PDF Solutions Secures Landmark Contract with Global IDM Customer
PDF Solutions (Nasdaq: PDFS) has secured a landmark multi-year contract with a major global semiconductor manufacturer to expand deployment of its eProbe® tools, Characterization Vehicle® infrastructure, and Exensio® analytics software across multiple high-volume manufacturing facilities.
The agreement includes multiple eProbe systems deployment in 2025, featuring contactless testing of 3D semiconductor structures using electron beam technology. The integration combines eProbe DirectScan™ with test chips and analytics software to enhance yield learning and diagnosis to ppb levels. The implementation will utilize PDF Solutions' secureWISE® network for remote support.
The company reaffirmed its full-year 2025 revenue growth guidance of 21% to 23% compared to 2024.
PDF Solutions (Nasdaq: PDFS) ha assicurato un importante contratto pluriennale con un importante produttore globale di semiconduttori per espandere l'adozione dei suoi strumenti eProbe®, dell'infrastruttura Characterization Vehicle® e del software analitico Exensio® in numerosi stabilimenti di produzione ad alto volume.
L'accordo prevede il dispiegamento di più sistemi eProbe nel 2025, con test non in contatto di strutture 3D dei semiconduttori tramite tecnologia a fascio elettronico. L'integrazione combina eProbe DirectScan™ con test chips e software analitico per migliorare l'apprendimento del rendimento e la diagnosi fino a livelli ppb. L'implementazione utilizzerà la rete secureWISE® di PDF Solutions per l'assistenza da remoto.
L'azienda ha riaffermato la guidance di crescita dei ricavi per l'intero 2025 tra il 21% e il 23% rispetto al 2024.
PDF Solutions (Nasdaq: PDFS) ha asegurado un contrato histórico de varios años con un importante fabricante global de semiconductores para ampliar la implementación de sus herramientas eProbe®, la infraestructura Characterization Vehicle® y el software analítico Exensio® en varias instalaciones de fabricación de alto volumen.
El acuerdo contempla el despliegue de varios sistemas eProbe en 2025, con pruebas sin contacto de estructuras 3D de semiconductores mediante tecnología de haz de electrones. La integración combina eProbe DirectScan™ con chips de prueba y software analítico para mejorar el aprendizaje de yield y el diagnóstico hasta niveles de ppb. La implementación utilizará la red secureWISE® de PDF Solutions para soporte remoto.
La compañía reafirmó su guía de crecimiento de ingresos para todo 2025 de entre el 21% y el 23% respecto a 2024.
PDF Solutions (나스닥: PDFS)은(는) 주요 글로벌 반도체 제조업체와의 다년 계약을 성사시켜 eProbe® 도구, Characterization Vehicle® 인프라, Exensio® 분석 소프트웨어의 배치를 여러 대량생산 시설에 확대했습니다.
계약에는 2025년 다수의 eProbe 시스템 배치가 포함되며, 전자빔 기술을 이용한 3D 반도체 구조의 비접촉 테스트를 특징으로 합니다. 이 통합은 eProbe DirectScan™를 시험 칩 및 분석 소프트웨어와 결합하여 수율 학습과 진단을 ppb 수준으로 향상시킵니다. 구현은 원격 지원을 위한 PDF Solutions의 secureWISE® 네트워크를 활용합니다.
회사는 2025년 전체 매출 성장 가이드를 2024년 대비 21%에서 23%로 재확인했습니다.
PDF Solutions (Nasdaq : PDFS) a obtenu un contrat-cadre multinationaux avec un grand fabricant mondial de semiconduteurs pour étendre le déploiement de ses outils eProbe®, de son infrastructure Characterization Vehicle® et de son logiciel analytique Exensio® dans plusieurs installations de fabrication à haut débit.
L'accord prévoit le déploiement de plusieurs systèmes eProbe en 2025, avec des tests sans contact de structures 3D de semiconduteurs utilisant la technologie au faisceau d'électrons. L'intégration associe eProbe DirectScan™ à des puces de test et au logiciel analytique pour améliorer l'apprentissage sur les rendements et le diagnostic jusqu'à des niveaux ppb. La mise en œuvre utilisera le réseau secureWISE® de PDF Solutions pour le support à distance.
L'entreprise a réaffirmé son objectif de croissance du chiffre d'affaires pour l'ensemble de 2025 entre 21 % et 23 % par rapport à 2024.
