STMicroelectronics introduces automotive image sensor to help scale affordable in-cabin sensing

New VD56GA image sensor aims to cut in-cabin camera system cost while improving infrared image quality for mass-market driver monitoring.

Rhea-AI Summary

STMicroelectronics (STM) has launched its ST SafeSense VD56GA 1.1 MP automotive in-cabin infrared image sensor to support scalable driver and occupant monitoring.

The VD56GA targets OEMs and Tier 1 suppliers needing cost-effective deployment across high-volume vehicle platforms, combining a compact architecture with high infrared sensitivity and embedded image-processing. Using ST’s new backside-illuminated ST DeepNIR pixel technology, the sensor delivers 35% higher MTF sharpness and nearly 60% higher quantum efficiency versus the previous generation, enabling lower-cost optics and simplified IR illumination. Housed in a 3.7 mm x 3.2 mm CSP package with RAW and YUV outputs, it aims to reduce camera-module cost and design complexity. ST reports more than 10 million automotive SafeSense image sensors shipped to date. Samples of VD56GA are available now.

Positive

• VD56GA image performance offers 35% higher MTF sharpness and nearly 60% higher infrared quantum efficiency than the previous generation sensor.
• Compact package 3.7 mm x 3.2 mm CSP supports space-constrained in-cabin camera designs.
• Embedded processing features such as auto exposure and dark calibration can remove the need for external image-processing resources.
• SafeSense shipments exceed 10 million automotive image sensors, indicating broad adoption across key automotive regions.

Negative

• None.

News Explained

VD56GA is available for sampling now, with ST’s Crolles front-end production and Asian packaging route disclosed.

STMicroelectronics has introduced the VD56GA and made samples available now, creating a new product option that OEMs and Tier 1 suppliers can evaluate for in-cabin camera programs.

The release identifies a manufacturing route with front-end production in Crolles, France, and packaging in Asia; ST says its vertically integrated model supports supply-chain resilience and continuity for automotive customers.

The release also cites a Yole Group forecast that driver- and occupant-monitoring volumes will exceed 70 million units by 2031, describing market scale rather than a disclosed ST order or volume commitment.

Key Figures

Image sharpness improvement: 35% higher Infrared sensitivity improvement: Nearly 60% higher Sensor resolution: 1.1 MP +2 more

Image sharpness improvement

35% higher

Compared with the previous generation

Infrared sensitivity improvement

Nearly 60% higher

Compared with the previous generation

Sensor resolution

1.1 MP

VD56GA automotive image sensor

Projected market volume

Exceed 70 million units by 2031

Driver and occupant monitoring market

Package dimensions

3.7 mm x 3.2 mm

Compact CSP package

Key Terms

modulation transfer function, quantum efficiency, backside-illuminated pixel architecture, yuv output formats

4 terms

modulation transfer function technical

"35% higher modulation transfer function (MTF) sharpness"

A modulation transfer function (MTF) is a quantitative measure of how well an imaging system—such as a camera, microscope, or medical scanner—reproduces contrast at different levels of detail or spatial frequency. It matters to investors because MTF summarizes image quality in a single curve; higher MTF at relevant detail scales means better performance, affects product competitiveness, regulatory acceptance for medical devices, and can influence sales and margins.

quantum efficiency technical

"nearly 60% higher quantum efficiency than the previous generation"

Quantum efficiency is the percentage of incoming light particles (photons) that a light-sensitive device turns into usable electrical charges or signals. Think of it like the share of store visitors who make a purchase: a higher percentage means the device captures more of the available light and produces more output for the same input. For investors, higher quantum efficiency usually signals better product performance, greater energy or detection yield, and potential competitive and financial advantages for companies that make solar panels, cameras, or sensors.

backside-illuminated pixel architecture technical

"new backside-illuminated pixel architecture"

A backside-illuminated pixel architecture is a design for digital image sensors where the light-collecting photodiodes sit closer to the incoming light by moving metal wiring to the opposite side of the sensor. This reduces light loss and electronic noise, improving low-light sensitivity and image quality — like shifting furniture out of the way so a window lets in more light — and matters to investors because it can make cameras and sensors more competitive and valuable in devices and industrial uses.

yuv output formats technical

"Support for both RAW and YUV output formats"

YUV output formats are the technical ways video devices and software encode and send images by separating brightness (luma, Y) from color information (chroma, U and V). Different YUV formats vary in color sampling, bit depth and data layout, which affects picture quality, file size, processing load and compatibility with displays and streaming systems. For investors, YUV choices influence product performance, bandwidth and interoperability in video hardware, software and content-delivery businesses.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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STMicroelectronics introduces automotive image sensor
to help scale affordable in-cabin sensing

• Helps OEMs and Tier 1s bring driver and occupant monitoring to high-volume vehicle platforms with lower system cost
• Delivers 35% higher image sharpness and nearly 60% higher infrared sensitivity than the previous generation in a compact 1.1 MP automotive image sensor

Geneva, Switzerland, September 14, 2026 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces ST SafeSense VD56GA, a new 1.1 MP automotive image sensor for infrared in-cabin sensing that helps OEMs and Tier 1 suppliers scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost.

