Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
Microchip Technology's (NASDAQ:MCHP) subsidiary Silicon Storage Technology (SST) and Deca Technologies have announced a strategic collaboration to develop non-volatile memory (NVM) chiplet solutions. The partnership combines Deca's M-Series fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology.
The collaboration aims to provide customers with a comprehensive package for chiplet development, including IP, simulation tools, and advanced assembly services. This modular approach enables the integration of different chips, process nodes, and dies from multiple foundries, offering a more efficient and cost-effective alternative to traditional monolithic chip designs.
La controllata di Microchip Technology (NASDAQ:MCHP), Silicon Storage Technology (SST), e Deca Technologies hanno annunciato una collaborazione strategica per sviluppare soluzioni chiplet per memorie non volatili (NVM). La partnership unisce le tecnologie M-Series fan-out e Adaptive Patterning di Deca con la tecnologia flash incorporata SuperFlash di SST.
L’accordo mira a offrire ai clienti un pacchetto completo per lo sviluppo di chiplet, comprendente IP, strumenti di simulazione e servizi avanzati di assemblaggio. Questo approccio modulare permette di integrare differenti chip, nodi di processo e die provenienti da più fonderie, rappresentando un’alternativa più efficiente e conveniente rispetto ai tradizionali progetti monolitici.
La filial de Microchip Technology (NASDAQ:MCHP), Silicon Storage Technology (SST), y Deca Technologies han anunciado una colaboración estratégica para desarrollar soluciones chiplet de memoria no volátil (NVM). La alianza combina las tecnologías M-Series fan-out y Adaptive Patterning de Deca con la tecnología de flash embebido SuperFlash de SST.
La colaboración pretende ofrecer a los clientes un paquete integral para el desarrollo de chiplets, que incluye IP, herramientas de simulación y servicios avanzados de ensamblaje. Este enfoque modular permite integrar distintos chips, nodos de proceso y dies de múltiples fundiciones, ofreciendo una alternativa más eficiente y rentable frente a los diseños monolíticos tradicionales.
Microchip Technology(NASDAQ:MCHP)의 자회사인 Silicon Storage Technology(SST)와 Deca Technologies가 비휘발성 메모리(NVM) 칩렛 솔루션 개발을 위한 전략적 협력을 발표했습니다. 이번 파트너십은 Deca의 M-Series 팬아웃 및 Adaptive Patterning 기술과 SST의 SuperFlash 임베디드 플래시 기술을 결합합니다.
협력의 목표는 IP, 시뮬레이션 도구 및 고급 조립 서비스를 포함한 칩렛 개발을 위한 종합 패키지를 고객에게 제공하는 것입니다. 이 모듈식 접근 방식은 여러 파운드리의 서로 다른 칩, 공정 노드 및 다이를 통합할 수 있게 하여 기존의 단일 칩(monolithic) 설계보다 더 효율적이고 비용 효과적인 대안을 제시합니다.
La filiale de Microchip Technology (NASDAQ:MCHP), Silicon Storage Technology (SST), et Deca Technologies ont annoncé une collaboration stratégique pour développer des solutions chiplet de mémoire non volatile (NVM). Le partenariat associe les technologies M-Series fan-out et Adaptive Patterning de Deca à la technologie SuperFlash embarquée de SST.
Cette collaboration vise à fournir aux clients un pack complet pour le développement de chiplets, incluant des IP, des outils de simulation et des services d’assemblage avancés. Cette approche modulaire permet d’intégrer différents puces, nœuds de procédé et dies provenant de plusieurs fonderies, offrant une alternative plus efficace et économique aux conceptions monolithiques traditionnelles.
Die Tochtergesellschaft von Microchip Technology (NASDAQ:MCHP), Silicon Storage Technology (SST), und Deca Technologies haben eine strategische Zusammenarbeit zur Entwicklung von nichtflüchtigen Speicher-(NVM)-Chiplet-Lösungen angekündigt. Die Partnerschaft kombiniert Decas M-Series Fan-Out- und Adaptive Patterning-Technologien mit SSTs SuperFlash Embedded-Flash-Technologie.
Die Kooperation zielt darauf ab, Kunden ein umfassendes Paket für die Chiplet-Entwicklung bereitzustellen, einschließlich IP, Simulationswerkzeugen und fortschrittlichen Montageleistungen. Dieser modulare Ansatz ermöglicht die Integration verschiedener Chips, Prozessknoten und Dies aus mehreren Foundries und stellt eine effizientere und kostengünstigere Alternative zu herkömmlichen monolithischen Chipdesigns dar.
- Strategic partnership enables broader adoption of heterogeneous integration in semiconductor industry
- Solution allows mixing of advanced process nodes with less expensive legacy geometries
- Enables faster time-to-market through IP reuse and modular design approach
- Provides cost optimization by utilizing most appropriate die technology for specific functions
- Complex integration challenges may affect implementation timeline
- Requires significant coordination between multiple technology partners
- May involve higher initial development costs compared to traditional solutions
Insights
Microchip and Deca's chiplet collaboration addresses industry scaling challenges with modular NVM solutions that could accelerate product development.
This strategic partnership between Microchip's Silicon Storage Technology (SST) subsidiary and Deca Technologies represents a significant advancement in chiplet technology that addresses growing challenges in traditional monolithic chip designs. By combining SST's SuperFlash embedded flash technology with Deca's M-Series fan-out and Adaptive Patterning technologies, they're creating a modular framework for non-volatile memory chiplets.
