LOBO TECHNOLOGIES LTD announces Initial 50-Unit Purchase Order for New EEC-Certified Tricycle Electric Vehicle in Germany

Rhea-AI Summary

MediaTek announced the Dimensity 9500, a flagship mobile SoC focused on on-device AI, gaming, and power efficiency, with flagship smartphones expected in Q4 2025.

Key technical highlights include a third‑generation All Big Core CPU (4.21GHz ultra core + 3 premium + 4 performance cores) delivering up to 32% higher single‑core and 17% higher multi‑core performance versus prior generation, an Arm G1‑Ultra GPU with up to 33% peak performance gain and 42% better power efficiency, and a ninth‑generation NPU 990 that doubles compute for generative AI with up to 33% lower NPU power and 56% lower peak power for some workloads.

Other features: industry‑first 4‑channel UFS4.1 support, 40% faster large model loading, 128K token LLM support, 4K image generation, 200MP capture, and connectivity improvements including 5CC carrier aggregation (+15% bandwidth).

Positive

• CPU: up to 32% higher single‑core performance
• GPU: up to 33% higher peak performance
• NPU: compute doubled for generative AI workloads
• Power: up to 56% lower peak power for select AI tasks
• Storage: industry first 4‑channel UFS4.1 support
• Launch timing: flagship phones expected in Q4 2025

Negative

• None.

Key Figures

Ultra core frequency 4.21GHz Dimensity 9500 ultra CPU core clock speed

Single-core gain 32% Higher single-core performance vs previous generation

Multi-core gain 17% Higher multi-core performance vs previous generation

Peak power reduction 55% Lower power consumption at peak vs previous generation

Multitask efficiency 30% More power efficient while multitasking in games and calls

LLM output speed 100% Faster 3 billion parameter LLM output vs prior generation

Image capture 200MP Maximum camera capture resolution supported

Video frame rate 120FPS Raytracing frame interpolation capability

Market Reality Check

$0.8500 Last Close

Volume Volume 333,621 is at 0.05x the 20-day average of 6,734,601, indicating very light trading activity. low

Technical Shares at 0.935, trading above the 200-day MA of 0.77 and still well below the 52-week high of 2.41.

Peers on Argus

LOBO is up 9.36% while peers show mixed moves: AYRO up 7.35%, FLYE up 20%, EVTV up 1.69%, but ECDA down 12.63% and CJET down 10.74%. No momentum scanner peers were flagged, supporting a stock-specific move.

Historical Context

Date	Event	Sentiment	Move	Catalyst
2025-10-29	PV storage order	Positive	+5.7%	Secured ~US$1.194M PV power storage order covering 80 villas in Kenya.
2025-10-27	Outlook update	Positive	-0.9%	Updated 2025 outlook with 30–40% revenue growth and return to profitability.
2025-10-22	Trade fair orders	Positive	-2.7%	Reported >US$5M in orders and 40% growth vs prior Canton Fair.
2025-10-20	Strategic initiative	Positive	+0.9%	Announced Ghana CyberCity and Digital Bank Africa HQ initiative with partners.
2025-07-28	Financing facility	Positive	+0.8%	Exploring up to $10M equity financing facility with Strattners for growth.

Pattern Detected

Recent positive operational and outlook news has produced mixed reactions, with three price moves aligning positively and two diverging.

Recent Company History

This announcement follows several commercially focused updates. On Oct 22, 2025, LOBO reported over US$5 million in Canton Fair orders, and on Oct 27, 2025 it issued a 2025 outlook calling for 30–40% revenue growth to $28–30M and a return to profitability. Additional orders, including a US$1.194M PV storage deal in Kenya on Oct 29, 2025, and strategic initiatives in Ghana plus a potential $10M equity facility, highlight expansion. Today’s news adds to this stream of product and growth-oriented developments.

Market Pulse Summary

This announcement adds to a series of growth and product-focused updates for LOBO, complementing recent order wins, an outlook calling for 30–40% revenue growth to $28–30M, and strategic initiatives in Africa. Historically, similar news produced mixed price reactions, so investors may track execution on announced projects, order conversion into revenue, and any future financing usage. The prior Nasdaq compliance update and governance changes also frame the company’s listing and capital-structure backdrop.

