onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era

onsemi’s new Embedded Power Platform targets higher power density and faster development across AI infrastructure, electric vehicles and industrial systems.

Rhea-AI Impact

(Neutral)

Rhea-AI Sentiment

(Neutral)

Rhea-AI Summary

onsemi (ON) launched its Embedded Power Platform (EPP) on September 16, 2026, a new architecture that uses the silicon wafer itself as the package to jointly optimize electrical, mechanical and thermal performance for power systems.

EPP enables integration of silicon, SiC and GaN devices, embedding FETs, drivers and controllers in a single wafer-level package. The company reports that, depending on application, this can deliver approximately 3–5x higher power density, faster development cycles and reduced design complexity. Early examples include an AI solid-state circuit breaker about 50% smaller and 20% cooler than existing designs, and EV traction inverters with up to 4x higher power density and 15% lower power losses versus conventional approaches.

Positive

Power density increased by approximately 3–5x versus current solutions, depending on application
AI circuit breaker prototype about 50% smaller and 20% cooler than existing designs
EV traction inverter up to 4x higher power density and 15% lower power losses than conventional approaches
Development cycles designed to be reduced to as little as four months for some applications
Subaru collaboration as an early engagement partner to evaluate EPP for future EV architectures

Negative

None.

News Explained

onsemi has unveiled EPP, but says sampling is only expected to begin in 2026. Subaru is an early engagement partner evaluating the platform and is expected to receive engineering samples, simulation models and technical support, so the release describes development-stage availability rather than a completed product rollout.

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Market Reaction – ON

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$26.07B Market Cap

Following this news, ON has declined 8.52%, reflecting a notable negative market reaction. Our momentum scanner has triggered 83 alerts so far, indicating high trading interest and price volatility. The stock is currently trading at $66.96. Trading volume is elevated at 2.8x the average, suggesting increased selling activity.

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Market Context

ON's prior AI power-architecture announcement on Jul 29 was followed by a 0.48% decline over 24 hour...

Analysis

ON's prior AI power-architecture announcement on Jul 29 was followed by a 0.48% decline over 24 hours; that documented comparison was relevant because EPP also addressed AI power delivery, while this article reported a new architecture rather than operating results.

Key Figures

Power density improvement: 3–5x higher Development cycle: As little as four months Circuit-breaker size reduction: Approximately 50% smaller +4 more

Power density improvement: 3–5x higher; Compared with current solutions, depending on application
Development cycle: As little as four months; EPP platform development objective
Circuit-breaker size reduction: Approximately 50% smaller; Early EPP-based solid-state circuit-breaker design versus existing designs
Circuit-breaker cooling improvement: 20% cooler; Early EPP-based solid-state circuit-breaker design versus existing designs
EV inverter power density: Up to 4x higher; Compared with conventional approaches
EV inverter power losses: 15% lower; Compared with conventional approaches
Sampling: 2026; Expected sampling with strategic customers and ecosystem participants

Previous AI Reports

2 past events · Latest: Jul 29

Same Type 2 events

Jul 29
AI power collaboration

24h Move

-0.5%

Collaboration with NVIDIA on 800 VDC architectures for AI data centers
Oct 30
Vertical GaN launch

24h Move

-1.1%

Introduced vertical GaN semiconductors for AI and electrification applications

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

silicon carbide (sic), gallium nitride (gan), parasitic inductance

3 terms

silicon carbide (sic) technical

"integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride"

Silicon carbide (SiC) is a very durable material made from silicon and carbon, often used in high-performance electronics and industrial tools. It matters because it can handle extreme heat and voltage better than regular materials, making devices more efficient and longer-lasting, especially in electric vehicles and power systems.

gallium nitride (gan) technical

"silicon carbide (SiC) and gallium nitride (GaN) technologies"

Gallium nitride (GaN) is a durable semiconductor material used to build electronic components that switch power and radio signals faster and with less energy loss than older silicon parts. Think of it as a more efficient, high-performance engine that lets devices be smaller, run cooler, and handle higher voltages; investors watch GaN adoption because it can lower manufacturing and operating costs, enable new products, and shift competitive advantage and profit margins across chipmakers and equipment makers.

parasitic inductance technical

"Reduce electrical losses through lower parasitic inductance"

Parasitic inductance is the unwanted tendency of traces, wires, component leads or circuit layouts to act like tiny coils that resist rapid changes in electric current, similar to how a heavy flywheel resists quick speed shifts. It matters to investors because it can degrade high-speed signal integrity, cause voltage spikes, create electromagnetic interference, raise testing and compliance costs, and force design changes that affect product performance, manufacturing yield and time to market.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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09/16/2026 - 02:30 PM

Platform uses silicon wafer itself as the package and introduces a highly integrated approach to power system design across automotive, industrial, and AI data center markets

Summary: onsemi today unveiled the Embedded Power Platform (EPP), redefining system power delivery through unprecedented power density and integration of multiple dies into a single silicon device. By jointly optimizing electrical, mechanical and thermal performance within a single architecture, EPP enables up to 3 – 5x higher power density compared with current solutions with a highly integrated approach to power system design. This helps customers reduce complexity while scaling for the increasing demands of AI infrastructure and electrification.