The collaboration tackles a critical industry inflection point where traditional Moore's Law scaling faces increasing technical and economic limitations. Chiplet-based designs offer compelling advantages by enabling the integration of different process nodes, technologies, and even dies from multiple foundries within a single package. This approach allows companies to optimize each function with the most appropriate technology rather than compromising on a single monolithic design.
What's particularly valuable is the comprehensive offering - they're not just providing component technologies but a complete ecosystem including design rules, simulation flows, test strategies, and manufacturing paths. This reduces the implementation barriers that have historically limited chiplet adoption despite its theoretical advantages.
For Microchip, this represents a strategic expansion of SST's embedded flash business into the growing heterogeneous integration market. The partnership positions them to capture value in next-generation semiconductor architectures while extending the utility and longevity of their SuperFlash technology beyond traditional monolithic implementations.
The collaboration specifically targets the "more-than-Moore" opportunity where performance and functionality improvements come from novel integration approaches rather than just process node shrinks. This trend is accelerating as leading-edge nodes become prohibitively expensive for many applications, making chiplet approaches increasingly attractive for balancing performance, power, and cost.
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures
CHANDLER, Ariz. and SAN JOSE, Calif., Sept. 10, 2025 (GLOBE NEWSWIRE) -- As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases. Deca Technologies and Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc. (NASDAQ:MCHP), announced today that they have entered into a strategic agreement to innovate a comprehensive non-volatile memory (NVM) chiplet package to facilitate customer adoption of modular, multi-die systems.
This collaboration combines Deca’s M-Series™ fan-out and Adaptive Patterning® technologies with SST’s industry-leading SuperFlash® embedded flash technology. The companies are applying their system-level integration expertise to deliver a bundled offering that empowers customers to design, verify and commercialize NVM chiplets. By enabling greater architectural flexibility, the solution offers both technical and commercial advantages over traditional monolithic integration.
The collaborative solution provides a modular, memory-centric foundation for advanced multi-die architectures by combining the strengths of both companies. The chiplet package leverages SST’s SuperFlash technology, along with the interface logic and physical design elements required to function as a self-contained chiplet. This is paired with Adaptive Patterning-based redistribution layer (RDL) design rules, simulation flows, test strategies and manufacturing paths through Deca’s ecosystem of qualified partners.
Building on this foundation, Deca and SST will jointly support customers from early design through qualification and prototype manufacturing. By streamlining integration and accelerating design cycles, the companies aim to enable broader adoption of heterogeneous integration, engaging with customers globally to bring chiplet solutions to market.
“Chiplet integration is reshaping how the industry thinks about performance, scalability and time to market,” said Robin Davis, VP of Strategic Engagements & Applications at Deca. “Our partnership with SST empowers customers to develop a chiplet solution that combines different chips, process nodes, sizes and even die from multiple foundries delivering more efficient and cost-effective products.”
Chiplet technology offers significant advantages in semiconductor design and manufacturing by enabling a more-than-Moore approach. Designers can go beyond traditional scaling to deliver enhanced functionality and performance and get products to market faster. Chiplets allow the reuse of existing IP and can facilitate the mixing of advanced process nodes with less expensive legacy geometries. By utilizing the most appropriate die technology for a particular function, chiplets provide a versatile, efficient and economical pathway for advanced semiconductor innovation.
“As our customers push the boundaries of Moore’s Law, they are expressing greater interest in chiplet-based solutions,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “This partnership aims to deliver a comprehensive package of IP, simulation tools and advanced assembly and engineering services necessary for successful chiplet development and productization.”
Pricing and Availability
Customers interested in SST’s SuperFlash technology should access the SST website or contact a regional SST sales executive for more information and details of our NVM chiplet solutions. Those interested in Deca’s technology and offerings should visit the Deca website or reach out to Deca’s marketing contact.
Resources
High-res images available through Flickr or editorial contact (feel free to publish):
- Application image: www.flickr.com/photos/microchiptechnology/54745873597/sizes/o/
About Microchip Technology:
Microchip Technology Inc. is committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio support customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. For more information, visit the Microchip website at www.microchip.com.
About Silicon Storage Technology (SST)
Microchip Technology’s SST subsidiary is a leading provider of embedded flash technology. SST develops, designs, licenses and markets a diversified range of proprietary and patented SuperFlash memory technology solutions for the consumer, industrial, automotive and Internet of Things (IoT) markets. SST was founded in 1989, went public in 1995 and was acquired by Microchip in April 2010. SST is now a wholly owned subsidiary of Microchip and is headquartered in San Jose, Calif. For more information, visit the SST website at www.sst.com.
About Deca Technologies
Deca is a leading provider of advanced packaging technologies, including M-Series™ fan-out and Adaptive Patterning®—a breakthrough design-during-manufacturing approach. Deca’s first-generation technologies set new benchmarks for quality and reliability, with over eight billion units shipped into leading smartphone applications. With the growth of Gen 2 aimed at chiplets and heterogeneous integration, Deca’s technologies are emerging as key industry standards for the future. A growing ecosystem of technology partners are implementing Deca’s proven structures, processes, and design systems opening multiple options to accelerate next-generation product development. For more information, visit the Deca website at www.ThinkDeca.com.
Note: The Microchip name and logo, the Microchip logo, Silicon Storage Technology, SST and SuperFlash are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.
| SST Editorial Contact: | |
| Brian Thorsen | |
| 480-792-7182 | |
| brian.thorsen@microchip.com |
| Deca Contact: | |
| Robin Davis | |
| 781-223-7612 robin.davis@thinkdeca.com | |
FAQ
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