Micron Technology, Inc. - $MU STOCK NEWS

Micron announced the availability of Crucial LPCAMM2, a next-generation laptop memory form factor featuring LPDDR5X mobile memory for professionals and creators. The LPCAMM2 delivers higher bandwidth, dual-channel support, and 1.3 times faster performance compared to DDR5 SODIMMs, while consuming up to 58% less active power and saving 64% space. It is suitable for AI PC and complex workloads and compatible with Lenovo ThinkPad P1 Gen 7. The LPCAMM2 enables speeds of up to 7,500MT/s, reduces power consumption, extends battery life, and provides up to 80% less standby power than DDR5 SODIMMs. It is upgradeable, offers 32GB and 64GB densities, and comes with a lifetime warranty.

Micron Technology, Inc. (Nasdaq: MU) has validated and shipped the industry's first 128GB DDR5 RDIMM memory, utilizing high-capacity monolithic 32Gb DRAM die-based technology. This memory offers enhanced bit density, energy efficiency, and lower latency compared to competitors' products. The collaboration with industry leaders has led to widespread adoption of these high-performance modules in various data center applications, including AI, ML, HPC, and IMDBs. Micron's 128GB DDR5 RDIMM memory is supported by a strong ecosystem and will be available through global distributors in June 2024. This launch signifies Micron's continued leadership in providing high-capacity RDIMMs for memory-intensive workloads.

Micron Technology, Inc. and the Biden-Harris Administration announced $6.1B in CHIPS and Science Act funding to support leading-edge memory manufacturing in Idaho and New York. This investment will boost U.S. economic and national security, create jobs, and strengthen Micron's position in the semiconductor industry.

Silvaco Group, Inc. announces an expanded partnership with Micron Technology, Inc. The partnership includes an enhanced software license, support services, and a $5.0 million investment from Micron for the development of Silvaco's FTCO™ digital twin modeling tools. Silvaco's CEO, Dr. Babak Taheri, highlights the use of AI and machine learning in semiconductor technologies to create a digital twin for wafer-level fabrication facilities. Micron's principal fellow, Dr. Gurtej Sandhu, expresses excitement about the collaboration and its impact on memory and storage advancements.

Micron Technology, Inc. (MU) leads in NAND technology with the production of 232-layer QLC NAND, offering superior performance in client and data center storage. The Micron 2500 SSD outperforms competitors with industry-leading bit-density, NAND I/O speeds, read and programming performance. It is the first client SSD to integrate 200+ layer QLC NAND, delivering exceptional user experience and setting new standards in PC applications. The SSD boasts up to 7.1 GB/s sequential read speeds, outperforming TLC and QLC-based SSDs in the value segment. Micron's innovation in QLC NAND ensures high endurance and performance across different capacities and form factors.

Micron Technology collaborates with Qualcomm Technologies to provide automotive-grade memory and storage solutions for Snapdragon Digital Chassis, enhancing AI capabilities in intelligent vehicles.

Micron Technology introduces the world's first quad-port SSD, the Micron 4150AT, designed for software-defined intelligent vehicles. The SSD offers high performance, virtualization capabilities, boosted security, and customizable endurance modes, catering to the demands of next-generation automotive architectures.

Micron Technology, Inc. (MU) ensures safety of team members after Taiwan earthquake. Operations and supply chain evaluation ongoing.

Micron Technology, Inc. (MU) reported strong fiscal Q2 2024 results with revenue of $5.82 billion, GAAP net income of $793 million, and non-GAAP net income of $476 million. The company's operating cash flow was $1.22 billion, showcasing profitability and growth. Micron's CEO, Sanjay Mehrotra, highlighted the team's exceptional performance and the company's leading position in the semiconductor industry, driven by AI opportunities.