Silicon Labs Stock Price, News & Analysis

Silicon Labs (NASDAQ: SLAB) announced the general availability of its new FG23L wireless SoC starting September 30, with developer kits available immediately. The FG23L, part of the Series 2 portfolio, delivers secure long-range Sub-GHz connectivity at a competitive price point.

The device features a 146 dB link budget, offering double the range of comparable solutions, with +20 dBm transmit power and battery life exceeding 10 years. It integrates a 78 MHz Cortex-M33 core, dual-core wireless architecture, and Secure Vault™ Mid security, along with 23 GPIOs and comprehensive design tools.

Digi International (NASDAQ: DGII) has announced the launch of Digi XBee® for Wi-SUN®, a comprehensive solution for IP-based mesh networks targeting smart city, utility, renewable energy, and industrial IoT applications. The solution, developed in collaboration with Silicon Labs, integrates modules built on Silicon Labs' EFR32 platform, Digi XBee Hive™ Border Routers, and advanced network management tools.

The technology leverages Wi-SUN protocol, which has proven its reliability with over 100 million devices deployed globally. Key features include self-healing wireless mesh networks, support for multiple data rates (50 kbps to 2.4 Mbps), enterprise-grade security through Digi TrustFence®, and compatibility with the Wi-SUN CERTIFIED™ program. The solution also includes unique features like support for Cisco OpenCSMP, enabling potential integration with existing utility Wi-SUN networks.

["First complete end-to-end Wi-SUN solution in the industry with guaranteed interoperability", "Built on proven technology with over 100 million devices deployed globally", "Enhanced security features including Silicon Labs' PSA Level 3-certified Secure Vault High™", "Supports integration with existing utility Wi-SUN networks through Cisco OpenCSMP", "Offers multiple connectivity options including LTE, Wi-Fi, and Ethernet"]

Silicon Labs (NASDAQ:SLAB) has announced its sixth annual Works With IoT conference series for 2025, expanding to multiple global locations. The series includes in-person events in Austin (October 1-2), Shenzhen (October 23), and Bangalore (October 30), followed by a virtual event (November 19-20).

The Austin Summit will feature notable speakers including Ring founder Jamie Siminoff, Turing Award winner Robert Metcalfe, and Silicon Labs executives. The conference will focus on IoT innovations, AI at the edge, and wireless technology developments, bringing together device manufacturers, engineers, and business leaders to discuss smart home, healthcare, and industrial IoT solutions.

Silicon Labs (NASDAQ: SLAB), a leader in low-power wireless technology, has announced its participation in several upcoming investor conferences in August and September 2025. Key executives including CFO Dean Butler, CEO Matt Johnson, and other senior leaders will represent the company at various events.

The schedule includes the KeyBanc Technology Leadership Forum (Aug 11), Needham Virtual Semiconductor Conference (Aug 20), Jefferies Technology Conference (Aug 26), Evercore Conference (Aug 27), and Citi's Global TMT Conference (Sept 4). Webcasts for the KeyBanc and Citi fireside chats will be available on Silicon Labs' investor relations website.

Silicon Labs (NASDAQ: SLAB), a leader in low-power wireless technology, reported strong Q2 2025 financial results with revenue reaching $193 million, marking a 33% year-over-year and 9% sequential growth. The company's Industrial & Commercial segment generated $110 million in revenue (up 25% YoY), while Home & Life revenue reached $83 million (up 45% YoY).

Key achievements include the announcement of the SiXG301, the world's first device achieving PSA Level 4 iSE/SE certification, and the upcoming SiXG302 Series 3 device. For Q3 2025, Silicon Labs projects revenue between $200-210 million with non-GAAP diluted EPS expected between $0.20-$0.40.

Silicon Labs (NASDAQ: SLAB) has achieved a significant milestone by becoming the first company to receive PSA Level 4 certification for its Series 3 Secure Vault security subsystem on the SiXG301 SoC. This certification, the highest level recognized by PSA Certified, validates the system's resilience against sophisticated physical attacks including laser fault injection, side-channel attacks, microprobing, and voltage manipulation.

The company collaborated with Keysight Technologies for validation testing, and the SiXG301 SoC is expected to be commercially available in Q3 2025. Built on a 22 nm process node, the Series 3 platform enhances Silicon Labs' security capabilities and helps device makers comply with new global regulations, including the EU's Radio Equipment Directive (RED) and CRA, US Cyber Trust Mark, and Singapore's Cybersecurity Labeling Scheme.

Silicon Labs (NASDAQ: SLAB), a leader in low-power wireless technology, has scheduled its second quarter 2025 financial results release for Tuesday, August 5, 2025. The company will host an earnings conference call at 7:30 a.m. Central Time on the same day.

The earnings call will be accessible via webcast through the Investor Relations section of Silicon Labs' website. A replay of the call will remain available on the company's investor page until September 4, 2025.

Silicon Labs (SLAB) and Wirepas have reached a significant milestone, shipping 10 million wireless SoCs with Wirepas' RF mesh connectivity software. The partnership has seen major success in India's smart electricity metering sector, with 4 million meters deployed using Silicon Labs' sub-GHz FG23 SoC platform. Notable achievements include Norway's implementation of over 1 million smart meters in a single decentralized mesh network. The collaboration combines Silicon Labs' energy-efficient wireless platforms with Wirepas' decentralized mesh stack to create robust, ultra-resilient IoT networks for industrial applications including smart metering, emergency lighting, industrial monitoring, and building automation. This milestone validates their solution's market readiness and ability to support large-scale infrastructure projects.

Silicon Labs (SLAB) has unveiled its first Series 3 wireless SoC families - SiXG301 and SiXG302 - built on the advanced 22nm process node. The SiXG301, optimized for line-powered applications, features 4MB Flash, 512kB RAM, and supports concurrent multi-protocol operation for Zigbee, Bluetooth, and Matter over Thread networks. It will be generally available in Q3 2025. The SiXG302, designed for battery-powered devices, achieves 15 µA/MHz active current consumption, 30% lower than competitors, and will begin customer sampling in 2026. Both families will include "M" variants for multiprotocol (SiMG301/302) and "B" variants for Bluetooth LE (SiBG301/302). These SoCs target applications across smart cities, industrial automation, healthcare, and smart homes.