factors which could cause actual results to differ materially from the forward-looking statement. These statements are based upon, among other things, assumptions made by, and information currently available to, management, including management’s own knowledge and assessment of the company’s industry, R&D initiatives, competition and capital requirements. Other factors and uncertainties that could affect the company’s forward-looking statements include, among other things, the following: our success in predicting new markets and the acceptance of our new products; efficient management of our infrastructure; the pace of technological developments and industry standards evolution and their effect on our target product and market choices; the effect of outsourcing technology development; changes in the ordering patterns of our customers; a decrease in the quality and/or reliability of our products; protection of our proprietary intellectual property; competition by alternative sophisticated as well as generic products; continued availability of raw materials for our products at competitive prices; disruptions in our manufacturing facilities; risks of international sales and operations including fluctuations in exchange rates; compliance with regulatory requirements applicable to our manufacturing operations; and customer concentrations. Additional factors that could cause actual results to differ materially from those anticipated by our forward-looking statements are under the captions “Risk Factors” and “Management’s Discussion and Analysis of Financial Condition and Results of Operations” in our most recent Annual Report (Form 10-K) or Quarterly Report (Form 10-Q) filed with the Securities and Exchange Commission. Forward-looking statements are made as of the date of this release, and we expressly disclaim any obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.
Company Contact:
Interlink Electronics, Inc.
Steven N. Bronson, CEO
LINK@IESensors.com
805-623-4184
Investor Relations Contact:
Gateway Group, Inc.
Matt Glover and Clay Liolios
LINK@IESensors.com
949-574-3860
FAQ
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