Smartkem Collaborates with Manz Asia for Advanced Computer and AI Chip Packaging Solutions
Rhea-AI Summary
Smartkem (SMTK) has announced a collaboration with Manz Asia to demonstrate inkjet printable dielectric layers for advanced computer and AI chip packaging solutions at SEMICON® SEA 2025. The partnership combines Smartkem's specialized dielectric materials with Manz Asia's inkjet printing technology to enable large-area panel chip packaging beyond current 300mm wafer limitations.
The panel level packaging market is projected to reach $600 million by 2030, representing a 27% CAGR from 2024. The collaboration leverages Smartkem's UV curable dielectric layer chemistry and Manz Asia's high-precision inkjet printing equipment to deliver scalable semiconductor packaging solutions. Key advantages of panel level packaging include higher throughput, lower cost per chip, better material utilization, and improved integration capabilities.
Positive
- Panel level packaging market expected to reach $600 million by 2030, with 27% CAGR from 2024
- Partnership enables large-area panel chip packaging beyond current 300mm wafer limitations
- Technology offers lower cost per chip through economies of scale
- Solution provides higher throughput and better material utilization compared to traditional circular wafers
Negative
- None.
News Market Reaction – SMTK
On the day this news was published, SMTK gained 0.93%, reflecting a mild positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Manz
Visit Manz Asia at Booth no. L1314.
Smartkem Chairman and CEO, Ian Jenks, commented: "We're thrilled to be working with Manz Asia to address a fast-growing opportunity in the market for advanced computer and AI chip packaging. As the demand for AI leads to increasingly complex servers, our materials combined with Manz Asia's printing technology have the potential to enable large area panel chip packaging beyond the existing constraints of today's 300mm wafer packaging. Panel level packaging is a market expected to grow to approximately
Manz Asia General Manger, Robert Lin, commented: "Manz Asia is committed to advancing green manufacturing and smart production through the development of high-precision inkjet printing equipment. Our maskless inkjet technology enables accurate material deposition and supports a wide range of inks, making it suitable for various substrates—including PI, ABF, EMC, silicon, and glass—in both wafer and panel formats. The collaboration with Smartkem marks a significant step in demonstrating how our inkjet platform, combined with next-generation dielectric materials, can deliver scalable and sustainable solutions for semiconductor advanced packaging."
Building on the UV curable dielectric layer chemistry developed at Smartkem's R&D facility for thin film transistor fabrication, Smartkem has designed ink formulations suitable for use in advanced computer and AI chip packaging applications. These inks have been co-developed with Manz Asia to be compatible with its existing inkjet-based semiconductor production equipment.
Panel level packaging on rectangular wafers offers key advantages over traditional packaging on circular wafers, including:
- Higher throughput, as a larger print area means more chips can be packaged simultaneously;
- Lower cost per chip from economies of scale with use of printed circuit board like manufacturing equipment;
- Better material utilization from less edge loss compared to circular wafers; and
- Improved integration supported by complex fan-out wafer-level packaging at a larger scale.
About Smartkem
Smartkem is seeking to change the world of electronics with a new class of transistors developed using its proprietary advanced semiconductor materials. Our TRUFLEX® semiconductor polymers enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost, high-performance displays. Our semiconductor platform can be used in a range of display technologies including MicroLED, LCD and AMOLED, as well as in applications in advanced computer and AI chip packaging, sensors, and logic.
Smartkem designs and develops its materials at its research and development facility in
The company has an extensive IP portfolio including 138 granted patents across 17 patent families, 16 pending patents and 40 codified trade secrets. For more information, visit our website or follow us on LinkedIn.
About Manz Asia
Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.
We offer comprehensive equipment solutions encompassing wet chemistry, plating, digital printing, automation, and proprietary software integration for Redistribution Layer (RDL) process—from lab-scale to mass production. Our technologies support key applications in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, covering critical stages of semiconductor packaging.
By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.
For more information, please visit website or follow us on LinkedIn.
About SEMICON®
Forward-thinking semiconductor organizations are implementing practices to reduce the environmental impact of their businesses and manufacturing operations to ensure their resiliency when disruptive events such as geopolitical conflicts, climate-related disasters, and public health crises strike. Initiatives focused on reducing greenhouse gas emissions and water use, deploying renewable energy systems, and improving the energy efficiency of chipmaking equipment are growing in importance.
To thrive in the coming decade and beyond, companies must look beyond short-term performance and focus on building resilience to better withstand unpredictable disruptions to their businesses, the semiconductor industry and global economies. Visit the website for more information.
Forward-Looking Statements
All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.
Industry Representatives and Media
Selena Kirkwood
Head of Communications for Smartkem
T: +44 (0) 7971 460 364
s.kirkwood@smartkem.com
Analysts and Investors
David Barnard, CFA
Alliance Advisors Investor Relations
T: 1 415 433 3777
dbarnard@allianceadvisors.com
[1] Yole Intelligence: Panel Level Packaging 2025 https://www.yolegroup.com/product/report/panel-level-packaging-2025/
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SOURCE Smartkem
FAQ
What is the projected market size for panel level packaging by 2030 according to Smartkem (SMTK)?
What are the main benefits of Smartkem's panel level packaging technology over traditional circular wafers?
What is the purpose of the collaboration between Smartkem (SMTK) and Manz Asia?
When and where will Manz Asia demonstrate Smartkem's dielectric materials?
