Smartkem Announces Preliminary Joint Development Agreement with Manz Asia for Advanced Computer and AI Chip Packaging Solutions
Smartkem (NASDAQ: SMTK) has entered into a preliminary Joint Development Agreement (JDA) with Manz Asia to co-develop next-generation dielectric ink solutions for advanced AI chip packaging applications. The non-binding agreement builds on their existing collaboration, which has already demonstrated an advanced inkjet metalization process for chip packaging at SEMICON® SEA 2025.
The partnership aims to combine Smartkem's semiconductor materials with Manz's precision inkjet technology to develop solutions for 12" wafer-level and large-area panel packaging. The collaboration focuses on improving yield and reducing cost per packaged chip, particularly for data centers deploying AI accelerators. The initiative targets enhanced chip density, faster interconnects, improved thermal management, and more sustainable manufacturing processes.
Smartkem (NASDAQ: SMTK) ha stipulato un accordo preliminare di Joint Development Agreement (JDA) con Manz Asia per co-sviluppare soluzioni innovative di inchiostri dielettrici destinate a packaging avanzato per chip AI di nuova generazione. L'accordo, non vincolante, si basa sulla collaborazione già in corso, che ha già mostrato un processo avanzato di metallizzazione a getto d'inchiostro per il packaging di chip durante SEMICON® SEA 2025.
La partnership mira a unire i materiali semiconduttori di Smartkem con la tecnologia di precisione a getto d'inchiostro di Manz per sviluppare soluzioni per il packaging a livello di wafer da 12” e pannelli di grandi dimensioni. La collaborazione si concentra sull’incremento della resa e sulla riduzione dei costi per chip confezionato, in particolare per i data center che utilizzano acceleratori AI. L’iniziativa punta a migliorare la densità dei chip, velocizzare le interconnessioni, ottimizzare la gestione termica e rendere i processi di produzione più sostenibili.
Smartkem (NASDAQ: SMTK) ha firmado un acuerdo preliminar de Joint Development Agreement (JDA) con Manz Asia para co-desarrollar soluciones de tinta dieléctrica de próxima generación para aplicaciones avanzadas de empaquetado de chips AI. El acuerdo no vinculante se basa en su colaboración existente, que ya ha demostrado un proceso avanzado de metalización por inyección de tinta para empaquetado de chips en SEMICON® SEA 2025.
La asociación busca combinar los materiales semiconductores de Smartkem con la tecnología de inyección de tinta de precisión de Manz para desarrollar soluciones para empaquetado a nivel de oblea de 12” y paneles de gran área. La colaboración se centra en mejorar el rendimiento y reducir el costo por chip empaquetado, especialmente para centros de datos que implementan aceleradores AI. La iniciativa apunta a aumentar la densidad de chips, acelerar las interconexiones, mejorar la gestión térmica y procesos de fabricación más sostenibles.
Smartkem (NASDAQ: SMTK)은 Manz Asia와 차세대 AI 칩 패키징용 유전체 잉크 솔루션 공동 개발을 위한 예비 공동 개발 계약(JDA)을 체결했습니다. 이 비구속적 합의는 이미 SEMICON® SEA 2025에서 고급 잉크젯 금속화 공정을 선보인 기존 협력을 기반으로 합니다.
이번 파트너십은 Smartkem의 반도체 소재와 Manz의 정밀 잉크젯 기술을 결합하여 12인치 웨이퍼 레벨 및 대형 패널 패키징 솔루션을 개발하는 것을 목표로 합니다. 협력은 수율 향상과 AI 가속기를 사용하는 데이터 센터용 패키징 칩당 비용 절감에 중점을 둡니다. 이 이니셔티브는 칩 밀도 향상, 빠른 인터커넥트, 개선된 열 관리 및 보다 지속 가능한 제조 공정을 목표로 합니다.
Smartkem (NASDAQ : SMTK) a conclu un accord préliminaire de Joint Development Agreement (JDA) avec Manz Asia pour co-développer des solutions d’encre diélectrique de nouvelle génération destinées aux applications avancées de packaging de puces AI. Cet accord non contraignant s’appuie sur leur collaboration existante, qui a déjà démontré un procédé avancé de métallisation par jet d’encre pour le packaging de puces lors de SEMICON® SEA 2025.
Le partenariat vise à combiner les matériaux semi-conducteurs de Smartkem avec la technologie de jet d’encre de précision de Manz pour développer des solutions pour le packaging au niveau wafer 12” et les panneaux de grande surface. La collaboration se concentre sur l’amélioration du rendement et la réduction du coût par puce emballée, notamment pour les centres de données utilisant des accélérateurs AI. L’initiative cible une densité de puces accrue, des interconnexions plus rapides, une meilleure gestion thermique et des processus de fabrication plus durables.
Smartkem (NASDAQ: SMTK) hat eine vorläufige Joint Development Agreement (JDA) mit Manz Asia abgeschlossen, um gemeinsam die nächste Generation von dielektrischen Tintenlösungen für fortschrittliche AI-Chip-Verpackungsanwendungen zu entwickeln. Die unverbindliche Vereinbarung baut auf der bestehenden Zusammenarbeit auf, die bereits einen fortschrittlichen Inkjet-Metallisierungsprozess für Chip-Verpackungen auf der SEMICON® SEA 2025 demonstriert hat.
