Marvell Technology Inc Stock Price, News & Analysis

Marvell Technology (NASDAQ: MRVL) has unveiled a groundbreaking custom HBM compute architecture for cloud AI accelerators. The new technology enables XPUs to achieve up to 25% more compute capacity and 33% greater memory while improving power efficiency. The architecture features advanced die-to-die interfaces and delivers up to 70% lower interface power compared to standard HBM interfaces.

Marvell is collaborating with leading HBM manufacturers - Micron, Samsung Electronics, and SK hynix - to develop custom HBM solutions for next-generation XPUs. The optimized interfaces reduce required silicon real estate in each die, allowing HBM support logic integration onto the base die, resulting in improved performance and lower TCO for cloud operators.

Marvell Technology (NASDAQ: MRVL) has unveiled Aquila, the industry's first coherent-lite DSP optimized for 1.6 Tbps coherent optical transceiver modules operating at O-band wavelengths. The new DSP is designed for distributed campus data center interconnects spanning up to 20 km with high bandwidth and low latency.

The Aquila DSP introduces an innovative O-band coherent architecture that delivers cost efficiency, power savings, and scalability for campus-based data center connectivity. It enables 1.6 Tbps total bandwidth in pluggable module form factor with 400 Gbps/lane 16-QAM signaling, addressing the growing market need as the industry shifts from large-scale facilities to campus-based data centers due to power and space constraints.

Marvell Technology (MRVL) reported Q3 fiscal 2025 results with net revenue of $1.516 billion, showing 7% year-over-year growth and exceeding guidance by $66.0 million. The company posted a GAAP net loss of $(676.3) million, or $(0.78) per diluted share, while non-GAAP net income was $373.0 million, or $0.43 per diluted share.

For Q4 fiscal 2025, Marvell forecasts revenue of $1.800 billion (±5%), expecting 19% sequential growth and 26% year-over-year growth. The company attributes strong performance to AI-driven demand, with custom AI silicon programs now in volume production and robust demand for interconnect products from cloud customers.

Marvell Technology (NASDAQ: MRVL) has introduced Ara, the industry's first 3nm 1.6 Tbps PAM4 interconnects platform with 200 Gbps electrical and optical interfaces. Built on their successful Nova 2 DSP, Ara reduces optical module power consumption by over 20% through its 3nm technology and integrated optical modulator drivers. The platform features eight 200 Gbps electrical and optical lanes, enabling 1.6 Tbps in a standardized module form factor. This advancement aims to address increasing AI bandwidth demands while maintaining data center power constraints. Marvell plans to sample Ara to select customers in Q1 2025.

Marvell Technology (NASDAQ: MRVL) has expanded its strategic partnership with Amazon Web Services (AWS) through a five-year, multi-generational agreement. The collaboration encompasses the supply of custom AI products, optical DSPs, AEC DSPs, PCIe retimers, DCI optical modules, and Ethernet switching silicon solutions. Additionally, Marvell will utilize AWS's cloud infrastructure for electronic design automation (EDA), enabling accelerated silicon design through advanced compute capabilities. This cloud-first approach allows Marvell to parallelize design tasks and handle dynamic compute requirements more efficiently, while providing AWS with essential silicon technologies for their data center operations.

Marvell Technology (NASDAQ: MRVL) has announced a conference call scheduled for December 3, 2024, at 1:45 p.m. Pacific Time to discuss their third quarter fiscal year 2025 financial results. Participants can join through automated registration or by dialing directly. The call will be webcast on Marvell's Investor Relations website, with a replay available until December 10, 2024.

Marvell Technology (NASDAQ: MRVL) demonstrates its industry-leading 3nm PCIe Gen 7 connectivity at the OCP Global Summit, extending its PAM4 technology leadership. PCIe Gen 7 doubles data transfer speeds, enabling continued scaling of compute fabrics for AI and accelerated infrastructure. Marvell's comprehensive interconnect portfolio addresses high-bandwidth optical and copper connections in AI data centers.

Key points:

• PCIe Gen 7 operates at 128 GT/s per lane, supporting AI and ML workload scaling
• Marvell's 3nm fabrication technology enables lower power consumption with superior reach and link margins
• The company's PAM4 SerDes technology leadership extends to PCIe, CXL, and proprietary compute fabric links
• Marvell introduced the industry's first 1.6T PAM4 DSP in 2023

Marvell Technology, Inc. (NASDAQ: MRVL) has announced the development of FBNIC, a custom 5nm network interface controller (NIC) ASIC, in collaboration with Meta. The FBNIC board design will be contributed to the Open Compute Project (OCP) community. Key features of FBNIC include:

• Ethernet network interface support for multiple configurations
• Multi-host PCIe interface with four independent Gen5 x4 ports
• Complete firmware control for innovative customized capabilities
• Compliance with OCP NIC 3.0, Version 1.2.0 Design Specification

This custom design aims to optimize performance, increase efficiencies, and reduce the average time needed to resolve potential network and server issues. Marvell's President of Products and Technologies, Raghib Hussain, emphasized the importance of optimizing semiconductors for specific applications and cloud infrastructure architectures in large-scale data center computing.

Marvell Technology (NASDAQ: MRVL) will showcase its accelerated infrastructure portfolio at the 2024 OCP Global Summit in San Jose, California, from October 15-17. The company will demonstrate how its innovations enable the next generation of AI and cloud data centers. Marvell will exhibit next-generation silicon technologies, including PAM4 DSPs, PCIe retimers, Ethernet network switches, and CXL devices, designed to meet the scaling requirements of AI-driven workloads and optimize cloud network performance.

Visitors to Marvell's booth B1 can explore products such as Alaska 1.6T PAM4 DSPs, PCIe Gen 6 retimers, COLORZ 800 ZR/ZR+ modules, and Teralynx Ethernet switches. Marvell experts will lead discussions on topics like scaling interconnect and memory for AI clusters, overcoming computing's memory challenges, and open network switching for hyperscale cloud AI infrastructure. The event will feature keynote panels, expo hall sessions, and workshops focusing on various aspects of AI and cloud connectivity.