Welcome to our dedicated page for Semtech news (Ticker: SMTC), a resource for investors and traders seeking the latest updates and insights on Semtech stock.
Semtech Corporation (SMTC) provides essential semiconductor solutions powering IoT ecosystems, industrial automation, and advanced connectivity. This dedicated news hub offers investors and technology professionals timely updates on corporate developments shaping the analog and mixed-signal semiconductor sector.
Key resources include: Earnings announcements detailing financial performance, product launch updates for IoT connectivity modules, strategic partnership disclosures, and technology innovation reports. All content is curated to help stakeholders track SMTC's role in enabling next-generation communication infrastructure and smart device ecosystems.
Bookmark this page for direct access to verified press releases and objective reporting on Semtech's advancements in signal integrity solutions, advanced protection technologies, and IoT system deployments. Check regularly for critical updates impacting semiconductor industry trends and enterprise connectivity markets.
Semtech (SMTC) has successfully increased its revolving credit facility by $117.5 million, bringing the total facility size to $455.0 million through a Fourth Amendment to its Third Amended and Restated Credit Agreement. The amendment maintains existing financial covenants and material terms while partially replacing borrowing capacity maturing on November 7, 2024.
The facility remains largely undrawn, with only $2.9 million in outstanding letters of credit. Additionally, the company has utilized operational cash flow to repay $10 million on its term loan in Q1 FY2026, aligning with its strategic priority of reducing leverage. Three new institutions have joined the lending group as part of this expansion.
Luxshare-Tech and Semtech (SMTC) have announced the immediate availability of their 1.6T OSFP Active Copper Cable (ACC) at OFC 2025. The new cable, powered by Semtech's CopperEdge™ technology, features 224G/lane linear equalizer/redriver ICs for high-bandwidth connectivity in data center infrastructure.
Key features include:
- Extended reach up to 3 meters at 224G/lane for multi-rack interconnection
- Ultra-low latency under 100ps for AI/ML workloads
- Up to 10x lower power consumption compared to DSP-based solutions
- Protocol-transparent operation for wide application compatibility
The collaboration aims to address interconnect bottlenecks in cluster scaling, particularly benefiting AI/ML data center architectures.
Semtech (SMTC) has unveiled its CopperEdge family of active copper cable and on-board equalization technology, featuring the GN8214, GN8224, and GN8234 solutions. This breakthrough technology targets AI/ML data center deployments with significantly reduced power consumption compared to traditional DSP-based Active Electrical Cables.
Key innovations include:
- Ultra-low power consumption of less than 2W per cable end (90% lower than DSP-based AECs)
- Sub-100ps latency, offering 100x improvement over DSP-based retimers
- Extended reach performance: 800G copper cables to 5m and 1.6T copper cables to 3m
The portfolio supports both current and emerging connectivity standards, with GN8214 optimized for 112G/channel PAM4 applications (800G connectivity), while GN8224 and GN8234 target next-generation 224G/channel PAM4 deployments (1.6T connectivity).
Amphenol and Semtech (SMTC) have unveiled their new 1.6T OSFP Active Copper Cable (ACC) product at OFC 2025, featuring Semtech's CopperEdge™ 224G/lane linear equalizer/redriver ICs. The innovation targets next-generation AI/ML and data center infrastructure needs.
The product offers significant advantages including:
- Ultra-low power consumption (90% lower than DSP-based solutions)
- Ultra-low latency (sub-100ps)
- Simple configuration and control
According to LightCounting analyst Bob Wheeler, 224G/lane data center infrastructure deployment is expected to begin in 2025, with rapid growth anticipated as AI/ML applications drive increased performance and interconnect bandwidth demands. The 1.6T OSFP ACC is now available from Amphenol.
Amphenol Communications Solutions (ACS) and Semtech (SMTC) have unveiled their groundbreaking 1.6T OSFP Active Copper Cable (ACC) at OFC 2025, featuring Semtech's CopperEdge™ 224G/lane linear equalizer/redriver ICs. This innovation targets next-generation AI/ML and data center infrastructure needs.