Die Partnerschaft zielt darauf ab, Smartkems Halbleitermaterialien mit Manz' präziser Inkjet-Technologie zu kombinieren, um Lösungen für 12-Zoll-Wafer-Level- und großflächige Panel-Verpackungen zu entwickeln. Der Fokus der Zusammenarbeit liegt auf der Verbesserung der Ausbeute und der Senkung der Kosten pro verpacktem Chip, insbesondere für Rechenzentren, die AI-Beschleuniger einsetzen. Die Initiative strebt eine höhere Chipdichte, schnellere Interkonnektivität, verbesserte Wärmeableitung und nachhaltigere Herstellungsprozesse an.
- Potential for higher yield and lower cost per packaged chip in AI accelerator production
- Demonstrated success in previous collaboration with advanced inkjet metalization process
- Technology could enable improved chip density and faster interconnects for data centers
- Partnership combines complementary expertise in materials science and manufacturing equipment
- Agreement is preliminary and non-binding with no guarantee of definitive agreement
- No specific timeline or financial terms disclosed for the development project
- Success of the technology development and market adoption remains uncertain
Insights
Smartkem's preliminary JDA with Manz Asia targets dielectric ink innovation for AI chip packaging, potentially improving yields and reducing costs.
Smartkem (SMTK) has entered a preliminary Joint Development Agreement with Manz Asia to co-develop next-generation dielectric ink solutions for advanced chip packaging, specifically targeting AI applications. This agreement builds on their existing collaboration that recently yielded a demonstration of advanced inkjet metalization for chip packaging at SEMICON SEA 2025.
The strategic importance of this partnership lies in addressing critical bottlenecks in AI chip packaging. Dielectric inks are crucial components in back-end-of-line processes, particularly for top metal layer insulation and redistribution layer patterning. The collaboration aims to develop solutions for both 12" wafer-level packaging and large-area panel packaging, potentially creating manufacturing paradigms that transcend traditional wafer-based limitations.
If successful, this collaboration could deliver significant manufacturing advantages in three key areas: higher yields, lower cost per packaged chip, and increased chip density. These improvements would be particularly valuable for data centers deploying thousands of AI accelerators, where packaging efficiency directly impacts performance, cost, and thermal management.
However, investors should note the preliminary nature of this agreement. The press release explicitly states the JDA is non-binding, with no assurance regarding the execution of a definitive development agreement or the ultimate outcome of the project. This early-stage collaboration represents potential rather than immediate commercial impact, with significant development work still ahead before any products reach commercialization.
Joint Development Agreement builds on ongoing collaboration with Manz Asia
Smartkem Chairman and CEO, Ian Jenks, comments: "This joint development agreement builds on our collaboration with Manz Asia which has already resulted in our first demonstration at SEMICON® SEA 2025 of an advanced inkjet metalization process for packaging chips for production. Together, we intend to develop scalable, high-performance solutions that address the critical bottlenecks particularly in advanced computer and AI chip packaging. By combining Smartkem's unique semiconductor materials with Manz's precision inkjet technology, we expect to create new manufacturing paradigms that address the demand for 12" wafer-level packaging solutions as well as extend beyond wafer-based limitations to open the door to efficient, large-area panel packaging. If successful our efforts will result in higher yield and lower cost per packaged chip, which we believe is critical for data centers deploying tens of thousands of AI accelerators."
Manz Asia General Manager, Robert Lin, comments, "By combining Smartkem's expertise in material science with Manz Asia's engineering excellence in semiconductor manufacturing equipment, we believe that this JDA will fast-track the industrial adoption of dielectric ink technology, delivering new levels of scalability, resolution, and reliability for future chip integration. Dielectric inks play a critical role in back-end-of-line (BEOL) processes, particularly in top metal layer insulation and redistribution layer (RDL) patterning for advanced packaging. Smartkem's innovative dielectric formulations offer high-resolution patterning, robust film integrity, and excellent chemical compatibility – essential for supporting today's complex interconnect architectures."
As demand for AI computing accelerates, advances in 12" wafer-level packaging and large-area panel packaging could offer a transformative path forward for data center infrastructure. By moving beyond the limitations of traditional wafer-based approaches, panel-level packaging enables higher chip density, faster interconnects, improved thermal management, and more sustainable manufacturing processes. Smartkem and Manz believe that these benefits are essential to scaling the next generation of AI hardware, delivering greater performance and efficiency while reducing cost and environmental impact.
The JDA is preliminary only, is not-binding on the parties and there can be no assurance as to whether or when a definitive development agreement will be executed by the parties or as to the ultimate terms or outcome of any such project.
About Smartkem
Smartkem is seeking to change the world of electronics with a new class of transistors developed using its proprietary advanced semiconductor materials. Our TRUFLEX® semiconductor polymers enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost, high-performance displays. Our semiconductor platform can be used in a range of display technologies including MicroLED, LCD and AMOLED, as well as in applications in advanced computer and AI chip packaging, sensors, and logic.
Smartkem designs and develops its materials at its research and development facility in
The company has an extensive IP portfolio including 140 granted patents across 17 patent families, 14 pending patents and 40 codified trade secrets.
For more information, visit our website or follow us on LinkedIn.
About Manz Asia
Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.
We offer comprehensive equipment solutions encompassing wet chemistry, plating, digital printing, automation, and proprietary software integration for Redistribution Layer (RDL) process—from lab-scale to mass production. Our technologies support key applications in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, covering critical stages of semiconductor packaging.
By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.
For more information, please visit website or follow us on LinkedIn.
Forward-Looking Statements
All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.
Industry Representatives and Media
Selena Kirkwood
Head of Communications for Smartkem
T: +44 (0) 7971 460 364
s.kirkwood@smartkem.com
Analysts and Investors
David Barnard, CFA
Alliance Advisors Investor Relations
T: 1 415 433 3777
dbarnard@allianceadvisors.com
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FAQ
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