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STMicroelectronics N.V. reports news on its semiconductor products, manufacturing strategy, financial results, and shareholder matters. The company is an integrated device manufacturer with products spanning analog and mixed-signal chips, power and discrete devices, microcontrollers, digital ICs, RF products, MEMS, image sensors, and other sensing technologies for automotive, industrial, personal electronics, cloud infrastructure, and connected-device applications.
Recurring updates include STM32 microcontroller production and supply-chain localization, ST BrightSense and ST FlightSense sensing products, AI data center power-conversion architectures, robotics vision modules, strategic customer engagements, acquisitions that expand sensor capabilities, quarterly earnings, investor presentations, annual meeting resolutions, dividends, and share-repurchase authorizations.
STMicroelectronics (NYSE: STM) has started volume deliveries of STM32 microcontrollers fully manufactured in China, produced by Huahong using 40nm eNVM technology. Initial mass production covers selected STM32H7 models, with STM32H5 and STM32C5 families planned for local mass production by end of 2026.
The company says this establishes a fully localized STM32 supply chain in China—wafer manufacture, packaging, and testing—offering Chinese customers a dual-supply option with consistent global quality standards.
STMicroelectronics (NYSE: STM) expanded its 800 VDC datacenter power-conversion portfolio on March 17, 2026, adding 800 VDC to 12V and 800 VDC to 6V architectures developed to the NVIDIA 800 VDC reference design. These complement ST's prior 800 VDC to 50V stage to support gigawatt-scale AI compute.
ST highlights system-level efficiency, reduced copper and losses, and prior prototype performance above 98% efficiency and > 2,600 W/in³ power density (Oct 2025).
STMicroelectronics (NYSE:STM) and Leopard Imaging introduced a Jetson-ready multimodal vision module for humanoid and advanced robots on March 16, 2026. The module combines ST 2D RGB-IR imaging, VL53L9CX dToF 3D LiDAR (up to 9 m), and LSM6DSV16X motion sensing, plus NVIDIA Holoscan Sensor Bridge for multi-gigabit Jetson connectivity and NVIDIA Isaac support.
The package includes APIs, AI algorithms, sample apps, simulation models and a build system to accelerate sim-to-real development and reduce SW/HW integration effort for robot builders.
STMicroelectronics (NYSE: STM) and NVIDIA announced a collaboration to integrate ST sensors, STM32 microcontrollers, and motor-control solutions into the NVIDIA Holoscan Sensor Bridge and Isaac Sim ecosystems to accelerate Physical AI development.
Initial deliverables include Leopard Imaging stereo depth camera integration and a high-fidelity ST IMU model available to developers as of March 16, 2026.
STMicroelectronics (NYSE: STM) launched the ST64UWB family on March 10, 2026, a fully integrated ultra-wideband SoC lineup supporting IEEE 802.15.4z and the upcoming IEEE 802.15.4ab standard with multi-millisecond ranging and narrow-band assistance.
The three SoCs (ST64UWB-A100, A500, C100) use 18 nm FD-SOI, claim nearly +3 dB link-budget advantage, roughly 50% range extension, and radar improvements offering 2x accuracy versus 500 MHz channels; devices are sampling to Tier 1s and OEMs.
STMicroelectronics (NYSE: STM) announced it has entered high-volume production of its PIC100 silicon photonics platform on 300 mm lines to supply hyperscalers with 800G and 1.6T transceivers. ST plans to more than quadruple production by 2027 with further expansion in 2028, backed by customer capacity reservations. The company also previewed a PIC100 TSV roadmap to increase optical density and system thermal efficiency and will present demos and papers at OFC 2026.
STMicroelectronics (NYSE: STM) launched the STM32C5 series on March 5, 2026, a new entry-level MCU family built on ST’s 40 nm process with Arm Cortex-M33 cores.
Key facts: production starts now, on-chip Flash from 128Kbyte up to 1Mbyte, prices from $0.64 for 10,000-unit orders, wide -40°C to 125°C operating range, and enhanced security and STM32Cube development tools.
STMicroelectronics (NYSE: STM) announced that its motion-sensing and secure wireless technologies support Qualcomm’s Snapdragon Wear Elite platform, enabling always-on sensing, low-power on‑sensor ML, and secure contactless services for next‑generation wearables.
Key components include the LSM6DSV32X smart inertial module and ST54L NFC controller with embedded secure element, offered with reference designs and development tools to accelerate OEM time to market.
STMicroelectronics (NYSE: STM) will host two investor webcasts in March 2026: ST for Cloud AI on March 9, 2026 at 3:30pm CET / 10:30am ET and ST Intelligent Sensing Enabling the Physical AI on March 16, 2026 at 3:30pm CET / 10:30am ET.
Presentations by Remi El-Ouazzane and Marco Cassis will be followed by Q&A. Live listen-only webcasts and replays will be available at https://investors.st.com.
STMicroelectronics (NYSE: STM) published its Annual Report on Form 20-F for the year ended December 31, 2025 and filed it with the U.S. SEC.
The Form 20-F is prepared on U.S. GAAP and includes complete audited financial statements. Electronic copies are available at www.st.com and www.sec.gov. A free hard copy is available via Investor Relations at +41 22 929 5920 or investors.st.com.