Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design

Key Terms

thermal interface materials technical

Materials placed between heat-generating components and heat sinks or enclosures to conduct heat away and fill microscopic gaps, improving thermal contact much like grease between an engine and its cooler. They matter to investors because thermal interface materials affect product performance, reliability, size and energy efficiency, influence manufacturing costs and supply chains, and can create market demand for companies that make advanced, high-performance thermal solutions.

thermal conductivity technical

Thermal conductivity is a physical property that measures how quickly heat passes through a material; think of it as how fast a metal spoon becomes hot when left in hot soup versus a wooden spoon that stays cool. Investors care because it affects product performance, energy efficiency, manufacturing costs and safety—factors that influence operating expenses, market competitiveness and long-term durability of materials used in industries like electronics, construction, automotive and energy.

silicon carbide technical

Silicon carbide is a hard, durable material made from silicon and carbon, often used in industrial applications like cutting tools and electronics. Its ability to withstand high temperatures and conduct electricity efficiently makes it valuable in manufacturing advanced electronic devices. For investors, companies working with silicon carbide are seen as key players in the growing market for high-performance electronics and energy-efficient technologies.

gallium nitride technical

Gallium nitride is a durable semiconductor material used to make electronic components that switch faster, handle higher voltages, and waste less energy than older silicon parts. Think of it as a lighter, more efficient motor in an appliance: it lets devices shrink, run cooler and save power, which can lower manufacturing costs, enable new products and boost sales or margins for companies that adopt it—key factors investors watch.

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New Laird™ Tflex™ CR910 liquid gap filler and Laird™ Tgrease™ 3000 thermal grease expand Qnity’s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain

WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler, and Tgrease™ 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications.

Increasingly complex electronic architecture has made thermal management a foundational design requirement. Designers must manage increasing power densities while working with tighter tolerance and more complex assemblies—balancing performance, manufacturability, and long-term reliability under demanding, real-world conditions.

“As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry's most important engineering challenges," said Chuck Xu, President, Interconnect Solutions, Qnity. "Thermal management is no longer simply about protecting components—it's about enabling the next generation of innovation. These innovations reflect Qnity's broader commitment to delivering the technologies and engineering solutions that power progress across the semiconductor and electronics ecosystem."

Drawing on its deep expertise in materials science and application engineering, Qnity works closely with customers to develop thermal management solutions that not only solve today's design challenges but also prepare for future technology roadmaps.

Laird™ Tflex™ CR910 dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance.

Laird™ Tgrease™ 3000 is a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease™ 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.

Learn more about how Qnity is powering the next leap in electronics at www.qnityelectronics.com.

About Qnity
Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ^® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260728823961/en/

Media Contact
Ashley Boucher
Ashley.Boucher@qnityelectronics.com

Source: Qnity Electronics, Inc.