Kulicke and Soffa Industries (NASDAQ: KLIC) and ROHM Semiconductor (TYO: 6963) have announced the development of a new CuFirst™ Hybrid Bonding Process leveraging K&S's Fluxless Thermo-Compression (FTC) technology. The new process, integrated with the APTURA™ FTC system, aims to address limitations of existing hybrid bonding solutions, such as yield challenges and high costs. The CuFirst process bonds the copper interconnect first, leading to higher yields and lower infrastructure costs. K&S expects its TCB business to grow by 40-50% in fiscal year 2025, driven by its leadership in FTC and growing demand in various markets.
On February 15, 2021, MaxPower Semiconductor announced the dismissal of ROHM Semiconductor USA's lawsuit regarding noninfringement of MaxPower's patents. The U.S. District Court ruled that ROHM USA must arbitrate under the Technology License Agreement with ROHM Japan. MaxPower's CEO expressed confidence in prevailing during arbitration, emphasizing their commitment to protect their technology and intellectual property. This court decision underscores the binding nature of the license agreement and paves the way for the resolution of the ongoing technology dispute.