Welcome to our dedicated page for Micron Technology news (Ticker: MU), a resource for investors and traders seeking the latest updates and insights on Micron Technology stock.
Micron Technology, Inc. reports developments in memory and storage semiconductors for data centers, AI infrastructure, mobile and client devices, automotive systems, and embedded markets. The company’s updates center on DRAM, NAND, NOR, high-bandwidth memory, LPDDR memory, data center SSDs, and related storage products, including capacity and power-efficiency advances for compute-intensive workloads.
Recurring news also covers quarterly results by Cloud Memory, Core Data Center, Mobile and Client, and Automotive and Embedded units; customer and ecosystem collaborations; strategic investments tied to edge AI and physical AI; investor conference appearances; and balance-sheet actions such as cash tender offers for senior notes.
Micron (Nasdaq: MU) said company executives will participate at the Wolfe Research Auto, Auto Tech and Semiconductor Conference in New York on Wednesday, February 11, 2026 at 6:50 a.m. Mountain time.
Live webcasts and replays will be available via Micron's investor relations site at investors.micron.com.
Micron (Nasdaq: MU) broke ground on a new advanced wafer fabrication facility in Singapore, a planned investment of approximately US $24 billion (SG $31 billion) over 10 years that will add up to 700,000 sq ft of cleanroom space.
Wafer output is scheduled to begin in the second half of 2028. The expansion sits inside Micron’s existing NAND complex and complements an HBM advanced packaging facility expected to contribute to HBM supply in calendar 2027. The project is projected to create about 1,600 jobs (3,000 total across recent Singapore investments) and will follow LEED and sustainability commitments.
Micron (Nasdaq: MU) signed an exclusive Letter of Intent to acquire Powerchip Semiconductor Manufacturing Corporation's P5 Tongluo fabrication site in Miaoli County, Taiwan, for US$1.8 billion. The deal includes an existing 300mm cleanroom of 300,000 square feet and aims to create a long-term partnership with PSMC for post-wafer assembly and support of PSMC's legacy DRAM portfolio. Micron expects to assume ownership after closing, equip the site, and ramp DRAM production in phases with meaningful wafer output beginning in H2 2027. The transaction is expected to close by calendar Q2 2026, subject to final agreements and regulatory approvals, and is intended to expand Micron's Taiwan capacity and operational synergies with its Taichung site.
Micron (Nasdaq: MU) officially broke ground on a $100 billion leading-edge memory manufacturing complex in Clay, Onondaga County, New York on January 16, 2026. The site may host up to four fabs and is projected to create 50,000 jobs in New York and contribute to Micron’s broader ~$200 billion U.S. expansion vision. Micron plans a $500 million community investment framework, including $250 million for workforce development, and aims to produce 40% of its DRAM in the U.S., supporting an estimated 90,000 U.S. jobs. Production is expected to start in 2030 with fabs ramping through the decade.
Bertram Capital promoted Chris Brown to Partner effective Jan. 13, 2026. Brown rejoined Bertram in 2019 after an earlier stint (2010–2015) and focuses on the firm's Industrials vertical. He has participated in 15 platform investments and over 60 add-on acquisitions, and serves on the boards of AFC Industries, Applied Adhesives, Burke, MSE Supplies, LLC, and NEFCO. He previously worked in corporate development at Micron Technology (NASDAQ: MU) and in syndicated & leveraged finance at J.P. Morgan.
Micron (Nasdaq: MU) will break ground on a $100 billion megafab in Onondaga County, New York on Jan. 16, 2026, following completed environmental reviews and permit approvals.
The project, described as the largest private investment in New York state history, will include up to four fabs and become the largest semiconductor manufacturing facility in the United States, focused on advanced memory to meet growing AI demand. Micron executives and federal, state and local leaders will attend a ceremonial groundbreaking and a program at Syracuse University’s National Veterans Resource Center.
Micron Technology (Nasdaq: MU) reported record fiscal Q1 2026 results for the quarter ended November 27, 2025: revenue $13.64B, GAAP net income $5.24B (GAAP diluted EPS $4.60), non‑GAAP net income $5.48B (non‑GAAP EPS $4.78), and operating cash flow $8.41B. Capital expenditures were $4.5B and adjusted free cash flow was $3.9B. Cash and marketable investments totaled $12.0B. The board declared a quarterly cash dividend of $0.115 per share, payable Jan 14, 2026 to holders of record Dec 29, 2025.
For FQ2‑26 Micron provided guidance of $18.70B ± $0.40B revenue, GAAP gross margin 67.0% ± 1.0% and GAAP diluted EPS $8.19 ± $0.20.
Micron (Nasdaq: MU) announced it will exit the Crucial consumer business, ending consumer-branded product sales through retailers, e-tailers and distributors worldwide.
Micron will continue Crucial consumer shipments through the end of fiscal Q2 (February 2026), and will provide continued warranty service and support for Crucial products. The company said it will keep selling Micron-branded enterprise products to commercial customers globally.
Micron framed the move as part of a portfolio transformation to prioritize enterprise and commercial segments, improve supply and support for strategic customers driven by AI data-center demand, and pursue redeployment opportunities for affected team members.
Micron Technology (Nasdaq: MU) will hold its fiscal first quarter earnings conference call on Wednesday, Dec. 17, 2025 at 2:30 p.m. Mountain time. The call will be webcast live at http://investors.micron.com/. Webcast replays of presentations will be available on the company Investor Relations website for approximately one year after the call.
Micron (Nasdaq: MU) announced shipment of qualification samples of its automotive UFS 4.1 solution on G9 3D NAND on Nov 13, 2025, targeting AI-enabled vehicles.
Key specs: 4.2 GB/s bandwidth (2x prior), 30% faster device boot and 18% faster system boot, up to 100,000 P/E cycles (SLC) and 3,000 P/E cycles (TLC), and case-temperature operation from -40°C to 115°C. UFS 4.1 is qualified to automotive standards including AEC-Q1041, meets ASIL B (ISO 26262), aligns to ASPICE Level 3, and supports real-time telemetry, health monitoring and device-level exception notifications.