Interlink Electronics, Inc. reports developments tied to sensor technology and printed electronics for human-machine interface, IoT, medical, industrial, automotive, wearables, environmental monitoring and specialty applications. Recurring updates include quarterly results, customer design wins, custom piezoelectric and force-sensing resistor solutions, printed electrode work for healthcare diagnostics, and electrochemical sensor projects for food-safety and quality monitoring.
Company news also covers business development appointments, international manufacturing and product-development capabilities, capital-structure actions such as preferred stock conversion, conference presentations and strategic acquisition activity. These announcements reflect Interlink's single operating focus on designing, developing and manufacturing sensor technologies and integrated sensing systems.
Interlink Electronics reported a strong financial performance for Q3 2021, with revenue reaching $2.2 million, a 44% increase from Q3 2020. Year-to-date revenue rose 18.5% to $5.9 million, driven by heightened demand in industrial and medical sectors. Gross margin improved to 58.1%, up from 52.4% a year earlier. The company achieved an operating income of $259,000 compared to a loss of $79,000 in 2020. Net income also increased to $223,000, or $0.03 per diluted share, reflecting positive growth dynamics and a commitment to acquisitions.
Interlink Electronics closed a private placement of its newly created 8.0% Series A Convertible Preferred Stock, raising $3.0 million by selling 120,000 shares at $25.00 each. The preferred stock is convertible at $12.50 per share, with mandatory conversion if the common stock price exceeds $15.00 for 20 out of 30 trading days. Net proceeds after expenses are approximately $2.82 million, earmarked for working capital and potential acquisitions. The offering closed on October 22, 2021, with additional sales anticipated in November 2021.
Interlink Electronics, Inc. (NASDAQ: LINK) reported preliminary financial results for Q3 2021, showcasing a significant 44% revenue increase year-over-year to $2.2 million, with an 8% sequential growth from Q2 2021. The gross margin was recorded at 58%, resulting in a pre-tax income of $0.3 million. The company is optimistic about future growth, focusing on expanding its sales pipeline and pursuing acquisition opportunities to diversify its customer base.
On Sept. 23, 2021, Interlink Electronics (NASDAQ: LINK) announced the establishment of an advanced engineering team in Glasgow, Scotland, to enhance its European presence. The new multidisciplinary team will start with five engineers, with plans for future expansion. Interlink is also forming a U.K. entity, Interlink Electronics Limited, with support from Scottish Enterprise. CEO Steven N. Bronson emphasized the importance of accessing engineering talent and capitalizing on the growing European market. Recent expansions include a new R&D center in Camarillo, California, bolstering the company's global growth strategy.
Interlink Electronics (NASDAQ: LINK) reported a net revenue of $2.1 million for Q2 2021, marking a 21% year-over-year increase and a 32% sequential growth from Q1. Gross margin fell to 54.6% from 58.6% year-over-year due to product mix and rising production costs. Operating income improved to $133,000, up from $41,000 in 2020. Net income rose to $63,000 or $0.01 per diluted share, compared to $13,000 the prior year. The company maintained a strong cash position of $6.2 million and aims to enhance growth through acquisitions.
BKF Capital Group, Inc. (OTC: BKFG) announced that its subsidiary, Bronson Financial LLC, has become a FINRA member, enabling it to operate as an investment banking firm. Bronson Financial will focus on providing investment banking services to emerging growth and middle-market companies, including M&A advisory, capital raising, fairness opinions, and valuations. Led by founder Steven N. Bronson, with nearly 40 years in business, the firm aims to treat clients as partners. BKF Asset Holdings, the parent company, invests in notable firms like Interlink Electronics (NASDAQ: LINK) and Qualstar (OTC: QBAK).
Interlink Electronics (Nasdaq: LINK) will present virtually at the LD Micro Invitational XI on June 9, 2021, at 1:00 p.m. EST. The presentation, led by Steven N. Bronson, CEO, will cover current and future company initiatives, emphasizing growth strategies, including mergers and acquisitions. The conference, running from June 8 to June 10, features around 180 companies and influential keynote speakers. Attendees can register here.
Interlink Electronics (NASDAQ: LINK) has officially opened a new R&D and materials science lab in Camarillo, California, following a six-month buildout. This 10,000 sq ft facility aims to enhance product development and technological options for the company, which is transitioning from Singapore to the U.S. The lab is equipped with advanced materials characterization and testing equipment to support innovation in sensor technology. The appointment of Gene Chen as VP of engineering will further strengthen the team's capabilities. Interlink continues to lead the HMI industry, focusing on expanding its product offerings.
Interlink Electronics, Inc. (NASDAQ: LINK) reported its financial results for Q1 2021, revealing net revenue of $1.6 million, a decline of 7% year-over-year. The gross margin remained steady at 55.7%. The company experienced a net loss of $43,000, or $0.01 per diluted share, compared to a net loss of $18,000 in the prior year. Challenges stemmed from reduced demand in the medical market due to COVID-19, although growth was noted in industrial and consumer sectors. Interlink ended the quarter with $6.1 million in cash and completed its NASDAQ relisting in March 2021.
Interlink Electronics Inc. (NASDAQ: LINK) announced the appointment of Dr. Gene Chen as Vice President of Engineering and Advanced Materials. Dr. Chen will oversee the new R&D and materials science lab in Camarillo, California, and lead the global engineering team. He brings over 20 years of experience in electrical engineering, having previously served as CTO at New Degree Technology. His expertise in advanced materials is expected to enhance Interlink's product offerings as the company focuses on innovative in-house solutions.