Welcome to our dedicated page for Stmicro news (Ticker: STM), a resource for investors and traders seeking the latest updates and insights on Stmicro stock.
STMicroelectronics (NYSE: STM) is a global leader in semiconductor solutions powering electronics across automotive, industrial, and IoT markets. This page aggregates all official news releases and third-party coverage related to STM's technological advancements and market activities.
Investors and industry professionals will find timely updates on quarterly earnings, product innovations like silicon carbide power modules, and strategic collaborations shaping next-generation mobility and automation solutions. The curated collection includes announcements about microcontroller developments, sensor technologies, and sustainability initiatives.
Key content categories cover financial performance, R&D breakthroughs, manufacturing expansions, and industry recognition. Each update provides insights into STM's role in enabling energy-efficient systems, smart factories, and secure IoT connectivity through its analog and digital semiconductor expertise.
Bookmark this page for streamlined access to STMicroelectronics' latest developments. Check back regularly to stay informed about the company's progress in advancing edge computing, electric vehicle technologies, and industrial automation solutions.
STMicroelectronics (NYSE:STM) announced the immediate resignation of Maurizio Tamagnini from its Supervisory Board. Tamagnini, who joined the board in 2014, served in various leadership roles including Chairman and most recently as Vice-Chairman since 2023. Nicolas Dufourcq, Chairman of ST's Supervisory Board, extended gratitude for Tamagnini's long-term support to the global semiconductor company.
STMicroelectronics (STM) has reported the latest status of its common share repurchase program from March 10-14, 2025. The company repurchased 281,500 ordinary shares (0.03% of issued share capital) at a weighted average price of EUR 22.5101 per share, totaling EUR 6,336,599.10.
The buyback program, approved by shareholders on May 22, 2024, and the supervisory board, aims to fulfill obligations from share option programs and allocations to employees or management. Following these transactions, STM now holds 16,726,512 treasury shares, representing approximately 1.8% of its issued share capital. The shares may be used for employee compensation or other lawful purposes under Market Abuse Regulation article 5(2).
STMicroelectronics (STM) has reported the latest status of its common share repurchase program, conducted between March 3-7, 2025. The company repurchased 427,820 ordinary shares, representing 0.05% of its issued share capital, at a weighted average price of EUR 22.9028 per share, totaling EUR 9,798,288.62.
The buyback program, approved by shareholders on May 22, 2024, and the supervisory board, aims to meet obligations from share option programmes and allocations to employees or management. Following these transactions, STMicroelectronics now holds 16,454,331 treasury shares, approximately 1.8% of its issued share capital. The shares may be held in treasury before being used for the stated purpose or any other lawful purpose under Market Abuse Regulation article 5(2).
STMicroelectronics (NYSE:STM) has implemented Black Duck Software Composition Analysis (SCA) and Coverity Static Analysis to enhance software security and automate SBOM generation for its products, particularly the STM32U3 microcontroller.
The integration aims to comply with the European Cyber Resilience Act (CRA) requirements, which mandate organizations to produce SBOMs and disclose vulnerabilities. The implementation enables STMicroelectronics to generate standardized, machine-readable SBOMs while strengthening its software security practices.
Black Duck, a seven-time Leader in Gartner Magic Quadrant for Application Security Testing, will help STMicroelectronics manage open-source risks and detect security vulnerabilities in proprietary code. The collaboration will be showcased at embedded world 2025 from March 11-13.
STMicroelectronics (NYSE: STM) has unveiled its next-generation STM32WBA6 wireless microcontrollers, designed for IoT connectivity in smart home, health, factory, and agriculture applications. These new MCUs feature enhanced memory capacity with up to 2MB Flash and 512KB RAM, improved wireless capabilities supporting multiple protocols (Bluetooth, Zigbee, Thread, Matter), and advanced security features including SESIP3 and PSA Level3 certifiable assets.
