Sandisk Corporation (Nasdaq: SNDK) is a developer, manufacturer and provider of data storage devices and solutions based on NAND flash technology. The Sandisk news feed on this page aggregates company announcements, earnings updates and technology disclosures so readers can follow how the business and its flash storage portfolio evolve over time.
Recent Sandisk news releases highlight several themes. The company regularly reports quarterly and annual financial results, including revenue trends, gross margin, operating income and segment performance across markets such as datacenter or cloud, client or edge devices, and consumer. These earnings announcements often include management commentary on demand patterns, AI-related workloads and the company’s outlook for upcoming quarters.
Sandisk also issues technology and product news. Examples in its public communications include the introduction of the UltraQLC platform and high-capacity NVMe enterprise SSDs, as well as updates on BiCS8-based flash memory and High Bandwidth Flash (HBF) for AI inference workloads. Joint announcements with partners such as Kioxia describe new fabrication capacity and advanced 3D flash memory nodes, while a Memorandum of Understanding with SK hynix focuses on standardizing HBF technology.
Corporate and investor-related news items cover topics such as participation in investor conferences, the timing of earnings conference calls, and changes to the Board of Directors, including the appointment of new directors and committee assignments. These releases provide insight into Sandisk’s governance, capital markets engagement and strategic priorities as a standalone company following its separation from Western Digital.
Investors and observers can use this news page to review Sandisk’s historical announcements, track recurring disclosures on AI and flash storage technologies, and monitor ongoing financial and governance updates. Checking this page over time allows readers to see how Sandisk’s flash-based storage strategy and market positioning are reflected in its official communications.
Sandisk (NASDAQ: SNDK) will hold its fiscal first quarter 2027 earnings conference call on October 29, 2026. The call is scheduled for 1:30 p.m. Pacific Time. A live webcast and a replay will be available at investor.sandisk.com.
S&P Dow Jones Indices will rebalance the S&P 100, S&P 500, S&P MidCap 400, and S&P SmallCap 600 before the market opens on September 21, 2026, to keep each index aligned with its target market-cap range.
Dell Technologies, Palo Alto Networks, Arista Networks, and Sandisk will join the S&P 100, while NIKE, Honeywell Aerospace, Simon Property Group, and Colgate-Palmolive exit. Bloom Energy, Everpure, and Illumina will enter the S&P 500, replacing Molson Coors Beverage, The Trade Desk, and Builders FirstSource, which move to the S&P SmallCap 600. Multiple constituents, including HubSpot, AGNC Investment, Corcept Therapeutics, Brinker International, Herc Holdings, Delek US Holdings, AXT, Arcutis Biotherapeutics, AtriCure, Capri Holdings, Boston Beer, and others shift among the S&P MidCap 400 and S&P SmallCap 600.
Sandisk (SNDK) will participate in two investor conferences in early September 2026.
Management presents at Citi's 2026 Global TMT Conference on Tuesday, September 8, 2026 at 9:35 a.m. PT / 12:35 p.m. ET, and at Goldman Sachs Communacopia + Technology Conference 2026 on Wednesday, September 9, 2026 at 11:30 a.m. PT / 2:30 p.m. ET. Live webcasts and archived replays will be available via Sandisk's investor relations website.
Sandisk (Nasdaq: SNDK) used its 2026 Investor Day, “Sandisk In Focus,” to outline a long-term growth strategy centered on NAND innovation, AI-driven storage demand and a new business model built on long-term customer agreements. The company highlighted its CMOS directly Bonded to Array (CBA) platform, a two‑dimensional scaling strategy and new BiCS9 and BiCS10 QLC nodes, including a BiCS10 QLC node with a 60% increase in bit density versus BiCS8.
Sandisk detailed durable New Business Model (NBM) agreements with eight customers, expected to represent about 50% of bits in FY2027 and roughly two‑thirds in FY2028. For FY2028–FY2030, Sandisk’s financial model targets mid‑to‑high‑teens revenue growth, non‑GAAP gross margin of about 80%, operating margin around 75% and adjusted free cash flow margin near 50%, while planning to return 100% of excess cash to shareholders after funding growth investments.
