Rambus Inc. reports developments as a semiconductor chips and silicon IP provider focused on high-performance memory and interconnect technology for data-intensive computing. Company news commonly covers PCIe IP, HBM memory controller IP, DDR5 and LPDDR5 memory interface chipsets, and related products for AI, cloud, data center, and high-performance computing systems.
Recurring updates also include quarterly financial results, product revenue and licensing activity, cash flow commentary, conference presentations, and leadership or board changes. Product announcements often center on bandwidth scaling, low latency, signal and power integrity, and secure data movement across memory subsystems and advanced computing infrastructure.
Rambus (NASDAQ:RMBS) reported third-quarter 2026 revenue of $218.3 million, up 22% year over year and above its guidance range. GAAP diluted earnings per share rose to $0.69 from $0.44 a year earlier; non-GAAP diluted earnings per share reached $0.84. Product revenue was $114.3 million, up 15% sequentially and 22% year over year. Royalties were $77.0 million, and contract and other revenue was $27.0 million.
GAAP net income rose to $74.6 million from $48.4 million, while operating margin increased to 38% from 35%. Operating cash flow reached a record $102.5 million. Cash, cash equivalents and marketable securities fell $48.0 million sequentially to $776.9 million, mainly reflecting share repurchases. Rambus expects fourth-quarter revenue of $227 million to $233 million and GAAP diluted earnings per share of $0.68 to $0.76. Achieving the revenue outlook requires signing customer agreements.
Rambus (RMBS) entered an agreement with ChipAgents to apply agentic AI to chip development and became an investor in the company.
Rambus is adopting the ChipAgents platform companywide, including its chip and silicon intellectual property (IP) design and verification workflows. The companies will also combine Rambus semiconductor expertise and tailored silicon IP with ChipAgents technology for customer design and IP integration across customers’ preferred design environments. Rambus expects the adoption to accelerate development and improve engineering productivity; these are intended benefits rather than reported results.
Rambus (RMBS) announced a power-management chip designed for upcoming LPDDR6 SOCAMM2 server-memory modules used in future AI infrastructure. The chip is currently sampling to lead customers. LPDDR6 SOCAMM2, a compact, modular server-memory architecture using low-power memory, remains in development.
Developed in technical cooperation with customers and ecosystem partners, the chip extends Rambus' LPDDR-based server-module portfolio beyond its existing LPDDR5X SOCAMM2 chipset. Together with Rambus' SPD Hub, it is designed to support module-level power management, monitoring and fault protection. The power-management chip converts the system supply voltage to the levels required by LPDDR6 memory and other active chips on the module.
Rambus (RMBS) will hold a conference call on October 26, 2026, to discuss its third quarter fiscal year 2026 results.
The call begins at 2:00 p.m. Pacific Time and will be webcast through investor.rambus.com. A replay will be available afterward on the Rambus Investor Relations website or by telephone for one week.
Rambus (RMBS) introduced its CryptoManager™ Root of Trust supporting the Caliptra™ specification, providing a production-ready Root of Trust and security orchestration platform for mission-critical data center and AI SoCs.
The solution is interoperable with the open-source Caliptra framework, enabling designers to extend Caliptra-based designs into a complete security subsystem. It combines a secure RISC-V processor, protected memory, key and data storage, cryptographic accelerators and secure interfaces, and operates alongside an unmodified Caliptra core to keep sensitive operations within a protected boundary while extending trust across the wider platform.
CryptoManager Root of Trust also adds platform-level security monitoring, policy enforcement, lifecycle management, side‑channel and fault‑injection protections, cryptographic agility including post‑quantum algorithms, and support for certifications such as FIPS 140‑3 and SESIP.
Rambus (NASDAQ: RMBS) has initiated a $100 million accelerated share repurchase (ASR) program with Mizuho Markets Americas, through its agent Mizuho Securities USA, to buy back its common stock as part of its existing board-authorized repurchase program.
According to Rambus, the company will pre-pay $100 million to the dealer and receive an initial delivery of approximately 796,000 shares. The final number of shares repurchased will be based on the volume-weighted average price of Rambus stock during the transaction term, less a discount. The ASR is expected to be completed by the end of the third quarter of 2026 and is described as aligned with the company’s focus on disciplined capital allocation and long-term stockholder value.
Rambus (NASDAQ: RMBS) reported record second-quarter 2026 revenue of $207.4 million, up 20% year over year and above guidance of $192–$198 million. Product revenue reached a record $99.2 million, up 13% sequentially and 22% year over year, with royalties at $84.2 million and contract and other revenue at $24.0 million.
GAAP diluted EPS was $0.61 and non-GAAP diluted EPS was $0.77, both above the non-GAAP guidance range. GAAP operating income was $72.7 million (35% margin) and non-GAAP operating income was $93.7 million (45% margin). Operating cash flow was $61.2 million, bringing cash, cash equivalents and marketable securities to $824.9 million.
For the third quarter of 2026, Rambus expects revenue of $210–$216 million, including product revenue of $110–$116 million, royalties of $69–$75 million, and contract and other revenue of $25–$31 million. The company guides GAAP diluted EPS of $0.59–$0.67 and non-GAAP diluted EPS of $0.75–$0.82, and highlighted expanded offerings for AI data center systems such as DDR5 9600 memory chipsets and PCIe 7 Switch IP.
Rambus (NASDAQ: RMBS) introduced its DDR5 9600 Server RDIMM chipset for next-generation AI and data center platforms. Centered on the 6th Generation RCD06, it delivers up to 9600 MT/s, a 20% data-rate increase, targeting higher memory bandwidth, capacity and power efficiency.
The complete solution includes the RCD06, PMIC5030 power management IC, SPD Hub and temperature sensor ICs to simplify RDIMM design and improve system reliability for advanced CPU-based servers.
Rambus (Nasdaq: RMBS) will hold a conference call on Monday, July 27, 2026, at 2:00 p.m. Pacific Time to discuss its second quarter fiscal year 2026 results. The call will be webcast via the Rambus investor website, with replay options available.
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