PDF Solutions (Nasdaq: PDFS) hat einen bahnbrechenden, mehrjährigen Vertrag mit einem großen globalen Halbleiterhersteller gesichert, um den Einsatz seiner eProbe®-Tools, der Characterization Vehicle®-Infrastruktur und der Exensio®-Analytics-Software in mehreren Hochvolumen-Fertigungsanlagen auszubauen.
Die Vereinbarung sieht den Einsatz mehrerer eProbe-Systeme im Jahr 2025 vor, einschließlich kontaktlosem Testen von 3D-Halbleiterstrukturen mit Elektronenstrahltechnologie. Die Integration kombiniert eProbe DirectScan™ mit Test-Chips und Analytik-Software, um Yield-Learning und Diagnose auf ppb-Niveau zu verbessern. Die Implementierung wird PDF Solutions' secureWISE®-Netzwerk für Fernsupport nutzen.
Das Unternehmen bestätigte seine Umsatzwachstumsprognose für das Gesamtjahr 2025 von 21% bis 23% gegenüber 2024.
PDF Solutions (بورصة ناسداك: PDFS) أمنت عقدًا تاريخيًا متعدد السنوات مع مُصنّع عالمي رئيسي للدوائر المتكاملة لتوسيع نشر أدواتها eProbe®، وبنية Characterization Vehicle®، وبرنامج التحليلات Exensio® عبر العديد من مرافق الإنتاج ذات الحجم العالي.
يشمل الاتفاق نشر عدة أنظمة eProbe في 2025، مع اختبار غير تلامسي لهيكل 3D للدوائر باستخدام تكنولوجيا شعاع الإلكترون. الدمج يجمع eProbe DirectScan™ مع شرائح الاختبار وبرنامج التحليلات لتعزيز تعلم العائد والتشخيص حتى مستويات ppb. ستستخدم التنفيذ شبكة secureWISE® من PDF Solutions للدعم عن بُعد.
أكدت الشركة مرة أخرى توجيهات نمو الإيرادات للسنة الكاملة 2025 بين 21% و23% مقارنةً بـ 2024.
PDF Solutions (纳斯达克代码：PDFS) 已与一家全球领先的半导体制造商达成具有里程碑意义的多年度合同，拓展其 eProbe® 工具、Characterization Vehicle® 基础设施和 Exensio® 分析软件 在多家高产能制造工厂的部署。
该协议包括在 2025 年部署多套 eProbe 系统，采用电子束技术对 3D 半导体结构进行无接触测试。该集成将 eProbe DirectScan™ 与测试芯片及分析软件结合，提升良率学习与诊断至 ppb 级别。实施将使用 PDF Solutions 的 secureWISE® 网络进行远程支持。
公司重申其 2025 全年收入同比增幅指引为 21% 至 23%，相较 2024 年。
- Secured landmark multi-year contract with major global semiconductor manufacturer
- Expansion of existing contract validates strategic vision and technology effectiveness
- Integration enables enhanced detectability to ppb levels for yield diagnosis
- Strong revenue growth guidance of 21-23% for 2025
- None.
Insights
PDF Solutions secures transformative multi-year contract validating its strategic vision and strengthening its position in semiconductor yield optimization solutions.
This landmark multi-year contract with a major global semiconductor manufacturer represents a significant validation of PDF Solutions' strategic direction in high-volume manufacturing. The deployment of multiple eProbe systems in 2025 demonstrates real-world demand for PDF's integrated approach to yield management at scale.
The contract has three critical components that showcase PDF's competitive advantage in the semiconductor tooling ecosystem. First, the eProbe technology provides contactless testing of 3D semiconductor structures using electron beam technology - essential for advanced node manufacturing where traditional contact testing becomes increasingly problematic. Second, their Characterization Vehicle infrastructure serves as specialized test chips that generate precise yield data. Finally, the Exensio analytics software ties everything together, creating an end-to-end yield optimization platform.
What's particularly noteworthy is how this agreement validates PDF's integrated approach. By combining process characterization data with design layout and in-line fabrication data, PDF can enhance detectability to parts-per-billion levels - a crucial capability as semiconductor geometries continue to shrink and manufacturing complexity increases. This integration capability directly addresses one of the semiconductor industry's most pressing challenges: achieving economic yields on increasingly complex chips.
The secureWISE network component is equally significant, enabling remote equipment support while maintaining security - a must-have feature in today's manufacturing environment where IP protection remains paramount. This comprehensive connectivity creates tangible competitive advantages through faster yield ramps and positions PDF Solutions at the intersection of semiconductor manufacturing and AI implementation.