Sandisk (Nasdaq: SNDK) and partner Kioxia unveiled a 9th-generation, high-performance 2Tb QLC 3D flash memory technology aimed at AI-driven and data-intensive infrastructure. The solution uses the companies’ CMOS directly Bonded to Array (CBA) architecture, pairing an advanced CMOS wafer with a proven memory-array platform.
According to Sandisk, the new QLC generation provides higher write/read bandwidth via a 6-plane architecture, improved power efficiency, and a 4.8Gb/s NAND interface speed, a 33% increase over 8th-generation 2Tb QLC devices, while targeting more capital-efficient NAND scaling.
Sandisk (Nasdaq: SNDK) reported fiscal Q4 2026 revenue of $8.97 billion, up 51% sequentially and 372% year-over-year, driven roughly one-third by higher volumes and two-thirds by higher pricing. GAAP net income was $6.90 billion, or $43.97 diluted EPS, while Non-GAAP diluted EPS was $39.25. Q4 GAAP gross margin reached 84.6%, and GAAP operating income was $7.04 billion.
For fiscal 2026, revenue was $20.25 billion, up 175% year-over-year, with GAAP net income of $11.43 billion and diluted EPS of $73.76; Non-GAAP diluted EPS was $70.88. Datacenter revenue grew 437% to $5.15 billion, Edge 195% to $12.16 billion, and Consumer 29% to $2.94 billion. The Board approved an additional $14 billion share repurchase authorization, bringing remaining capacity to $15.5 billion. For Q1 fiscal 2027, Sandisk expects revenue of $10.3–$10.8 billion and Non-GAAP diluted EPS of $44.00–$46.00.
Sandisk (Nasdaq: SNDK) and Kioxia announced their 10th‑generation QLC 3D flash memory on August 4, 2026, claiming up to a 60% increase in bit density over their 8th‑generation, surpassing 37 Gb/mm² and targeting AI, cloud and data‑intensive workloads.
The technology uses a 332‑layer architecture, CMOS directly Bonded to Array (CBA), and a 4.8 Gb/s NAND interface enabled by Toggle DDR6.0 and Separate Command Address protocol. Additional advances such as Power‑Isolated Low‑Tapped Termination (PI‑LTT) are designed to improve I/O power efficiency for modern infrastructure.
Sandisk (Nasdaq: SNDK) and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project (OCP), about six months after the consortium began work in February. The spec, developed within the OCP HBF workstream, also involved contributions from Google and Tenstorrent for technology validation and standard definition.
The specification defines system interfaces, electrical guidelines, xPU‑HBF host interface, reliability and packaging rules for HBF die stacks, and a software user guide for read/write operations. It aims to give AI inference system and accelerator designers a common framework to deploy near-compute, high-capacity, high-bandwidth flash that can coexist with High Bandwidth Memory. Sandisk and SK hynix published the spec openly under OCP to promote HBF as a de facto standard and to accelerate ecosystem development. The announcement also highlights a Sandisk keynote on August 5 and an HBF-focused panel with Sandisk, SK hynix, and Google on August 6 at the Future of Memory and Storage Conference in Santa Clara.
Sandisk (NASDAQ:SNDK) will hold its fiscal fourth quarter and fiscal year 2026 earnings conference call on Wednesday, August 5, 2026, at 1:30 p.m. PT, with live and replay webcasts at investor.sandisk.com.
The company will also host an Investor Day on Thursday, August 13, 2026, at 9:00 a.m. ET, featuring presentations from Chairman and CEO David Goeckeler, CFO Luis Visoso, and other leaders on business status and outlook.
Kioxia and Sandisk (Nasdaq:SNDK) have begun production of their 10th-generation 3D flash memory at the Fab2 (K2) facility at the Kitakami Plant in Japan. K2 previously produced 8th-generation products and will now scale 10th-generation output.
Both generations use CBA (CMOS directly Bonded to Array) technology, targeting high performance, capacity and low power use. The Fab2 plant features earthquake-absorbing design, energy-saving equipment, AI-driven efficiencies and a space-efficient cleanroom layout. The companies also extended their joint venture framework through December 2034, supporting long-term NAND flash development and capital investment.