Key Terms

soc technical

"MediaTek, the world's leading innovator of smartphone SoCs, today announced"

Standard of care (often abbreviated SOC) is the treatment or management approach that is widely accepted and used by medical professionals for a particular disease or condition. For investors, SOC provides the benchmark against which new therapies, devices, or clinical results are judged—like comparing a new car to the current most popular model; a product that meaningfully outperforms the SOC can win market share and drive revenue, while failure to beat or match it limits commercial potential.

ufs 4.1 technical

"four-lane UFS 4.1 storage. This design delivers up to 32% higher"

UFS 4.1 is a version of the Universal Flash Storage standard used in consumer devices to store and move data, like a faster, more efficient roadway for files and apps inside a phone, tablet, or laptop. Investors care because it can boost device speed, battery life and user experience, influence component costs and supplier choice, and affect product competitiveness and sales for makers and chip suppliers.

gpu technical

"Integrating the Arm G1-Ultra GPU, the MediaTek Dimensity 9500 provides"

A GPU (graphics processing unit) is a specialized computer chip designed to handle many calculations at once, originally for rendering images and video but now widely used for tasks like artificial intelligence, data analysis and high-performance computing. Investors watch GPU demand and prices because strong sales often signal growth for chip makers and their customers, affect profit margins and capital spending, and can forecast wider trends in gaming, AI adoption and cloud services.

raytracing technical

"and introduces higher frame rate interpolation up to 120FPS raytracing, so gamers"

A rendering technique that simulates how light travels and bounces to create highly realistic images, like tracing the path of individual sunbeams through a room. Investors care because raytracing demands powerful hardware (graphics processors) and specialized software, driving sales and design choices in chips, gaming, film, virtual reality, and data-center markets; adoption can boost revenue for companies that supply the necessary compute power or tools, much like demand for better engines lifts carmakers and parts suppliers.

compute-in-memory technical

"first to support an integrated compute-in-memory architecture for its newly-added"

Compute-in-memory is a chip design approach that performs calculations directly inside the memory where data sits instead of constantly shuttling data back and forth between separate processor and memory units. For investors, it matters because this can greatly speed up certain workloads and reduce power use—think of doing math on sticky notes at your desk instead of walking across the room to a whiteboard—potentially improving the performance, cost and battery life of devices that run artificial intelligence or data-heavy applications.

carrier aggregation technical

"while 5CC carrier aggregation boosts bandwidth by 15%. AI positioning"

Carrier aggregation is a wireless network technique that combines two or more separate frequency bands (radio channels) so a mobile device can send and receive more data at once, boosting speed and capacity. For investors, it affects how well a carrier can serve customers and use its spectrum, influencing customer experience, network costs, device compatibility, and potential revenue—think of it as opening extra lanes on a highway to reduce traffic and carry more goods.

AI-generated analysis. Not financial advice.

New flagship chipset further strengthens industry leadership in gaming, compute, imaging, and AI

HSINCHU, Sept. 22, 2025 /PRNewswire/ -- MediaTek, the world's leading innovator of smartphone SoCs, today announced the launch of its most advanced mobile platform yet: The MediaTek Dimensity 9500. Setting new standards in on-device AI, console-class gaming, and power efficiency, the MediaTek Dimensity 9500 is engineered to super-charge the next wave of flagship 5G smartphones.

The MediaTek Dimensity 9500 adopts a third-generation All Big Core CPU design, combining a 4.21GHz ultra core, three premium cores, and four performance cores, with four-lane UFS 4.1 storage. This design delivers up to 32% higher single-core and 17% higher multi-core performance compared to the previous generation, while the ultra core achieves up to 55% lower power consumption at peak performance, giving users longer battery life and greater productivity. The 9500 is also up to 30% more power efficient while multitasking in games and social audio call apps.

"As AI becomes part of everyday life, consumers want devices that feel smarter, faster, and more personal without sacrificing battery life," said JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit. "The MediaTek Dimensity 9500 delivers exactly that: Breakthrough on-device AI, top-tier performance and efficiency, and a full suite of premium experiences that our partners can bring to users around the world."

The platform's new cache and memory architecture, including the industry's first support for 4-channel UFS4.1, doubles read/write speeds and accelerates large AI model loading by 40%. The second-generation Dimensity Scheduling Engine translates this raw power into smoother responsiveness and sustained efficiency, even under heavy workloads.

Integrating the Arm G1-Ultra GPU, the MediaTek Dimensity 9500 provides up to 33% higher peak performance and 42% improved power efficiency, and introduces higher frame rate interpolation up to 120FPS raytracing, so gamers can enjoy console-level quality gaming. MediaTek's collaboration with leading studios, along with support for MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5, enable AAA-level real-time rendering and immersive lighting effects.

