Welcome to our dedicated page for Lam Research news (Ticker: LRCX), a resource for investors and traders seeking the latest updates and insights on Lam Research stock.
Lam Research Corp. supplies wafer fabrication equipment and services used by semiconductor manufacturers to build advanced chips. Company news commonly covers quarterly operating results, regional revenue mix, etch and deposition demand, customer support revenue, dividends, investor events, and global operations tied to chipmaker capacity and technology transitions.
Lam Research updates also highlight process-development collaborations and product technologies such as Aether dry resist, Kiyo and Akara etch platforms, Striker and ALTUS Halo deposition systems, advanced packaging capabilities, and customer service offerings that include spares, upgrades, and Reliant non-leading-edge equipment.
Lam Research Corporation (LRCX) announced the redemption of its 2.625% Senior Convertible Notes due 2041, effective May 21, 2021. Holders will receive a redemption price of $1,002.35 per $1,000 principal, which includes accrued regular interest of $0.44 and contingent interest of $1.91 for the period from May 15 to May 21, 2021. The notes can be converted into 31.8009 shares of common stock per $1,000 principal before the redemption date. This announcement follows a notice of redemption issued earlier and does not constitute an offer for securities.
On May 13, 2021, Lam Research Corporation (LRCX) announced a quarterly dividend of $1.30 per share, payable on July 7, 2021, to shareholders of record on June 16, 2021. This decision underscores the company's commitment to returning value to its investors. Future dividends will be subject to Board review. Lam Research is a key player in the semiconductor industry, providing innovative wafer fabrication equipment globally, emphasizing its strategy to enhance device performance.
Lam Research Corporation (Nasdaq: LRCX) announced its participation in the JP Morgan Global Technology, Media and Communications Conference on May 25, 2021, at 11:10 a.m. Pacific Time. Doug Bettinger, the Executive Vice President and CFO, will represent the company. A live webcast of the event will be accessible through the Investors’ section of Lam's website, with a replay available for two weeks post-presentation. Lam Research is a significant supplier of wafer fabrication equipment to the semiconductor industry, and its technology is integral to advanced chip production.
Lam Research reported strong financial results for the quarter ending March 28, 2021, with revenue of $3.85 billion, a 46.3% gross margin, and diluted EPS of $7.41 on a GAAP basis, reflecting an 11% revenue increase from the previous quarter. Non-GAAP results showed a similar revenue figure with a diluted EPS of $7.49. Operating income rose to 31.1% of revenue. Cash and cash equivalents decreased to $6 billion due to significant share repurchases and dividends. The company expects revenue of $4 billion for the next quarter, indicating continued growth.
Lam Research Corp. (NASDAQ: LRCX) announced its quarterly financial conference call scheduled for April 21, 2021, at 2:00 PM PT. Investors can access the call via the company's website, with a replay available three hours post-conclusion. Lam Research is a leading supplier of wafer fabrication equipment to the semiconductor industry, playing a crucial role in the production of advanced chips globally. The company is headquartered in Fremont, California, and is part of the FORTUNE 500.
Lam Research (Nasdaq: LRCX) announced a notice of redemption for all 2.625% Senior Convertible Notes due 2041 issued by its subsidiary Novellus Systems, Inc. The redemption date is set for May 21, 2021, at a price equal to 100% of the principal plus accrued interest. Holders can convert the notes into shares at a rate of 31.8009 shares of LRCX per $1,000 principal amount before the redemption date. The company will instruct the trustee to notify noteholders of the redemption terms.
Lam Research Corporation (Nasdaq: LRCX) will participate in the Morgan Stanley Technology, Media and Telecom Conference on March 1, 2021, at 8:45 a.m. Pacific Time. Doug Bettinger, Executive Vice President and CFO, will represent the company. A live webcast of the presentation will be publicly accessible via Lam's website, with a replay available for two weeks post-event. Lam Research is a key supplier of wafer fabrication equipment to the semiconductor industry, known for its technological leadership and commitment to customer success.
Lam Research Corporation (Nasdaq: LRCX) has declared a quarterly dividend of $1.30 per share, payable on April 7, 2021, to shareholders on record as of March 17, 2021. This payment reflects the company's ongoing commitment to returning value to its investors. As a key player in the semiconductor equipment sector, Lam Research provides essential technology that supports advanced chip manufacturing.
Future dividends are subject to the Board's review. The company emphasizes that its forward-looking statements may be influenced by various uncertainties, including market conditions and the impacts of the COVID-19 pandemic.
Lam Research Corporation (Nasdaq: LRCX) announced its participation in the Goldman Sachs Technology & Internet Conference 2021. Tim Archer, President and CEO, will present on February 11, 2021, at 7:30 a.m. PT (10:30 a.m. ET). A live webcast of the event can be accessed on Lam's Investor Relations page, with a replay available for two weeks afterward.
Lam Research is a leading provider of wafer fabrication equipment and services for the semiconductor industry, known for its technological innovation and collaboration with major semiconductor companies.
Lam Research has launched Vantex, a cutting-edge dielectric etch technology for the Sense.i etch platform, designed to enhance performance and scalability in 3D NAND and DRAM manufacturing. This innovation allows chipmakers to achieve higher aspect ratios and improve etch profile uniformity while reducing costs. With increased RF power and advanced pulsing technology, Vantex is expected to significantly boost yield across 300mm wafers. The technology is already shipping for qualification to major memory customers, aiming for high-volume production in 2021.