The company's reaffirmed 21-23
Large 2025 Contract Validates High-Volume Manufacturing Strategy
SANTA CLARA, Calif., Sept. 22, 2025 (GLOBE NEWSWIRE) -- PDF Solutions, Inc. (Nasdaq: PDFS) today announced a landmark contract signing: a significant multi-year agreement to expand a prior contract and deploy eProbe® tools, Characterization Vehicle® infrastructure, and associated Exensio® analytics software across multiple high-volume manufacturing facilities of a major global semiconductor manufacturer.
Breakthrough Technology Scales to Mass Production
PDF Solutions' eProbe technology delivers contactless testing of 3D semiconductor structures using electron beam, optimized for each wafer's specific design characteristics. This agreement encompasses multiple eProbe systems with deployment in 2025, supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis.
The contract marks a pivotal milestone that validates PDF Solutions' strategic vision and demonstrates the critical role of eProbe technology in both advanced node development and high-volume manufacturing.
Integration of Process characterization, Design and in-line Fabrication data
PDF Solutions combines the eProbe DirectScan™ application with Characterization Vehicle test chips and Exensio analytics software to enable faster yield learning in high-volume manufacturing environments.
This landmark contract validates the approach of integrating process characterization data with design layout data and in-line fabrication data to enhance detectability to ppb levels to accelerate root cause for yield diagnosis and variability control.
Secure Connected Solutions Drive Value
PDF Solutions will deploy eProbe tools and associated software at the Foundry’s manufacturing sites, using PDF Solutions’ secureWISE® network to provide secure remote equipment support and maintenance. This deployment exemplifies PDF Solutions' strategic vision: creating a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem.
Comprehensive connectivity is essential for achieving faster yield ramps and delivering on the promise of AI in semiconductors. To successfully implement AI solutions, the industry needs automated connections between data sources, tools, and enterprise software systems across the entire semiconductor supply chain.
Reaffirming Financial Outlook
PDF Solutions reaffirms its full-year 2025 revenue growth guidance of
About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.
Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com.
Headquartered in Santa Clara, California, PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.
Forward-Looking Statements
This press release includes forward-looking statements regarding the Company’s future expected business performance and financial results, including expectations about total revenue growth for 2025, portfolio strength, and momentum, and other statements identified by words such as “could,” “expects,” “intends,” “may,” “plans,” “potential,” “should,” “will,” “would,” or similar expressions and the negatives of those terms, that are subject to future events and circumstances. Other than statements of historical fact, all statements contained in this press release are forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with: the effectiveness of the Company’s business and technology strategies; current semiconductor industry trends and competition; rates of adoption of the Company’s solutions by new and existing customers; project milestones or delays and performance criteria achieved; cost and schedule of new product development and investments in research and development; the continuing impact of macroeconomic conditions, including inflation, changing interest rates and tariffs, the evolving trade regulatory environment and geopolitical tensions, and other trends impacting the semiconductor industry, the Company’s customers, operations, and supply and demand for its products; supply chain disruptions; changes in laws and regulations, including recent tax and data privacy laws and regulations, or the interpretation or enforcement thereof; the success of the Company’s strategic growth opportunities and partnerships; recent and future acquisitions, strategic alliances and relationships and the Company’s ability to successfully integrate acquired businesses and technologies; whether the Company can successfully convert backlog into revenue; customers’ production volumes under contracts that provide Gainshare; the sufficiency of the Company’s cash resources and anticipated funds from operations; the Company’s ability to obtain additional financing if needed; and other risks and uncertainties discussed in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Report on Form 10-K for the year ended December 31, 2024, Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K and any amendments to such reports. All forward-looking statements made in this press release and the conference call are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements nor the reasons why actual results could differ materially from those projected in such statements.
Characterization Vehicle, DirectScan, DEX, eProbe, Exensio, PDF Solutions, secureWISE, and the PDF Solutions logo are trademarks or registered trademarks of PDF Solutions, Inc. and/or its subsidiaries in the United States and other countries. Other trademarks used herein are the property of their owners.
| Company Contacts: | |||
| Sonia Segovia Investor Relations | Adnan Raza Chief Financial Officer | ||
| Tel: (408) 938-6491 | Tel: (408) 9280-7900 | ||
| Email: sonia.segovia@pdf.com@pdf.com | Email: adnan.raza@pdf.com | ||
FAQ
What is the significance of PDF Solutions' new contract announcement in 2025?
How does PDF Solutions' eProbe technology work in semiconductor manufacturing?
What is PDF Solutions' revenue growth guidance for 2025?
How does PDF Solutions integrate its different technologies for semiconductor manufacturing?
What role does secureWISE® play in PDF Solutions' new contract implementation?