The MCUs offer improved wireless performance with -100dBm sensitivity and are powered by an Arm® Cortex®-M33 core running at up to 100MHz. Key features include USB High Speed, multiple digital interfaces (3 SPI ports, 4 I2C ports, 3 USARTs), and various package options from 7mm x 7mm to ultra-compact 3.78mm x 3.46mm sizes.
The STM32WBA6 series is currently in production with prices starting at $2.50 for 10,000-piece orders. Meta System's CTO confirms successful prototype development with production scheduled for Q2 2025.
STMicroelectronics (NYSE: STM) has unveiled its new STM32U3 microcontrollers (MCUs), designed for ultra-low power applications in remote locations. These MCUs achieve record-breaking performance-per-watt efficiency, doubling the efficiency compared to the previous generation.
The new MCUs are specifically targeted at IoT devices that require extended operation without maintenance, powered by coin cells or ambient energy sources. Key applications include utility meters, healthcare devices, animal care monitors, forest-fire sensors, and industrial sensors.
Notable features include:
- Market-leading Coremark-per-milliwatt score of 117
- Dynamic power consumption as low as 10µA/MHz
- Stop current of 1.6µA
- Up to 1MB Flash memory and 256kB SRAM
- Enhanced security with in-factory secret key provisioning
- Pricing starts at $1.93 for 10,000-piece orders
STMicroelectronics (NYSE: STM) has announced enhanced capabilities for its ST87M01 NB-IoT and geolocation module, which is now certified for Deutsche Telekom networks. The module adds new Wi-Fi positioning functionality for improved indoor and urban area geolocation where GNSS signals may be compromised.
Key features include:
- NB-IoT release 15 certification
- GSMA-compliant embedded SIM with secure element
- GNSS receiver
- Remote SIM Provisioning (RSP) capability compliant with GSMA SGP.32 standard
The certification by Deutsche Telekom expands access across Europe and confirms compliance with performance and efficiency criteria. The module will be showcased at Mobile World Congress in Barcelona and embedded world event in Nuremberg in March 2025, demonstrating IoT use cases including Remote SIM Provisioning and Wi-Fi positioning capabilities.
STMicroelectronics (STM) has reported the latest status of its common share repurchase program for the period of February 24-28, 2025. The company repurchased 125,500 ordinary shares (0.01% of issued share capital) at a weighted average price of EUR 24.0857 per share, totaling EUR 3,022,753.55.
The buyback program, approved by shareholders on May 22, 2024, and the supervisory board, aims to meet obligations from share option programmes and allocations to employees or management. Following these transactions, STM now holds 16,026,511 treasury shares, representing approximately 1.8% of its issued share capital.
STMicroelectronics (NYSE: STM), a global semiconductor leader, has announced the publication and filing of its 2024 Annual Report Form 20-F with the United States Securities and Exchange Commission (SEC). The report, which includes U.S. GAAP-based complete audited financial statements for the year ended December 31, 2024, is now accessible on the company's website and the SEC's website.
Interested parties can obtain a hard copy of the report at no cost by contacting ST's Investor Relations Department.
STMicroelectronics (NYSE: STM) has unveiled the Teseo VI family of global navigation satellite system (GNSS) receivers, marking a significant advancement in precise positioning technology. The new receivers are the first to integrate multi-constellation and quad-band signal processing on a single die, achieving centimeter-level accuracy.
The family includes the Teseo VI STA8600A and Teseo VI+ STA8610A, featuring dual independent Arm® Cortex®-M7 processing cores. These receivers are designed for automotive applications like ADAS and autonomous driving, as well as industrial uses including asset tracking, mobile robots, and smart agriculture.
Key innovations include quad-band GNSS support (L1, L2, L5, and E6), proprietary phase-change memory (PCM) technology reducing external memory needs, and comprehensive hardware cyber security features compliant with UNECE R155 and ISO 21434 specifications. Two new automotive modules, the Teseo-VIC6A (16mm x 12mm) and Teseo-ELE6A (17mm x 22mm), are also being introduced to simplify integration.