Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
Lam Research (NASDAQ:LRCX) has introduced VECTOR® TEOS 3D, an advanced deposition tool designed for next-generation chip packaging in AI and high-performance computing applications. The breakthrough technology enables ultra-thick, uniform, inter-die gapfill for 3D stacking and heterogeneous integration.
The tool addresses critical manufacturing challenges by depositing specialized dielectric films up to 60 microns thick between dies, with scalability beyond 100 microns. Key features include single-pass processing of crack-free films, quad station module architecture delivering 70% faster throughput, and enhanced energy efficiency. TEOS 3D is already installed in leading logic and memory fabs globally.
Lam Research (NASDAQ:LRCX) ha presentato VECTOR® TEOS 3D, un avanzato strumento di deposizione pensato per l'imballaggio di chip di nuova generazione nelle applicazioni di intelligenza artificiale e calcolo ad alte prestazioni. Questa tecnologia permette il riempimento uniforme e ultra-spesso degli spazi tra die per lo stacking 3D e l'integrazione eterogenea.
Lo strumento affronta sfide produttive critiche depositando film dielettrici specializzati fino a 60 micron di spessore, con scalabilità oltre i 100 micron. Tra le caratteristiche principali: processi a singola passata per film privi di crepe, architettura a modulo a quattro stazioni che garantisce un 70% di throughput in più e maggiore efficienza energetica. TEOS 3D è già installato in importanti fonderie di logica e memoria a livello globale.
Lam Research (NASDAQ:LRCX) ha presentado VECTOR® TEOS 3D, una avanzada herramienta de deposición diseñada para el empaquetado de chips de próxima generación en aplicaciones de IA y computación de alto rendimiento. La tecnología permite un relleno inter-die ultraespeso y uniforme para apilamiento 3D e integración heterogénea.
La herramienta resuelve retos críticos de fabricación depositando películas dieléctricas especializadas de hasta 60 micrones de espesor, con escalabilidad más allá de los 100 micrones. Sus características clave incluyen procesamiento de pasada única para películas sin grietas, una arquitectura de módulo de cuatro estaciones que ofrece un 70% más de rendimiento y mayor eficiencia energética. TEOS 3D ya está instalado en fabs líderes de lógica y memoria a nivel mundial.
Lam Research (NASDAQ:LRCX)는 AI 및 고성능 컴퓨팅용 차세대 칩 패키징을 위해 설계된 첨단 증착 장비인 VECTOR® TEOS 3D를 선보였습니다. 이 혁신 기술은 3D 스태킹 및 이종 통합을 위한 초두껍고 균일한 다이 간 갭필을 가능하게 합니다.
이 장비는 다이 사이에 특수 유전체 필름을 60마이크론 두께까지 증착하며, 100마이크로운 이상으로 확장할 수 있어 제조상의 핵심 과제를 해결합니다. 주요 특징으로는 균열 없는 필름의 싱글 패스 처리, 70% 빠른 처리량을 제공하는 쿼드 스테이션 모듈 구조, 향상된 에너지 효율성이 있습니다. TEOS 3D는 이미 전 세계 주요 로직 및 메모리 팹에 설치되어 있습니다.
Lam Research (NASDAQ:LRCX) a lancé VECTOR® TEOS 3D, un outil de dépôt avancé conçu pour le packaging de puces de nouvelle génération dans les applications d'IA et de calcul haute performance. Cette technologie permet un comblement inter-die ultra-épais et uniforme pour l'empilement 3D et l'intégration hétérogène.
L'outil répond à des défis critiques de fabrication en déposant des films diélectriques spécialisés jusqu'à 60 microns d'épaisseur, avec une évolutivité au-delà de 100 microns. Ses caractéristiques clés incluent un traitement en une seule passe pour des films sans fissures, une architecture modulable à quatre stations offrant un rendement supérieur de 70% et une meilleure efficacité énergétique. TEOS 3D est déjà installé dans des fonderies logiques et mémoire de premier plan dans le monde.
Lam Research (NASDAQ:LRCX) hat VECTOR® TEOS 3D vorgestellt, ein fortschrittliches Depositionsgerät für die Chip-Packaging-Generation der nächsten Stufe in KI- und Hochleistungsrechner-Anwendungen. Die bahnbrechende Technologie ermöglicht ultra-dicke, gleichmäßige Gap-Füllungen zwischen Dies für 3D-Stacking und heterogene Integration.
Das Gerät löst entscheidende Fertigungsprobleme, indem es spezialisierte dielektrische Filme bis zu 60 Mikrometer Dicke aufbringt, mit Skalierbarkeit über 100 Mikrometer hinaus. Wichtige Merkmale sind Ein-Pass-Verarbeitung für rissfreie Filme, eine Quad-Station-Modularchitektur, die 70% schnelleren Durchsatz bietet, sowie verbesserte Energieeffizienz. TEOS 3D ist bereits in führenden Logik- und Speicherfabriken weltweit installiert.
- First solution for single-pass processing of crack-free films over 30 microns thick
- 70% faster throughput and 20% improvement in cost of ownership compared to previous generation
- Enhanced energy efficiency through high-efficiency RF generators and ECO Mode
- Already installed at leading logic and memory fabs globally
- None.
Insights
Lam's VECTOR TEOS 3D addresses critical AI chipmaking bottlenecks with breakthrough 3D packaging technology, strengthening their position in high-growth advanced packaging.