The solution offers significant advantages including:
- Ultra-low power consumption (90% lower than DSP-based solutions)
- Ultra-low latency (sub-100ps)
- Simple configuration and control
According to LightCounting analyst Bob Wheeler, 224G/lane data center infrastructure deployment is expected to begin in 2025 with rapid growth anticipated as AI/ML applications drive increased performance demands. The collaboration leverages ACS's cable technology and manufacturing capabilities with Semtech's semiconductor expertise to deliver high-bandwidth, low-power connectivity solutions for AI/ML infrastructure.
Semtech (SMTC) has announced the expansion of its optical communications portfolio with DirectEdge 100G per channel single-mode and multi-mode LPO solutions. The new technology focuses on power efficiency for AI infrastructure scaling in data centers.
According to IDC data, AI infrastructure spending will exceed $200 billion globally by 2028. In H1 2024, investments reached $47.4 billion, showing 97% year-over-year growth. The DirectEdge portfolio claims to be over 50% more power efficient than comparable DSP-based solutions by eliminating power-hungry DSPs.
The portfolio includes complete coverage for both single and multimode fiber implementations in 400G and 800G optical modules, featuring various 56GBd PAM4 TIAs (Transimpedance Amplifiers) and Laser Drivers with different specifications and options.
Semtech (SMTC) announced the expansion of its optical communications portfolio to address increasing demands for higher speed and data throughput in AI data centers. The company is enabling 1.6T networks with its 200G per channel Physical Medium Dependent IC (PMD) portfolio while developing 400G per channel technology for 3.2T modules.
The company's FiberEdge™ PMDs deliver performance for 800G and 1.6T modules while meeting power efficiency requirements. The current 200G per channel PMD solutions include various 112GBd PAM4 TIAs (Transimpedance Amplifiers) models - GN1832, GN1834, GN1834D, GN1836, and 112GBd PAM4 Laser Drivers - GN1873 and GN1878. The 400G per channel solutions are under development with samples available to select customers.
Semtech (SMTC) has unveiled its new UEX series for USB 2.0 extension and distribution over IP networks. The series features two products: the UEX1000, a co-processor for Semtech's BlueRiver AVP family, and the standalone UEX2000.
The technology enables protocol-level USB 2.0 extension with advanced monitoring and security controls, supporting distances up to 100m. Key features include:
- IP-friendly discovery approaches for improved performance
- Device class filtering for secure transmission
- Network-wide firmware updates without physical access
- Automatic notification for USB maximum tier violations
- Plug-and-play functionality without software drivers
The technology has already been demonstrated by tt group and IDK at ISE 2025 in Barcelona, targeting applications in industrial control systems, manufacturing automation, video conferencing, and integrated medical operating rooms.
Semtech (SMTC) has unveiled the industry's first ITU-compliant asymmetric 50G PON OLT chipset, comprising the GN7161, GN7153BW, and GN25L80B components. This breakthrough enables the development of compact, power-efficient SFP-DD triple-generation modules for next-generation fiber networks.
The innovation addresses critical challenges in the global fiber broadband market, where increasing bandwidth demands from AI applications, cloud gaming, and remote work are straining existing infrastructure. The new chipset features advanced mixed signal equalization and high integration levels, resulting in reduced power consumption and compact chip scale packaging.
The solution ensures seamless integration into carrier networks supporting GPON, XGSPON, and HS-PON standards. Samples and production volumes are currently available to qualified customers, with Semtech planning to showcase the technology at the OFC 2025 conference in San Francisco.
Semtech (SMTC) announced that CEO Dr. Hong Hou will participate in the CEO panel at the Optica Executive Forum on March 31, 2025, in San Francisco. The panel, moderated by Michael Lebby of GenusTechnik Inc., will include executives from Ciena, Lumentum, and Coherent to discuss industry challenges and opportunities in optical communications.
The discussion will focus on organizational change management, industry challenges, and emerging opportunities in the optical communications market. Following the forum, Semtech will showcase its technologies at the 2025 Optical Fiber Communications Conference and Exhibition (OFC) from April 1-3, featuring demonstrations of data center interconnects, 800G/1.6T optical connectivity, and high-performance analog solutions.
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