STMicroelectronics releases innovative satellite navigation receiver to democratize precise positioning for automotive and industrial applications

Rhea-AI Summary

STMicroelectronics (NYSE: STM) has unveiled the Teseo VI family of global navigation satellite system (GNSS) receivers, marking a significant advancement in precise positioning technology. The new receivers are the first to integrate multi-constellation and quad-band signal processing on a single die, achieving centimeter-level accuracy.

The family includes the Teseo VI STA8600A and Teseo VI+ STA8610A, featuring dual independent Arm® Cortex®-M7 processing cores. These receivers are designed for automotive applications like ADAS and autonomous driving, as well as industrial uses including asset tracking, mobile robots, and smart agriculture.

Key innovations include quad-band GNSS support (L1, L2, L5, and E6), proprietary phase-change memory (PCM) technology reducing external memory needs, and comprehensive hardware cyber security features compliant with UNECE R155 and ISO 21434 specifications. Two new automotive modules, the Teseo-VIC6A (16mm x 12mm) and Teseo-ELE6A (17mm x 22mm), are also being introduced to simplify integration.

Positive

• First-to-market integration of multi-constellation and quad-band processing on single die
• Reduced bill-of-materials costs through proprietary PCM technology
• Enhanced positioning accuracy to centimeter-level
• Dual-core architecture enabling high performance and ASIL-level safety
• Comprehensive cybersecurity features meeting latest industry standards

Negative

• Product still in sampling phase, not yet in full production

Insights

Technology Analyst

STMicroelectronics' new Teseo VI GNSS receivers represent a significant technological breakthrough in the precise positioning market with potential to accelerate adoption across multiple high-growth sectors. By integrating quad-band, multi-constellation capabilities on a single die – an industry first – ST has effectively addressed three critical market barriers: cost, complexity, and form factor limitations.

The automotive implications are substantial. With centimeter-level accuracy in a cost-effective package, these receivers could accelerate ADAS and autonomous driving development beyond current geofenced areas. The Teseo APP2 variant's ISO 26262 ASIL-B compliance addresses critical safety requirements that have slowed autonomous vehicle deployment. This positions ST to capture greater share in the ADAS semiconductor market expected to grow at 17% CAGR through 2030.

For industrial applications, this democratization of precise positioning enables entirely new use cases in robotics, agriculture, and asset tracking where current solutions are either too expensive or power-hungry. The integration of ST's proprietary phase-change memory eliminates external memory components, reducing both BOM costs and physical footprint – critical advantages for space-constrained applications like delivery drones and mobile robots.

The dual Arm Cortex-M7 architecture provides computational headroom for advanced positioning algorithms while maintaining power efficiency. This, combined with the built-in hardware security module addressing UNECE R155 requirements, offers a compelling complete solution rather than just a component.

This launch strengthens ST's position in high-growth markets beyond its traditional automotive stronghold, potentially opening new revenue streams as industrial automation continues accelerating. The technology's ability to function reliably in challenging environments like urban canyons addresses a persistent limitation in current GNSS solutions, potentially expanding the addressable market significantly.

Semiconductor Industry Expert

STMicroelectronics' Teseo VI family represents a strategic technological leap in the $5 billion GNSS market that could significantly strengthen ST's competitive position against rivals like u-blox, Broadcom, and Qualcomm. By integrating quad-band capability on a single die, ST has created a compelling cost advantage in high-precision positioning – historically a premium segment with 30-40% higher margins than standard GNSS.

The timing is particularly advantageous as automotive OEMs accelerate ADAS deployment schedules. Most Level 2+ and Level 3 autonomous systems require centimeter-accurate positioning that traditionally demanded expensive multi-chip solutions. ST's single-die approach could reduce implementation costs by an estimated 25-30% while decreasing power consumption by 40% – critical for electric vehicle designs where power budgets are tightly constrained.

The industrial positioning market presents an even more significant growth vector. Current high-precision GNSS solutions cost $100-300 per unit, limiting adoption in price-sensitive applications. ST's integrated approach could bring costs below the critical $50 threshold where mass deployment becomes economically viable for applications like agricultural robots, construction equipment automation, and logistics tracking.

From a manufacturing perspective, the proprietary phase-change memory integration is particularly valuable amid ongoing supply chain constraints. By eliminating external memory dependencies, ST reduces exposure to memory pricing volatility while creating a technical moat competitors can't easily replicate.

This launch accelerates ST's strategic pivot toward higher-margin automotive and industrial segments, which now represent over 60% of revenue. The Teseo VI family complements ST's existing strengths in microcontrollers, power management, and sensors, enabling complete system sales rather than individual components – a key margin expansion driver.

While initial volumes will likely be modest, the technology positions ST to capture growing share in two critical high-growth markets: the $25 billion automotive semiconductor segment and the rapidly expanding industrial IoT market, potentially adding 1-2% to ST's compound annual growth rate over the next three years.

STMicroelectronics releases innovative satellite navigation receiver to democratize precise positioning for automotive and industrial applications

• ST first to put quad-band, multi-constellation design, needed for precise GNSS positioning accurate to a few centimeters, on a single die
• Innovative design ensures cost-effective precise positioning for road users and for new industrial applications, to increase the areas where autonomous vehicles can operate

Geneva, Switzerland, February 26, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of advanced driving systems (ADAS), smart in-vehicle systems, and safety-critical applications such as autonomous driving. They have also been designed to improve positioning capabilities in multiple industrial applications including asset trackers, mobile robots for home deliveries, managing machinery and crop monitoring in smart agriculture, timing systems such as base stations, and many more.