SCOTTSDALE, Ariz., Sept. 16, 2026 (GLOBE NEWSWIRE) -- onsemi today unveiled the Embedded Power Platform (EPP), a breakthrough architecture that uses the silicon wafer itself as the foundation of the package and introduces a highly integrated approach to power system design. Designed as a scalable platform, EPP brings electrical, mechanical and thermal design together from the outset to help customers achieve higher power density, improve system performance and accelerate development in AI, electrification and autonomous applications.

“For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture,” said Hassane El-Khoury, President and CEO of onsemi. “EPP brings together advanced semiconductor technologies, manufacturing and system-level optimization into a common architecture that can evolve alongside future innovations. This approach can redefine how power systems are built and create a new foundation for AI infrastructure, electrification and automation.”

What’s New: EPP reimagines the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a highly integrated wafer-level architecture. Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market.

EPP also leverages onsemi’s standard 12-inch silicon wafer manufacturing capabilities, bringing key integration processes into the precision and control of the semiconductor fab. This applies mature semiconductor design tools, wafer-level manufacturing and advanced simulation capabilities to power-system integration, helping improve performance while accelerating innovation.

Subaru Corporation is one of the first early engagement partners for EPP, working with onsemi to evaluate how the platform could support future electrified vehicle architectures. Through the collaboration, Subaru will gain early access to engineering samples, simulation models and technical expertise as the companies explore opportunities to improve vehicle performance, streamline development and accelerate innovation.

Why It Matters: AI infrastructure, electrified transportation, industrial automation are all competing for the same critical resource: power. Customers need to move and manage more electricity within increasingly compact systems while controlling heat, efficiency, cost and development time. Yet many of today's power systems are still developed using traditional design approaches that treat power electronics, mechanical design and thermal design as separate engineering challenges, with each layer optimized independently and sequentially. Decisions made at one stage can create compromises in another, leading to additional engineering iterations, costly late-stage changes and longer development cycles.

EPP replaces that sequential model with a common platform that can be co-designed, co-simulated and co-optimized. This approach is designed to help customers:

- Achieve 3 – 5x higher power density, depending on the application
- Accelerate development cycles to as little as four months
- Improve thermal performance and heat dissipation
- Reduce electrical losses through lower parasitic inductance
- Enable greater device control and higher switching frequencies
- Identify design trade-offs earlier and reduce costly late-stage changes
- Scale a common architecture across power levels, device types, applications semiconductor technologies

AI Infrastructure Applications: As AI rack power increases, more space and cooling capacity must be dedicated to the systems that deliver, convert and protect that power. This can limit how much compute capacity can fit within a rack. In an early EPP-based solid-state circuit-breaker design, the solution was approximately 50% smaller and 20% cooler than existing designs. By reducing packaging overhead and using the full EPP footprint to conduct heat, EPP can support more compact power systems, improve thermal management and enable greater power density in AI infrastructure.
Electric Vehicle Applications: Electric vehicle traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size. EPP addresses these challenges with up to 4x higher power density and 15% lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs. Its scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes. This approach can reduce R&D and manufacturing costs, accelerate qualification and development cycles, improve vehicle range or lower system costs, and help bring new vehicle programs to market faster.

The AI era is creating new infrastructure challenges that cannot be solved by computing power alone. As power becomes one of the defining constraints on future innovation, EPP represents a fundamentally new approach to how energy is delivered, managed and optimized. By turning the silicon wafer into the package itself, onsemi is establishing a foundation for the next generation of AI, electrification and autonomous systems.

Availability: EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications.

More Information:

About Embedded Power Platform:

About onsemi

onsemi (Nasdaq: ON) delivers intelligent power and sensing technologies that enable electrification, energy efficiency, safety, and automation across automotive, industrial, and AI data center end-markets. With a highly differentiated and innovative product portfolio, onsemi helps customers solve complex challenges to achieve higher efficiency, improved performance, and lower system cost, while supporting a safer, cleaner, and more energy-efficient world. onsemi is part of the S&P 500^®index. Learn more about onsemi at www.onsemi.com.

onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.

Contacts

Krystal Heaton
Director, Head of Public Relations
onsemi
(480) 242-6943
Krystal.Heaton@onsemi.com

Photos accompanying this announcement are available at:
https://www.globenewswire.com/NewsRoom/AttachmentNg/493dcb4e-d494-476b-b82f-8744b69b9479

https://www.globenewswire.com/NewsRoom/AttachmentNg/45506b9c-a7fa-4412-ac06-3fd4480375f3

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

When will onsemi’s Embedded Power Platform be available to customers?

EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants, focusing initially on automotive and AI applications.

How does the Embedded Power Platform change power system design compared to traditional approaches?

The platform turns the silicon wafer into the package, enabling multiple devices such as FETs, drivers and controllers to be embedded and co-optimized electrically, thermally and mechanically. This replaces sequential design flows with a common architecture that can be co-designed, co-simulated and co-optimized from the outset.

What role is Subaru playing in the adoption of EPP?

Subaru is an early engagement partner working with onsemi to evaluate how EPP could support future electrified vehicle architectures. Subaru will receive early access to engineering samples, simulation models and technical expertise as the companies explore ways to improve vehicle performance and streamline development.

Which end markets does onsemi target with EPP?

The platform is aimed at AI data center infrastructure, electrified transportation including electric vehicle traction inverters, and industrial automation and autonomous applications that require higher power density and enhanced thermal performance.

onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era