Lam Research's new VECTOR TEOS 3D represents a significant technological advancement in the semiconductor manufacturing space, specifically targeting the exploding demand for AI and high-performance computing chips. The tool solves a critical production bottleneck by enabling ultra-thick (up to 60 microns) uniform inter-die gapfill on highly stressed wafers - a key challenge as chipmakers shift toward chiplet architectures to overcome traditional Moore's Law scaling limitations.
What makes this particularly valuable is the tool's ability to handle the extreme wafer bow (warping) that occurs in advanced packaging processes, while depositing crack-free films in a single pass. This directly addresses manufacturing yield issues that have plagued 3D integration efforts. The 70% faster throughput and 20% improved cost of ownership compared to previous generations translate to tangible economic benefits for chip manufacturers utilizing this equipment.
The timing is strategic, as semiconductor companies are increasingly relying on advanced packaging to create more powerful AI chips by stacking memory closer to processing elements. This heterogeneous integration approach is becoming essential for next-generation AI computing architecture. By solving specific manufacturing pain points around structural support between dies, Lam is positioning itself as a critical enabler in the AI semiconductor supply chain.
This announcement reinforces Lam's leadership in the advanced packaging equipment segment, where they've been building expertise for 15 years. The product's global installation base at leading logic and memory fabs indicates early market acceptance and potentially signals growing revenue opportunities as AI chip demand continues accelerating.
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures
"VECTOR TEOS 3D deposits the industry's thickest, void-free, inter-die gapfill films, customized to meet the challenging requirements of advanced die stacking integration schemes, even on ultra-stressed, high-bow wafers," said Sesha Varadarajan, senior vice president of the Global Products Group at Lam Research. "It's another powerful addition to our best-in-class advanced packaging portfolio, which delivers the differentiated, atomic-level innovations chipmakers need to scale beyond Moore's Law and into the AI era."
Addresses Manufacturing Pain Points
The explosive growth of AI is driving the need for new devices that can support increasingly data-intensive workloads. Chipmakers are turning to 3D advanced packaging to integrate multiple dies into chiplet architectures to enable AI compute. By bringing memory and processing closer together to optimize electrical pathways, chiplet designs can improve processing speed, and pack more power into smaller form factors. However, as chiplets scale taller and become more complex, they present a range of new manufacturing hurdles, from stress during processing that can distort or bow a wafer's shape, to cracks and voids in films that cause defects and lower yield.
TEOS 3D conquers a range of critical advanced packaging production challenges, excelling at handling bulky, high-bow wafers precisely and reliably. With nanoscale precision, it deposits specialized dielectric films of up to 60 microns thick between dies, with scalability to deposit films greater than 100 microns. The films provide essential structural, thermal and mechanical support to prevent common packaging failures such as delamination. TEOS 3D also features Lam's novel clamping technology and an optimal pedestal design that provides exceptional stability when processing thick wafers, enabling uniform film deposition even when dealing with extreme wafer bow.
Other highlights include:
- The first solution for single-pass processing of crack-free films more than 30 microns thick, significantly enhancing yield and process time.
- Unique quad station module (QSM) architecture to boost productivity: Lam's proven QSM architecture features four distinct stations to enable parallel processing and reduce bottlenecks. The modular design helps deliver nearly
70% 1 faster throughput and up to20% improvement in cost of ownership compared to Lam's previous generation of gapfill solutions. - Lam Equipment Intelligence® technology for process repeatability: Built into TEOS 3D, Equipment Intelligence solutions boost equipment performance and reliability, and drive yield improvement by using smart technology to monitor processes, fix issues faster, and automate routine tasks.
- Enhanced energy efficiency: Integrated high-efficiency RF generators and ECO Mode peripheral control reduce energy consumption while improving process precision.
Joins an Industry-Leading Suite of Advanced Packaging Solutions
Leveraging the company's 15 years of leadership in advanced packaging and decades of expertise in dielectric films, TEOS 3D builds on Lam's existing VECTOR® Core and TEOS product families, representing continuous innovation in materials and processes for integrated packaging. It is part of a comprehensive product portfolio of industry-leading solutions that addresses critical challenges and drives innovation and productivity across the advanced packaging workflow.
Media Resources
- Visit the Lam Newsroom for related images.
- Read the Lam blog.
- Learn more about VECTOR® TEOS 3D.
About Lam Research
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in
1 – Based on internal testing;
Caution Regarding Forward-Looking Statements
Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to: industry trends, demands, expectations and requirements; the requirements of our customers; and the capabilities and performance of our products. Some factors that may affect these forward-looking statements include: business, economic, political and/or regulatory conditions in the consumer electronics industry, the semiconductor industry and the overall economy may deteriorate or change; the actions of our customers and competitors may be inconsistent with our expectations; trade regulations, export controls, tariffs, trade disputes, and other geopolitical tensions may inhibit our ability to sell our products; supply chain cost increases, tariffs and other inflationary pressures have impacted and may continue to impact our profitability; supply chain disruptions or manufacturing capacity constraints may limit our ability to manufacture and sell our products; and natural and human-caused disasters, disease outbreaks, war, terrorism, political or governmental unrest or instability, or other events beyond our control may impact our operations and revenue in affected areas; as well as the other risks and uncertainties that are described in the documents filed or furnished by us with the Securities and Exchange Commission, including specifically the Risk Factors described in our annual report on Form 10-K for the fiscal year ended June 29, 2025. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this press release.
Company Contacts:
Allison L. Parker
Media Relations
(510) 572-9324
publicrelations@lamresearch.com
Ram Ganesh
Investor Relations
(510) 572-1615
investor.relations@lamresearch.com
Source: Lam Research Corporation, (Nasdaq: LRCX)
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