“Our new Teseo VI receivers represent a real breakthrough among positioning engines for several reasons: they are the first to integrate multi-constellation and quad-band signal processing in a single die; they are the first to embed a dual-Arm®-core architecture enabling both very high performance and ASIL-level safety for assisted and autonomous driving applications. Last but not least, they embed ST’s proprietary embedded Non-Volatile-Memory (PCM), thus delivering a very integrated, cost-effective, and reliable platform for new precise-positioning solutions,” said Luca Celant, Digital Audio and Signal Solutions General Manager, STMicroelectronics. “ST’s new satellite-navigation receivers will support exciting, advanced capabilities in automotive ADAS applications and enable many new use cases being implemented by industrial companies.”

Teseo VI is the first in the market to integrate all the necessary system elements for centimeter accuracy into one die, supporting simultaneous multi-constellation and quad-band operations. This innovation simplifies the development of end-user navigation and positioning products, enhances reliability even in challenging conditions like urban canyons, and reduces bill-of-materials costs. Additionally, the single chip accelerates time to market and allows for compact and lightweight form factors.

The new Teseo VI family of precise positioning receiver chips leverages decades of experience and integrates multiple ST proprietary technologies, including precise positioning and advanced embedded memory.

Technical Notes for Editors

ST’s new GNSS device family includes the Teseo VI STA8600A and Teseo VI+, STA8610A, each with dual independent Arm® Cortex®-M7 processing cores for local control of all the IC’s (integrated circuit) functions. The Cortex-M7 brings powerful 32-bit processing and helps enable concurrent multi-constellation and multi-band operation on a single die.

Teseo VI+ can also host various enhanced positioning engines, developed independently by third ST Authorized Partner companies, to provide complete real-time kinematics for centimeter position accuracy.

Completing the family, the Teseo APP2 STA9200MA operates dual cores in lockstep, providing hardware redundancy for applications such as road vehicle guidance meeting ISO 26262 ASIL-B functional safety. Pin-compatibility between Teseo APP2 and other Teseo VI ICs simplifies PCB design for companies producing ASIL-certified and non-ASIL applications.

All variants feature ST’s innovative RF architecture and GNSS baseband design provides quad-band GNSS support (L1, L2, L5 and E6) with the unique ability to acquire and track only L5. This is highly effective in reducing outliers and increasing robustness in difficult conditions such as urban canyons and in the presence of jammers.

In addition, the proprietary phase-change memory (PCM) technology removes external memory needs, thereby minimizing the system bill of materials (BOM) and simplifying the manufacturing supply chain. Proprietary PCM is robust to withstand challenging environments such as automotive, non-volatile like Flash, and has a small cell architecture suited to space-efficient on-chip integration.

The ICs all contain a full set of hardware cyber security features including secure boot, over-the-air firmware update, and output-data protection. In addition, ST’s hardware security module (HSM) provides robust protection against online hacking. The devices comply with the latest UNECE R155 and ISO 21434 specifications that mandate cybersecurity by design.

The Teseo VI product family is supported by an established ecosystem of suppliers and partners for algorithms, reference designs, and compatible complementary hardware.

The Teseo VI product family includes also two new GNSS automotive modules: the Teseo-VIC6A in a 16mm x 12mm form factor (embedding Teseo VI), and the Teseo-ELE6A in a 17mm x 22mm form factor (embedding Teseo VI+). These new modules simplify the integration of Teseo VI/VI+ ICs on the customer platform and ensure optimum performance. 

The Teseo VI samples are available on request.

For more information, please go to www.st.com/teseo6

You can also read our blogpost at https://blog.st.com/teseovi/

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.

INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
jerome.ramel@st.com

MEDIA RELATIONS
Alexis Breton
Corporate External Communications
Tel: +33.6.59.16.79.08
alexis.breton@st.com

Attachments

• P4676A -- Feb 26 2025 -- Teseo VI satnav receiver_FINAL FOR PUBLICATION
• P4676A -- Feb 26 2025 -- Teseo VI satnav receiver_IMAGE

FAQ

What is the key innovation in STM's new Teseo VI GNSS receivers?

Teseo VI is the first to integrate multi-constellation and quad-band signal processing on a single die, enabling centimeter-level positioning accuracy while reducing costs and simplifying development.

Which automotive applications will STM's Teseo VI receivers support?

The receivers will support ADAS, smart in-vehicle systems, and autonomous driving applications, with ASIL-B functional safety certification for the Teseo APP2 variant.

What are the key features of STM's Teseo VI cybersecurity system?

It includes secure boot, over-the-air firmware updates, output-data protection, and a hardware security module (HSM), complying with UNECE R155 and ISO 21434 specifications.

What industrial applications will STM's new GNSS receivers target?

The receivers target asset tracking, mobile delivery robots, smart agriculture machinery, crop monitoring, and timing systems like base stations.

What are the new Teseo VI automotive modules announced by STM?

STM announced the Teseo-VIC6A (16mm x 12mm) and Teseo-ELE6A (17mm x 22mm) modules for simplified integration of Teseo VI/VI+ ICs.