As driver and occupant monitoring moves into more vehicle platforms, automotive manufacturers and suppliers are looking for imaging solutions that support strong in-cabin performance without adding unnecessary system cost or design complexity. VD56GA meets that need with a compact sensor architecture, high infrared sensitivity, and embedded image-processing features that can help simplify camera design and integration. The sensor is designed to give camera developers the image quality needed for driver and occupant monitoring while preserving the size and cost advantages of a compact format. In many in-cabin use cases, this can help customers meet performance targets without moving to a larger, more expensive sensor.

“In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.”

“As driver and occupant monitoring systems move into a broader range of vehicle platforms, OEMs are increasingly focused on solutions that can be deployed at scale, with volumes set to exceed 70 million units by 2031. Success in this market depends not only on imaging performance, but also on reducing system cost, simplifying integration, and enabling adoption across high-volume vehicle programs," (*) underlined Anas Chalak, Market & Technology Analyst, Imaging at Yole Group.

Helping carmakers scale driver and occupant monitoring

VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing. For OEMs and Tier 1s, that can translate into a more cost-effective path to deploying driver and occupant monitoring across a broader range of vehicle programs.

The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging. With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under display camera.

By extracting more performance from a compact 1.1 MP architecture, VD56GA helps automotive designers achieve the image quality required for advanced sensing functions, while benefiting from the integration and cost advantages of a compact sensor architecture.

Compact integration with embedded image processing

Designed for modern automotive camera modules, VD56GA is housed in a compact 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs.

The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing. These features remove the need for external image-processing resources, simplify camera design and speed development.

Support for both RAW and YUV output formats give OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments, making it easier to adapt the device to a broad range of implementation strategies.

Building on ST’s automotive imaging leadership

VD56GA builds on ST’s established presence in automotive imaging and in-cabin sensing. Earlier this year, ST announced shipment of its 10 millionth automotive of SafeSense by ST image sensors, reflecting broad adoption across key automotive regions, including Europe, Asia, and the United States.

Customers benefit from ST’s vertically integrated manufacturing model and secure supply chain, with front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France and packaging in Asia; reinforcing the company’s focus on industrial resilience, product quality, and supply continuity for automotive customers worldwide.

Availability

Samples are available now. Pricing information and sample requests are available from local ST sales offices.

Learn more: https://www.st.com/en/imaging-and-photonics-solutions/vd56ga.html  

*Source: Status of CMOS Image sensors industry 2026 report, Yole Group

About STMicroelectronics

At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.

For further information, please contact:

INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41 22 929 59 20
jerome.ramel@st.com

MEDIA RELATIONS
Alexis Breton
Group VP Corporate External Communications
Tel: +33 6 59 16 79 08
alexis.breton@st.com

Attachments

• P4788D -- Sep 14 2026 -- ST SafeSense VD56GA automotive image sensor_FINAL FOR PUBLICATION
• ST SafeSense VD56GA automotive image sensor

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

How does VD56GA help reduce overall in-cabin camera module cost?

VD56GA’s infrared imaging performance allows the use of lower-cost optics, simplified infrared illumination, and less demanding optical filtering. Its embedded image-processing features, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing, remove the need for external image-processing resources. Together, these attributes are presented by the company as a way to lower complete camera-module cost for OEMs and Tier 1 suppliers.

What output formats and integration options does the VD56GA sensor support?

The VD56GA supports both RAW and YUV output formats, giving OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments. The device is housed in a 3.7 mm x 3.2 mm CSP package, targeting modern automotive camera modules and space-constrained in-cabin locations.

Where is the VD56GA manufactured and packaged?

Front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France, while packaging is performed in Asia. The company presents this vertically integrated manufacturing and secure supply chain as support for industrial resilience, product quality, and supply continuity for automotive customers.

How can customers obtain VD56GA samples and pricing information?

Samples of the VD56GA sensor are available now. Pricing details and sample requests are handled through local STMicroelectronics sales offices, and additional product information is available on the VD56GA page in the imaging and photonics solutions section of ST’s website.