The MediaTek Dimensity 9500 platform turns the vision of intelligent agent-based user experiences into reality, with proactive, personalized, collaborative, evolving, and secure features. Integrating the ninth-generation MediaTek NPU 990 with Generative AI Engine 2.0 doubles compute power and introduces BitNet 1.58-bit large model processing, reducing power consumption by up to 33%. Doubling its integer and floating-point computing capabilities, users benefit from 100% faster 3 billion parameter LLM output, 128K token long text processing, and the industry's first 4k ultra-high-definition image generation; all while slashing power consumption at peak performance by 56%.

The Dimensity 9500 is the first to support an integrated compute-in-memory architecture for its newly-added Super Efficient NPU, significantly reducing power consumption and enabling AI models to run continuously. This advancement further enhances end-user experiences with more sophisticated proactive AI.

With MediaTek Imagiq 1190, the MediaTek Dimensity 9500 supports RAW-domain pre-processing, up to 200MP capture, 30fps continuous focus tracking, and new portrait engine, while enabling cinematic 4K 60FPS portrait video. It offers offers the latest MiraVision Adaptive Display technology, which dynamically adjusts contrast and color saturation based on ambient lighting, panel characteristics, and real-time content analysis. This ensures a clear viewing experience both outdoors in high-brightness scenarios — without overheating during prolonged use — and indoors in extremely dark environments, providing eye protection while maintaining clarity.

The platform's connectivity suite includes Bluetooth call enhancement, Wi-Fi fast transfer, and multi-network intelligence for seamless calls and data. AI-powered communication technologies deliver up to 10% lower power in 5G and 20% lower power in Wi-Fi scenarios, while 5CC carrier aggregation boosts bandwidth by 15%. AI positioning and network selection technologies offer 20% higher accuracy, as well as 50% lower network latency thanks to AI congestion prediction.

As the world's largest supplier of smartphone SoCs, MediaTek continues to drive industry transformation through innovation and collaboration. The MediaTek Dimensity 9500 is the result of years of investment in advanced technologies, product development, and ecosystem partnerships. MediaTek works closely with leading game studios, device manufacturers, and software partners to deliver the ultimate mobile experiences to consumers worldwide.

Flagship smartphones powered by the MediaTek Dimensity 9500 are expected to arrive in the fourth quarter of 2025. To learn more about the MediaTek Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g.

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About MediaTek Inc.

MediaTek (TWSE: 2454) is a global leader in fabless semiconductor design, providing solutions from the edge to the cloud. Powering over 2 billion connected devices every year, MediaTek's leading-edge technology keeps the world connected and enhances everyday life.  At the forefront of innovation, MediaTek drives advancements in transformative technologies such as AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8. Our high-performance, power-efficient products form the foundation for a smarter, more connected world, enabling devices from smartphones, smart homes and AI PCs to high-performance computing, automotive, and AI data centers. As a trusted partner to the world's leading brands, MediaTek leads the industry in creating solutions that meet the evolving needs of the global community, ensuring access to world-class technology for everyone. Our commitment to accelerating AI underscores our dedication to enriching the future of humanity. Visit http://www.mediatek.com for more information.

PR Contact: Kevin Keating, pr@mediatek.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/mediatek-dimensity-9500-unleashes-best-in-class-performance-ai-experiences-and-power-efficiency-for-the-next-generation-of-mobile-devices-302562586.html

SOURCE MediaTek Inc.

FAQ

What performance gains does the MediaTek Dimensity 9500 claim compared to the prior generation?

MediaTek reports up to 32% higher single‑core and 17% higher multi‑core CPU performance versus the previous generation.

When will smartphones powered by the MediaTek Dimensity 9500 be available?

Flagship smartphones powered by the Dimensity 9500 are expected to arrive in Q4 2025.

How does the Dimensity 9500 improve on‑device AI performance and efficiency?

It integrates the ninth‑generation NPU 990 with doubled compute, 100% faster 3B‑parameter LLM output, and up to 33% lower NPU power for some tasks.

What gaming and graphics features does MediaTek highlight for the Dimensity 9500?

The platform uses an Arm G1‑Ultra GPU with up to 33% peak performance gain, 42% improved power efficiency, and supports up to 120FPS frame interpolation and raytracing.

What storage and model‑loading improvements does the Dimensity 9500 offer?

The SoC adds industry first 4‑channel UFS4.1 support, doubling read/write speeds and accelerating large AI model loading by 40%.

What connectivity and network benefits does the Dimensity 9500 provide?

Connectivity enhancements include AI‑powered power reductions (5G and Wi‑Fi), 5CC carrier aggregation that boosts bandwidth by 15%, and AI positioning with 20% higher accuracy.