Welcome to our dedicated page for Rambus Del news (Ticker: RMBS), a resource for investors and traders seeking the latest updates and insights on Rambus Del stock.
Rambus Inc. reports developments as a semiconductor chips and silicon IP provider focused on high-performance memory and interconnect technology for data-intensive computing. Company news commonly covers PCIe IP, HBM memory controller IP, DDR5 and LPDDR5 memory interface chipsets, and related products for AI, cloud, data center, and high-performance computing systems.
Recurring updates also include quarterly financial results, product revenue and licensing activity, cash flow commentary, conference presentations, and leadership or board changes. Product announcements often center on bandwidth scaling, low latency, signal and power integrity, and secure data movement across memory subsystems and advanced computing infrastructure.
Rambus (Nasdaq: RMBS) announced that company leaders will present at three investor events in June 2026: the Baird 2026 Global Consumer, Technology & Services Conference, the Evercore 2026 Global TMT Conference, and the Rosenblatt 6th Annual Technology Virtual Summit.
All presentations will be webcast live and available for replay on the Rambus investor relations website.
Rambus (NASDAQ: RMBS) introduced a PCIe 7.0 Switch IP with Time Division Multiplexing (TDM) aimed at AI, cloud, and HPC systems. The IP targets higher link utilization, low latency, deterministic performance, and support for disaggregated and pooled compute architectures, extending Rambus' PCIe product family.
The switch is designed for integration into ASICs and complements controllers, retimers, and debug solutions to help system designers scale fabrics and simplify architectures for next‑generation AI clusters.
Rambus (NASDAQ: RMBS) appointed Sumeet Gagneja as senior vice president and chief financial officer, effective April 29, 2026. Gagneja will lead the global finance organization, overseeing financial strategy, capital allocation, and investor engagement while reporting to CEO Luc Seraphin.
Gagneja previously served as divisional CFO for AMD Data Center and held senior finance roles at Western Digital Flash, Xilinx, Innovium, Maxim Integrated, Avago, and Intel; he holds an MBA from University of Michigan Ross and is a California CPA.
Rambus (NASDAQ:RMBS) reported Q1 2026 results with GAAP revenue of $180.2M, product revenue of $88.0M (up 15% YoY), licensing billings of $70.8M, and $83.2M cash provided by operations. GAAP diluted EPS was $0.55. Cash, cash equivalents, and marketable securities totaled $786.1M as of March 31, 2026.
The company provided Q2 2026 outlook: product revenue $95–$101M, licensing billings $76–$82M, and diluted share count of 110M.
Rambus (NASDAQ: RMBS) announced a SOCAMM2 server-module chipset to enable LPDDR5X-based memory modules for AI servers. The chipset supports JEDEC-standard LPDDR5X up to 9.6 Gb/s, adds an SPD Hub for module ID/telemetry, and includes 12A and 3A voltage regulators.
This is the first product in a planned family of LPDDR-based server module chipsets designed for lower-power, high-bandwidth, compact, serviceable memory in AI data centers.
Rambus (Nasdaq: RMBS) said it will discuss first quarter fiscal 2026 results on a conference call on Monday, April 27, 2026 at 2:00 p.m. Pacific Time. The call will be webcast and accessible via the Rambus investor website.
A replay will be available on the investor website and by phone for one week using the provided access numbers and ID# 9039474.
Rambus (NASDAQ: RMBS) unveiled an industry-leading HBM4E Memory Controller IP on March 4, 2026, targeting AI accelerators, GPUs and HPC. The controller supports up to 16 Gbps per pin, delivering 4.1 TB/s per HBM4E device and enabling over 32 TB/s for systems with eight devices. The IP pairs with third-party PHYs and is available for licensing with early access design engagements.
Rambus (Nasdaq: RMBS) announced executives will present at the Morgan Stanley Technology, Media & Telecom Conference in San Francisco on Monday, March 2, 2026 at 1:05 p.m. PT.
The presentation will stream live via webcast and a replay will be available on the Rambus Investor Relations website at investor.rambus.com.
Rambus (NASDAQ: RMBS) appointed Victor Peng to its Board of Directors, effective February 12, 2026. Mr. Peng brings more than 40 years of semiconductor leadership, including roles as president of AMD overseeing embedded and data center GPU businesses, AI software, and R&D.
He previously served 14 years at Xilinx in senior roles and currently sits on the boards of KLA and Microchip Technology, adding governance and industry expertise as Rambus pursues AI and data center opportunities.
Rambus (NASDAQ: RMBS) announced that Desmond Lynch, senior vice president and chief financial officer, will resign effective February 27, 2026. John Allen, vice president and chief accounting officer, will serve as interim CFO while a formal search for a permanent successor is underway. Rambus reaffirmed its previously issued guidance for Q1 FY2026.
The company emphasized continuity, citing its finance organization and interim leadership to support execution of its growth strategy and long‑term value delivery.